公开(公告)号：US6119926A

公开(公告)日：2000-09-19

申请号：US247325

申请日：1999-02-10

申请人： Hans Egger ,  Marit Seidel ,  Daniel von Flue

发明人： Hans Egger ,  Marit Seidel ,  Daniel von Flue

IPC分类号： H01L21/60 ,  B23K20/00 ,  B23K31/00 ,  B23K31/02

CPC分类号： H01L24/85 ,  B23K20/004 ,  H01L24/78 ,  B23K2201/38 ,  H01L2224/05554 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78901 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/14

摘要： On the production of wire connections (wire bonding) which start from a semiconductor chip and end on a substrate (2b) the capillary (12) guiding the wire (3) should be moved to an end section (s3) of its trajectory in a specific, programmed way in order to eliminate as far as possible reactions on the geometry of the wire bridge on bonding of the wire to the substrate and to produce flawless bond connections. The end section (s3) in which the capillary (12) moves slowly begins at a predetermined height (H) and ends on the substrate at the second connection point (5). In the end section (s3) the downward movement (vv) of the capillary is superimposed by a horizontal movement (vh) which is directed away from the already existing connection of the wire (3) to the chip and which continually decreases in relationship to the downward movement (vv).

摘要翻译： 在从半导体芯片开始并且在基板（2b）上的端部的线连接（引线接合）的生产中，引导线（3）的毛细管（12）应当被移动到其轨迹的端部（s3） 具体的，编程的方式，以便尽可能地消除尽可能地在将线接合到衬底上时对线桥的几何形状的反应，并且产生无瑕疵的接合连接。 毛细管（12）缓慢移动的端部（s3）在预定高度（H）开始，并在第二连接点（5）处终止在基板上。 在末端部分（s3）中，毛细管的向下运动（vv）通过水平运动（vh）叠加，水平运动（vh）指向远离已经存在的导线（3）的连接到芯片，并且其相对于 向下运动（vv）。