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    Process for smoothing a rough surface on a substrate by dry etching
    3.
    发明申请
    Process for smoothing a rough surface on a substrate by dry etching 失效
    通过干法蚀刻来平滑基板上粗糙表面的工艺

    公开(公告)号：US20030062335A1

    公开(公告)日：2003-04-03

    申请号：US10218055

    申请日：2002-08-12

    Applicant: HRL LABORATORIES, LLC

    Inventor： Peter D. Brewer

    IPC: B44C001/22 ,  C03C015/00

    CPC classification number: C03C19/00 ,  B24B7/241 ,  B24B37/042 ,  C03C15/00 ,  H01L21/042 ,  H01L21/30604 ,  H01L21/30625

    Abstract: A process for smoothing a rough surface on a substrate, such as a diamond or silicon carbide substrate, said rough surface including protruding peak portions separated by valleys, said smoothing comprising (a) depositing a coating on said rough surface so as to adhere to and to fill at least the valleys of said rough surface, (b) mechanically polishing the thus coated rough surface so as to achieve a smooth coated surface, and (c) dry etching the smooth coated surface, such as by PACE, so as to remove the remaining coating and at least protruding peak portions of the substrate so as to achieve a smooth surface on the substrate, wherein in the mechanical polishing step (b) the coating is removed at a rate of reduction of thickness greater than the rate at which the substrate is subject to reduction of thickness by the mechanical polishing, and in the dry etching step (c) the coating and substrate are removed at substantially the same or a similar rate of reduction of thickness, and, if necessary, steps (a), (b) and (c) are repeated, or the coating and substrate are removed in separate, alternate preferential etching steps.

    Abstract translation: 一种用于平滑诸如金刚石或碳化硅衬底的衬底上的粗糙表面的工艺，所述粗糙表面包括由谷分开的突出的峰部分，所述平滑化包括（a）在所述粗糙表面上沉积涂层以粘附到 以至少填充所述粗糙表面的谷部，（b）机械抛光由此涂覆的粗糙表面，以便实现光滑的涂覆表面，和（c）例如通过PACE干燥蚀刻光滑涂覆表面，以便去除 剩余的涂层和至少突出的基板的峰部分，以便在基板上实现光滑的表面，其中在机械抛光步骤（b）中，以大于其的 基板通过机械抛光进行厚度减小，在干法蚀刻步骤（c）中，以基本上相同或相似的厚度减小速率除去涂层和基板，如果 必要时，重复步骤（a），（b）和（c），或者在单独的交替优先蚀刻步骤中除去涂层和基底。

    Method of self-latching for adhesion during self-assembly of electronic or optical components
    4.
    发明申请
    Method of self-latching for adhesion during self-assembly of electronic or optical components 失效
    电子或光学部件自组装过程中自锁的方法

    公开(公告)号：US20030062123A1

    公开(公告)日：2003-04-03

    申请号：US10218053

    申请日：2002-08-12

    Applicant: HRL LABORATORIES, LLC

    Inventor： Andrew T. Hunter ,  Peter D. Brewer

    IPC: C09J005/04 ,  B32B007/00

    CPC classification number: H01L25/50 ,  H01L24/95 ,  H01L2224/95085 ,  H01L2924/01322 ,  H01L2924/00

    Abstract: A method for assembling components on a substrate including the steps of: (a) selectively coating at least a first receptor site of the substrate with a liquid precursor that forms a solid adhesive upon contact with an initiator; (b) providing each of the components with an adhesion surface that has the initiator; and (c) depositing the components on the substrate in a manner that causes a first of the components to contact the at least first receptor site whereupon contact between the initiator and the liquid precursor causes formation of the adhesive which affixes the first compound to the first receptor site. In a preferred embodiment of the invention, the precursor is a liquid monomer and the initiator initiates a polymerization reaction upon contact with the monomer to form a solid polymer.

    Abstract translation: 一种用于在基板上组装部件的方法，包括以下步骤：（a）用与引发剂接触时形成固体粘合剂的液体前体选择性地涂覆基材的至少第一受体部位; （b）为每个组分提供具有引发剂的粘合表面; 和（c）以使得第一组分接触所述至少第一受体部位的方式将组分沉积在基底上，由此引发剂和液体前体之间的接触引起粘合剂的形成，所述粘合剂将第一化合物固定到第一 受体位点。 在本发明的优选实施方案中，前体是液体单体，并且引发剂在与单体接触时引发聚合反应以形成固体聚合物。

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