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公开(公告)号：US10730107B2
公开(公告)日：2020-08-04
申请号：US16281968
申请日：2019-02-21
发明人： William Brian Atkins , Clayton Arthur Ownby , Michael Clark , Grant O. Cook, III , Garrett T. Olson
IPC分类号： B22D27/04 , B22D19/06 , B22D33/00 , F27D15/02 , B22F7/06 , B22F3/26 , C22C1/10 , C22C29/06 , B22F5/00
摘要： A mold transfer assembly includes a transfer housing providing an interior defined by one or more sidewalls and a top. The transfer housing is sized to receive and encapsulate a mold as the mold is moved between a furnace and a thermal heat sink. An arm is coupled to the transfer housing to move the transfer housing and the mold encapsulated within the transfer housing between the furnace and a thermal heat sink. The transfer housing exhibits one or more thermal properties to control a thermal profile of the mold.
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公开(公告)号：US09889502B2
公开(公告)日：2018-02-13
申请号：US14438971
申请日：2014-06-25
发明人： Clayton Arthur Ownby , Grant O. Cook, III , Jeffrey G. Thomas , Daniel Brendan Voglewede , William Brian Atkins , Ronald Eugene Joy , Michael Clark
CPC分类号： B22D27/04 , B22D27/003 , B22D27/15 , B22D30/00 , B22D45/00
摘要： An example insulation enclosure includes a support structure having at least an inner frame and providing a top end, a bottom end, and an opening defined in the bottom end for receiving a mold within an interior of the support structure, and a radiant barrier positioned within the interior of the support structure, the radiant barrier including a front surface arranged to face the mold and a back surface facing the support structure, wherein the radiant barrier interposes the mold and the support structure to redirect thermal energy radiated from the mold back towards the mold.
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公开(公告)号：US10252329B2
公开(公告)日：2019-04-09
申请号：US14787133
申请日：2015-01-28
发明人： William Brian Atkins , Clayton Arthur Ownby , Michael Clark , Grant O. Cook, III , Garrett T. Olsen
IPC分类号： B22D27/04 , B22D33/00 , F27D15/02 , B22D19/06 , B22F7/06 , B22F3/26 , C22C1/10 , C22C29/06 , B22F5/00
摘要： A mold transfer assembly includes a transfer housing providing an interior defined by one or more sidewalls and a top. The transfer housing is sized to receive and encapsulate a mold as the mold is moved between a furnace and a thermal heat sink. An arm is coupled to the transfer housing to move the transfer housing and the mold encapsulated within the transfer housing between the furnace and a thermal heat sink. The transfer housing exhibits one or more thermal properties to control a thermal profile of the mold.
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公开(公告)号：US20170136535A1
公开(公告)日：2017-05-18
申请号：US14440457
申请日：2014-06-25
发明人： Clayton A. Ownby , Jeffrey G. Thomas , Michael Clark , Ronald Joy , Grant O. Cook , Garrett T. Olsen
CPC分类号： B22D27/04 , B22D19/14 , B22D25/02 , B22F3/003 , B22F7/06 , B22F2005/001 , B22F2999/00 , C22C2001/1073 , B22F2203/11
摘要： An example insulation enclosure includes a support structure having a top end, a top wall provided at the top end, a bottom end, and an opening defined at the bottom end for receiving a mold within an interior of the support structure. Rigid insulation material may be supported by the support structure and extending between the top and bottom ends and across the top end. The rigid insulation material may extend between the top and bottom ends and consist of one or more sidewall insulation loops that extend along a circumference of the insulation enclosure.
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公开(公告)号：US20190184459A1
公开(公告)日：2019-06-20
申请号：US16281968
申请日：2019-02-21
发明人： William Brian Atkins , Clayton Arthur Ownby , Michael Clark , Grant O. Cook, III , Garrett T. Olson
CPC分类号： B22D27/045 , B22D19/06 , B22D33/005 , B22F3/26 , B22F2005/001 , B22F2007/066 , B22F2999/00 , C22C1/1068 , C22C29/06 , F27D15/02 , B22F2203/11
摘要： A mold transfer assembly includes a transfer housing providing an interior defined by one or more sidewalls and a top. The transfer housing is sized to receive and encapsulate a mold as the mold is moved between a furnace and a thermal heat sink. An arm is coupled to the transfer housing to move the transfer housing and the mold encapsulated within the transfer housing between the furnace and a thermal heat sink. The transfer housing exhibits one or more thermal properties to control a thermal profile of the mold.
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公开(公告)号：US20160339515A1
公开(公告)日：2016-11-24
申请号：US14787133
申请日：2015-01-28
发明人： William Brian Atkins , Clayton Arthur Ownby , Michael Clark , Grant O. Cook, III , Garrett T. Olsen
CPC分类号： B22D27/045 , B22D19/06 , B22D33/005 , B22F3/26 , B22F2005/001 , B22F2007/066 , B22F2999/00 , C22C1/1068 , C22C29/06 , F27D15/02 , B22F2203/11
摘要： A mold transfer assembly includes a transfer housing providing an interior defined by one or more sidewalls and a top. The transfer housing is sized to receive and encapsulate a mold as the mold is moved between a furnace and a thermal heat sink. An arm is coupled to the transfer housing to move the transfer housing and the mold encapsulated within the transfer housing between the furnace and a thermal heat sink. The transfer housing exhibits one or more thermal properties to control a thermal profile of the mold.
摘要翻译： 模具转移组件包括提供由一个或多个侧壁和顶部限定的内部的转移壳体。 转移壳体的尺寸适于在模具在炉和热散热器之间移动时接收和封装模具。 臂连接到传送壳体，以将传送壳体和封装在传送壳体内的模具移动到炉和热散热器之间。 转印壳体具有一个或多个热性质以控制模具的热分布。
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公开(公告)号：US10195662B2
公开(公告)日：2019-02-05
申请号：US14440457
申请日：2014-06-25
发明人： Clayton A. Ownby , Jeffrey G. Thomas , Michael Clark , Ronald Joy , Grant O. Cook, III , Garrett T. Olsen
摘要： An example insulation enclosure includes a support structure having a top end, a top wall provided at the top end, a bottom end, and an opening defined at the bottom end for receiving a mold within an interior of the support structure. Rigid insulation material may be supported by the support structure and extending between the top and bottom ends and across the top end. The rigid insulation material may extend between the top and bottom ends and consist of one or more sidewall insulation loops that extend along a circumference of the insulation enclosure.
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