Laminated electric heat generating member for reflow soldering devices
    1.
    发明授权
    Laminated electric heat generating member for reflow soldering devices 失效
    用于回流焊接装置的层压电热元件

    公开(公告)号:US4412123A

    公开(公告)日:1983-10-25

    申请号:US148505

    申请日:1980-05-09

    CPC分类号: B23K3/0471 H05B3/10

    摘要: An electrically heated soldering device adapted to simultaneously heat a plurality of spaced electrical elements in a reflow soldering operation includes an elongated metal laminate of substantially U-shaped cross section having a bight portion between two side portions which may be parallel or divergent. The laminate includes a layer of aluminum between a layer of copper and a layer of stainless steel, with the layers being roll bonded together. The copper and aluminum layers are removed at the bight portion to expose the stainless steel layer and form a heat generating zone for contacting the plurality spaced electrical elements which is corrosion resistant and nonwettable by solder. The edges of the copper and aluminum layers adjacent to the exposed stainless steel bight portion are shaped to impart a selectable temperature profile, either uniform or non-uniform along the length of the bight portion. The exposed surface of the stainless steel portion can be provided with a ceramic coating to electrically insulate bight portion from the elements to be soldered. The legs of the U-shaped laminate are adapted to be connected to an electric power source through the copper and aluminum layers thereof.

    摘要翻译: 适于在回流焊接操作中同时加热多个间隔的电气元件的电加热焊接装置包括具有大致U形横截面的细长金属层压体,其具有可以平行或发散的两个侧部之间的弯曲部分。 该层压板包括一层铜层与一层不锈钢之间的铝层,其中层层压在一起。 铜和铝层在弯曲部分被去除以暴露不锈钢层并且形成用于接触多个间隔开的电气元件的发热区域,该电气元件是耐腐蚀的并且通过焊料不可润湿。 与暴露的不锈钢弯曲部分相邻的铜和铝层的边缘被成形为沿着弯曲部分的长度赋予可选择的温度分布,均匀或不均匀。 不锈钢部分的暴露表面可以设置有陶瓷涂层,以将弯曲部分与要焊接的元件电绝缘。 U形层压体的腿部通过其铜和铝层连接到电源。

    High density connector for stacked circuit boards
    2.
    发明授权
    High density connector for stacked circuit boards 失效
    用于堆叠电路板的高密度连接器

    公开(公告)号:US5334029A

    公开(公告)日:1994-08-02

    申请号:US59844

    申请日:1993-05-11

    IPC分类号: H01R12/52 H01R9/09

    CPC分类号: H01R12/52

    摘要: Disclosed is a device for electrically coupling stocked circuit boards using conductive polymer interconnect material and a spacer element. In one embodiment, coaxial connection is provided by means of an array of wires within undulating metal envelopes. In another embodiment, pins are provided within holes in a plastic spacer. In a third embodiment, wires are laid on a substrate and successive laminations are built up to form the spacer element. In a fourth embodiment, wire arrays are extrusion molded within thermoplastic sheets which are laminated to form the spacer element.

    摘要翻译: 公开了一种用于使用导电聚合物互连材料和间隔元件电耦合放电电路板的装置。 在一个实施例中,通过在起伏的金属封套内的电线阵列来提供同轴连接。 在另一个实施例中,销设置在塑料间隔件的孔内。 在第三实施例中,将电线放置在基板上,并且构建连续的叠片以形成间隔元件。 在第四实施例中,线阵列被挤出成型在热塑性片材中,层压以形成间隔元件。