公开(公告)号：US20040263393A1

公开(公告)日：2004-12-30

申请号：US10862043

申请日：2004-06-03

Applicant: HRL LABORATORIES, LLC

Inventor： Jonathan J. Lynch ,  Peter D. Brewer ,  Andrew T. Hunter

IPC: H01Q001/38

CPC classification number: H01Q9/0457 ,  H01L24/20 ,  H01L2224/24137 ,  H01L2224/48091 ,  H01L2224/73267 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/14 ,  H01Q21/0093 ,  H01Q21/065 ,  H01Q23/00 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated communication device having a substrate layer of substantially electrically nonconductive material with two substantially parallel surfaces, an antenna element disposed on one of the surfaces, a ground layer of substantially electrically conductive material disposed on the other surface and having an opening formed therethrough opposite from the antenna element, and a transceiver device mounted to the ground layer to transmit and/or receive electromagnetic energy through the opening.

Abstract translation: 一种集成通信装置，具有基本上不导电材料的基底层，具有两个基本平行的表面，设置在其中一个表面上的天线元件，设置在另一个表面上的基本上导电材料的接地层， 天线元件和安装到接地层的收发器装置，以通过开口传输和/或接收电磁能。

公开(公告)号：US20030068519A1

公开(公告)日：2003-04-10

申请号：US10218052

申请日：2002-08-12

Applicant: HRL LABORATORIES, LLC

Inventor： Peter D. Brewer ,  Andrew T. Hunter ,  Luisa M. Deckard

IPC: H01L029/12

CPC classification number: H01L24/95 ,  B82Y10/00 ,  B82Y30/00 ,  H01L23/13 ,  H01L24/26 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/95085 ,  H01L2224/95145 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01072 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10158 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T428/12528 ,  H01L2924/00

Abstract: A method for assembly including the steps of: (a) providing a plurality of microstructure components with each of the components having a bottom with the same three dimensional shape; (b) forming a mold with at least one protuberance from a surface thereof so that the at least one protuberance has the same shape; (c) molding a moldable substrate with the mold to form a molded substrate having a surface with at least one recess having the same shape; and (d) positioning a first of the plurality of microstructure components into said at least one recess. Each of the microstructure components may be formed by a masking and etching process, with the mold being formed by the same masking and etching process. The positioning step may consist of mixing the microstructure components with a fluid to form a slurry; and depositing the slurry on the surface of the molded substrate to cause the first of the plurality of microstructure components to self-align in the recess.

Abstract translation: 一种用于组装的方法，包括以下步骤：（a）提供多个微结构部件，每个部件具有具有相同三维形状的底部; （b）从其表面形成具有至少一个突起的模具，使得所述至少一个突起具有相同的形状; （c）用所述模具模制可模制基材以形成具有表面的模制基材，所述表面具有至少一个具有相同形状的凹部; 和（d）将所述多个微结构组件中的第一组件定位到所述至少一个凹部中。 每个微结构组件可以通过掩模和蚀刻工艺形成，其中模具通过相同的掩模和蚀刻工艺形成。 定位步骤可以包括将微结构组件与流体混合以形成浆料; 以及将所述浆料沉积在所述模制基底的表面上，以使所述多个微结构组件中的所述第一微结构组件在所述凹部中自对准。

公开(公告)号：US20030062123A1

公开(公告)日：2003-04-03

申请号：US10218053

申请日：2002-08-12

Applicant: HRL LABORATORIES, LLC

Inventor： Andrew T. Hunter ,  Peter D. Brewer

IPC: C09J005/04 ,  B32B007/00

CPC classification number: H01L25/50 ,  H01L24/95 ,  H01L2224/95085 ,  H01L2924/01322 ,  H01L2924/00

Abstract: A method for assembling components on a substrate including the steps of: (a) selectively coating at least a first receptor site of the substrate with a liquid precursor that forms a solid adhesive upon contact with an initiator; (b) providing each of the components with an adhesion surface that has the initiator; and (c) depositing the components on the substrate in a manner that causes a first of the components to contact the at least first receptor site whereupon contact between the initiator and the liquid precursor causes formation of the adhesive which affixes the first compound to the first receptor site. In a preferred embodiment of the invention, the precursor is a liquid monomer and the initiator initiates a polymerization reaction upon contact with the monomer to form a solid polymer.

Abstract translation: 一种用于在基板上组装部件的方法，包括以下步骤：（a）用与引发剂接触时形成固体粘合剂的液体前体选择性地涂覆基材的至少第一受体部位; （b）为每个组分提供具有引发剂的粘合表面; 和（c）以使得第一组分接触所述至少第一受体部位的方式将组分沉积在基底上，由此引发剂和液体前体之间的接触引起粘合剂的形成，所述粘合剂将第一化合物固定到第一 受体位点。 在本发明的优选实施方案中，前体是液体单体，并且引发剂在与单体接触时引发聚合反应以形成固体聚合物。