Narrow fins by oxidation in double-gate finfet
    1.
    发明授权
    Narrow fins by oxidation in double-gate finfet 有权
    狭窄的翅片通过氧化在双门finfet

    公开(公告)号:US06812119B1

    公开(公告)日:2004-11-02

    申请号:US10614052

    申请日:2003-07-08

    IPC分类号: H01L213205

    摘要: A method of forming fins for a double-gate fin field effect transistor (FinFET) includes forming a second layer of semi-conducting material over a first layer of semi-conducting material and forming double caps in the second layer of semi-conducting material. The method further includes forming spacers adjacent sides of each of the double caps and forming double fins in the first layer of semi-conducting material beneath the double caps. The method also includes thinning the double fins to produce narrow double fins.

    摘要翻译: 一种形成双栅极鳍效应晶体管(FinFET)的鳍片的方法包括在第一半导体材料层上形成第二半导电材料层,并在第二半导体材料层中形成双重盖子。 该方法还包括在每个双盖的侧面上形成间隔物,并在双重帽下面的第一半导体材料层中形成双翅片。 该方法还包括使双翅片变薄以产生窄的双翅片。

    Systems and methods for forming multiple fin structures using metal-induced-crystallization
    3.
    发明授权
    Systems and methods for forming multiple fin structures using metal-induced-crystallization 有权
    使用金属诱导结晶形成多个翅片结构的系统和方法

    公开(公告)号:US07498225B1

    公开(公告)日:2009-03-03

    申请号:US11428722

    申请日:2006-07-05

    摘要: A method for forming fin structures for a semiconductor device that includes a substrate and a dielectric layer formed on the substrate is provided. The method includes etching the dielectric layer to form a first structure, depositing an amorphous silicon layer over the first structure, and etching the amorphous silicon layer to form second and third fin structures adjacent first and second side surfaces of the first structure. The second and third fin structures may include amorphous silicon material. The method further includes depositing a metal layer on upper surfaces of the second and third fin structures, performing a metal-induced crystallization operation to convert the amorphous silicon material of the second and third fin structures to a crystalline silicon material, and removing the first structure.

    摘要翻译: 提供了一种用于形成半导体器件的鳍结构的方法,该半导体器件包括衬底和形成在衬底上的电介质层。 该方法包括蚀刻介电层以形成第一结构,在第一结构上沉积非晶硅层,以及蚀刻非晶硅层以形成与第一结构的第一和第二侧表面相邻的第二和第三鳍结构。 第二和第三鳍结构可以包括非晶硅材料。 该方法还包括在第二和第三鳍结构的上表面上沉积金属层,执行金属诱导结晶操作以将第二鳍和第三鳍结构的非晶硅材料转化成晶体硅材料,并且去除第一结构 。

    Reversed T-shaped finfet
    4.
    发明授权
    Reversed T-shaped finfet 失效
    反转T形finfet

    公开(公告)号:US07541267B1

    公开(公告)日:2009-06-02

    申请号:US11765611

    申请日:2007-06-20

    IPC分类号: H01L21/28

    摘要: A method includes forming a first rectangular mesa from a layer of semiconducting material and forming a first dielectric layer around the first mesa. The method further includes forming a first rectangular mask over a first portion of the first mesa leaving an exposed second portion of the first mesa and etching the exposed second portion of the first mesa to produce a reversed T-shaped fin from the first mesa.

    摘要翻译: 一种方法包括从半导体材料层形成第一矩形台面并在第一台面周围形成第一介电层。 该方法还包括在第一台面的第一部分上形成第一矩形掩模,离开第一台面的暴露的第二部分并蚀刻第一台面的暴露的第二部分以从第一台面产生反向的T形翅片。

    Damascene finfet gate with selective metal interdiffusion
    5.
    发明授权
    Damascene finfet gate with selective metal interdiffusion 有权
    大马士革finfet门与选择性金属相互扩散

    公开(公告)号:US06855989B1

    公开(公告)日:2005-02-15

    申请号:US10674520

    申请日:2003-10-01

    摘要: A fin field effect transistor includes a fin, a source region, a drain region, a first gate electrode and a second gate electrode. The fin includes a channel. The source region is formed adjacent a first end of the fin and the drain region is formed adjacent a second end of the fin. The first gate electrode includes a first layer of metal material formed adjacent the fin. The second gate electrode includes a second layer of metal material formed adjacent the first layer. The first layer of metal material has a different work function than the second layer of metal material. The second layer of metal material selectively diffuses into the first layer of metal material via metal interdiffusion.

    摘要翻译: 翅片场效应晶体管包括鳍片,源极区域,漏极区域,第一栅极电极和第二栅极电极。 鳍包括一个通道。 源区域邻近翅片的第一端形成,并且漏极区域邻近翅片的第二端形成。 第一栅电极包括邻近翅片形成的第一金属材料层。 第二栅电极包括与第一层相邻形成的第二金属材料层。 第一层金属材料具有与第二层金属材料不同的功函数。 金属材料的第二层选择性地通过金属相互扩散扩散到金属材料的第一层中。

    Varying carrier mobility in semiconductor devices to achieve overall design goals
    7.
    发明授权
    Varying carrier mobility in semiconductor devices to achieve overall design goals 有权
    在半导体器件中改变载波的移动性,实现总体设计目标

    公开(公告)号:US07095065B2

    公开(公告)日:2006-08-22

    申请号:US10633504

    申请日:2003-08-05

    IPC分类号: H01L29/80

    摘要: A semiconductor device may include a substrate and an insulating layer formed on the substrate. A first device may be formed on the insulating layer, including a first fin. The first fin may be formed on the insulating layer and may have a first fin aspect ratio. A second device may be formed on the insulating layer, including a second fin. The second fin may be formed on the insulating layer and may have a second fin aspect ratio different from the first fin aspect ratio.

    摘要翻译: 半导体器件可以包括衬底和形成在衬底上的绝缘层。 第一器件可以形成在绝缘层上,包括第一鳍片。 第一翅片可以形成在绝缘层上,并且可以具有第一翅片长宽比。 第二装置可以形成在绝缘层上,包括第二鳍片。 第二翅片可以形成在绝缘层上,并且可以具有与第一翅片长宽比不同的第二翅片长宽比。

    Double-gate semiconductor device with gate contacts formed adjacent sidewalls of a fin
    8.
    发明授权
    Double-gate semiconductor device with gate contacts formed adjacent sidewalls of a fin 有权
    双栅半导体器件,其栅极触点形成在翅片的相邻侧壁处

    公开(公告)号:US08217450B1

    公开(公告)日:2012-07-10

    申请号:US10770011

    申请日:2004-02-03

    IPC分类号: H01L29/94

    摘要: A double-gate semiconductor device includes a substrate, an insulating layer, a fin and two gates. The insulating layer is formed on the substrate and the fin is formed on the insulating layer. A first gate is formed on the insulating layer and is adjacent a first sidewall of the fin. The second gate is formed on the insulating layer and is adjacent a second sidewall of the fin opposite the first sidewall. The first and second gates both include a conductive material and are electrically separated by the fin.

    摘要翻译: 双栅半导体器件包括衬底,绝缘层,鳍和两个栅极。 绝缘层形成在基板上,并且鳍形成在绝缘层上。 第一栅极形成在绝缘层上并与鳍片的第一侧壁相邻。 第二栅极形成在绝缘层上并且与第一侧壁相对的翅片的第二侧壁相邻。 第一和第二栅极都包括导电材料并且被散热片电隔离。

    Non-volatile memory device
    9.
    发明授权
    Non-volatile memory device 失效
    非易失性存储器件

    公开(公告)号:US06958512B1

    公开(公告)日:2005-10-25

    申请号:US10770010

    申请日:2004-02-03

    摘要: A non-volatile memory device includes a substrate, an insulating layer, a fin, a conductive structure and a control gate. The insulating layer may be formed on the substrate and the fin may be formed on the insulating layer. The conductive structure may be formed near a side of the fin and the control gate may be formed over the fin. The conductive structure may act as a floating gate electrode for the non-volatile memory device.

    摘要翻译: 非易失性存储器件包括衬底,绝缘层,鳍,导电结构和控制栅。 绝缘层可以形成在基板上,并且鳍可以形成在绝缘层上。 导电结构可以形成在鳍的一侧附近,并且控制栅可以形成在翅片上。 导电结构可以用作非易失性存储器件的浮栅电极。