公开(公告)号：US11540399B1

公开(公告)日：2022-12-27

申请号：US17167955

申请日：2021-02-04

Applicant: HRL LABORATORIES, LLC

Inventor： Peter Brewer ,  Aurelio Lopez ,  Pamela R. Patterson

IPC: B23K1/00 ,  H05K3/34 ,  B23K3/00 ,  B23K101/42

Abstract: A method of bonding a double-ended cable to a multi-tier substrate (such as a multi-tier printed circuit board) includes picking up the double-ended cable, and imaging alignment markers on a first head of the double-ended cable, a second substrate of the multi-tier substrate, a second head of the double-ended cable, and a first substrate of the multi-tier substrate. The method also includes aligning the alignment marker on the first head of the cable to the alignment marker on the second substrate of the multi-tier substrate, coupling the first head of the cable to the second substrate, and releasing the first head of the cable. The method further includes aligning the alignment marker on the second head of the cable to the alignment marker on the first substrate of the multi-tier substrate, coupling the second head of the cable to the first substrate, and releasing the second head of the cable.

公开(公告)号：US12057429B1

公开(公告)日：2024-08-06

申请号：US17356387

申请日：2021-06-23

Applicant: HRL Laboratories, LLC

Inventor： Aurelio Lopez ,  Peter Brewer ,  Partia Naghibi Mahmoudabadi ,  Erik Daniel ,  Tahir Hussain

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/13013 ,  H01L2224/13016 ,  H01L2224/13144 ,  H01L2224/13466 ,  H01L2224/14051 ,  H01L2224/16057 ,  H01L2224/80201 ,  H01L2224/80986 ,  H01L2224/81053 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81379

Abstract: A method for bonding two confronting electronic devices together wherein the two electronic devices are initially temporarily coupled together using a room temperature process with a plurality of knife-edge microstructures on at least a first one of the electronic devices engaging portions of the a second one of the electronic devices. The room temperature process involves applying a relatively low compressive force or pressure between the two electronic devices compared to the forces or pressures used in convention flip-chip bonding. The first one of the electronic devices and the second one of the electronic devices also have traditional contact pads that are spaced from each other by a standoff distance when the devices are initially coupled together using the room temperature process. This allows for inspection of the two electronic devices while they are initially temporarily coupled together. In need be, the two can be separated at this stage for re-work After passing inspection, a relatively higher compressive force or pressure is applied between the two electronic devices to cause the standoff distance to decrease to zero and for the contact pads confronting each other on the confronting two electronic devices to weld thereby permanently bonding the two electronic devices together.

公开(公告)号：US11562984B1

公开(公告)日：2023-01-24

申请号：US17070826

申请日：2020-10-14

Applicant: HRL Laboratories, LLC

Inventor： Peter Brewer ,  Aurelio Lopez ,  Partia Naghibi-Mahmoudabadi ,  Tahir Hussain

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

Abstract: A method and apparatus for laterally urging two semiconductor chips, dies or wafers into an improved state of registration with each other, the method and apparatus employing microstructures comprising: a first microstructure disposed on a first major surface of a first one of said two semiconductor chips, dies or wafers, wherein the first microstructure includes a sidewall which is tapered thereby disposing it at an acute angle compared to a perpendicular of said first major surface, and a second microstructure disposed on a first surface of a second one of said two semiconductor chips, dies or wafers, wherein the shape of the second microstructure is complementary to, and mates with or contacts, in use, the first microstructure, the second microstructure including a surface which contacts said sidewall when the first and second microstructures are mated or being mated, the sidewall of the first microstructure and the surface of the second microstructure imparting a lateral force for urging the two semiconductor chips, dies or wafers into said improved state of registration.

公开(公告)号：US11555830B2

公开(公告)日：2023-01-17

申请号：US17006491

申请日：2020-08-28

Applicant: HRL Laboratories, LLC

Inventor： Erik S. Daniel ,  Aurelio Lopez ,  Peter Brewer

IPC: G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L23/00

Abstract: A temporary bond method and apparatus for allowing wafers, chips or chiplets. To be tested, the temporary bond method and apparatus comprising: a temporary connection apparatus having one of more knife-edged microstructures, wherein the temporary connection apparatus serves, in use, as a probe device for probing the chiplets, each chiplet including a die having one or more flat contact pads which mate with the one of more knife-edged microstructures of the temporary connection apparatus; a press apparatus for applying pressure between the one or more flat contact pads on the chiplet with the one of more knife-edged microstructures of the temporary connection apparatus thereby forming a temporary bond between the temporary connection pad with the knife-edged microstructure in contact with the one or more flat wafer pads; the press being able to apply a pressure to maintain the temporary bond connection during or prior to testing of the chiplet.

公开(公告)号：US20210063439A1

公开(公告)日：2021-03-04

申请号：US17006491

申请日：2020-08-28

Applicant: HRL Laboratories, LLC

Inventor： Erik S. DANIEL ,  Aurelio Lopez ,  Peter Brewer

IPC: G01R1/067 ,  H01L23/00 ,  G01R1/073 ,  G01R31/28

Abstract: A temporary bond method and apparatus for allowing wafers, chips or chiplets. To be tested, the temporary bond method and apparatus comprising: a temporary connection apparatus having one of more knife-edged microstructures, wherein the temporary connection apparatus serves, in use, as a probe device for probing the chiplets, each chiplet including a die having one or more flat contact pads which mate with the one of more knife-edged microstructures of the temporary connection apparatus; a press apparatus for applying pressure between the one or more flat contact pads on the chiplet with the one of more knife-edged microstructures of the temporary connection apparatus thereby forming a temporary bond between the temporary connection pad with the knife-edged microstructure in contact with the one or more flat wafer pads; the press being able to apply a pressure to maintain the temporary bond connection during or prior to testing of the chiplet.