Laminated electric heat generating member for reflow soldering devices
    1.
    发明授权
    Laminated electric heat generating member for reflow soldering devices 失效
    用于回流焊接装置的层压电热元件

    公开(公告)号:US4412123A

    公开(公告)日:1983-10-25

    申请号:US148505

    申请日:1980-05-09

    CPC分类号: B23K3/0471 H05B3/10

    摘要: An electrically heated soldering device adapted to simultaneously heat a plurality of spaced electrical elements in a reflow soldering operation includes an elongated metal laminate of substantially U-shaped cross section having a bight portion between two side portions which may be parallel or divergent. The laminate includes a layer of aluminum between a layer of copper and a layer of stainless steel, with the layers being roll bonded together. The copper and aluminum layers are removed at the bight portion to expose the stainless steel layer and form a heat generating zone for contacting the plurality spaced electrical elements which is corrosion resistant and nonwettable by solder. The edges of the copper and aluminum layers adjacent to the exposed stainless steel bight portion are shaped to impart a selectable temperature profile, either uniform or non-uniform along the length of the bight portion. The exposed surface of the stainless steel portion can be provided with a ceramic coating to electrically insulate bight portion from the elements to be soldered. The legs of the U-shaped laminate are adapted to be connected to an electric power source through the copper and aluminum layers thereof.

    摘要翻译: 适于在回流焊接操作中同时加热多个间隔的电气元件的电加热焊接装置包括具有大致U形横截面的细长金属层压体,其具有可以平行或发散的两个侧部之间的弯曲部分。 该层压板包括一层铜层与一层不锈钢之间的铝层,其中层层压在一起。 铜和铝层在弯曲部分被去除以暴露不锈钢层并且形成用于接触多个间隔开的电气元件的发热区域,该电气元件是耐腐蚀的并且通过焊料不可润湿。 与暴露的不锈钢弯曲部分相邻的铜和铝层的边缘被成形为沿着弯曲部分的长度赋予可选择的温度分布,均匀或不均匀。 不锈钢部分的暴露表面可以设置有陶瓷涂层,以将弯曲部分与要焊接的元件电绝缘。 U形层压体的腿部通过其铜和铝层连接到电源。

    Method and apparatus for facilitating loading of a panel processing
machine and positioning of artwork on a work surface thereon
    2.
    发明授权
    Method and apparatus for facilitating loading of a panel processing machine and positioning of artwork on a work surface thereon 失效
    便于加载面板加工机器并在工件表面上定位艺术品的方法和装置

    公开(公告)号:US5014413A

    公开(公告)日:1991-05-14

    申请号:US351897

    申请日:1989-05-15

    申请人: Hans H. Ammann

    发明人: Hans H. Ammann

    摘要: A method and apparatus for positioning a locating mechanism and the artwork frame of a panel processing machine has been devised utilizing a flexible beam apparatus for suspending the panel location mechanism and artwork frame which permit these devices to be moved out of the way during loading and unloading panels into and from the work surface of processing machinery. The flexible beam suspending the location mechanism in the disclosed embodiment comprises two parallel surface thin members of resilient sheet material. These members are each attached along one edge to a rigid portion of the machinery and along an opposing edge to the panel locating mechanism. This flexible beam arrangement permits the locating elements of the locating mechanism to be moved from and restored to a previous position with great accuracy. A pair of co-planar high aspect ratio sheet beam members are used to support the artwork frame. One end of these flexible beams is each attached to the machine and an opposing end is attached to the artwork frame. These flexible beam arrangements permit the locating elements and artwork to be moved while panels are inserted into or removed from a work surface of the processing machine and restored to a previous operative position with great accuracy.

    摘要翻译: 已经设计了一种用于定位定位机构和面板加工机的艺术品框架的方法和装置,利用柔性梁装置来悬挂面板定位机构和图案框架,这些框架允许这些装置在装载和卸载期间被移出。 面板进出加工机械的工作面。 在所公开的实施例中悬挂定位机构的柔性梁包括弹性片材的两个平行的表面薄的构件。 这些构件各自沿着一个边缘附接到机械的刚性部分并且沿着与面板定位机构相对的边缘。 这种柔性梁结构允许定位机构的定位元件以高精度移动并恢复到先前的位置。 一对共面高纵横比的薄片梁构件用于支撑艺术品框架。 这些柔性梁的一端各自连接到机器上,并且相对的端部附接到艺术品框架。 这些柔性梁结构允许定位元件和图案移动,同时将面板插入加工机械的工作表面或从加工机械的工作表面移除并且以高精度恢复到先前的操作位置。

    Method and apparatus for aligning phototools for photoprocessing of
printed circuit boards
    4.
    发明授权
    Method and apparatus for aligning phototools for photoprocessing of printed circuit boards 失效
    用于对准用于印刷电路板的光刻处理的照相工具的方法和装置

    公开(公告)号:US5335405A

    公开(公告)日:1994-08-09

    申请号:US69657

    申请日:1993-06-01

    摘要: Phototools are located for processing both sides of printed circuit board panels by an apparatus and process that utilizes a work station with two alignment fixtures each including panel center registration PCR alignment mechanism to locate phototools and panels. Processing steps utilize the alignment fixtures to locate phototools on both sides of a panel. Each of the two phototools is initially positioned on its alignment fixture by the PCR alignment mechanism and secured to its alignment fixture by means of a vacuum supplied by a vacuum chuck which is operative as the top surface of the alignment fixture. The panel is then placed on top of the first phototool and aligned to the first phototool in the first alignment fixture using the PCR alignment mechanism. This first phototool is then affixed to the first side of the panel. The panel with the attached first phototool is then placed on the second phototool in the second alignment fixture and aligned to the second phototool using the PCR alignment mechanism. The second phototool is then affixed to the second side of the panel. The phototool-panel-phototool package is then placed in a printer for exposure.

    摘要翻译: 摄影工具位于通过一个装置和工艺来处理印刷电路板面板的两侧,该设备和工艺利用具有两个对准夹具的工作站,每个对准夹具包括面板中心对准PCR对准机构来定位照相工具和面板。 处理步骤利用对准夹具来定位面板两侧的照相工具。 两个照相工具中的每一个最初通过PCR对准机构定位在其对准夹具上,并通过由作为对准夹具的顶表面的真空吸盘提供的真空固定到其对准夹具。 然后将面板放置在第一光学工具的顶部上,并使用PCR对准机构与第一对准夹具中的第一光学工具对准。 然后将第一张照片固定到面板的第一侧。 然后将具有附着的第一光固版的面板放置在第二对准夹具中的第二光学工具上,并使用PCR对准机构与第二光学工具对准。 然后将第二张照片固定到面板的第二侧。 然后将照相工具 - 面板照相工具包放置在用于曝光的打印机中。

    Process and apparatus for controlling losses in volatile working fluid
systems
    7.
    发明授权
    Process and apparatus for controlling losses in volatile working fluid systems 失效
    用于控制挥发性工作流体系统中的损失的方法和装置

    公开(公告)号:US4264299A

    公开(公告)日:1981-04-28

    申请号:US129623

    申请日:1980-03-12

    CPC分类号: C23G5/04 B23K1/015

    摘要: A process and apparatus are disclosed for controlling losses in volatile working fluid systems. In accordance with the process, the object upon which a work operation is to be effected is sequentially moved from a first sealable chamber to a second such chamber and back to the first chamber. While in the second chamber the object is exposed to a working fluid vapor which elevates the temperature of the object to a level near the boiling point of the working fluid. Thereafter, while still in the second chamber, a substantial portion of the working fluid is drained from the object such that the sensible heat acquired by the object upon its elevation of temperature is sufficient to evaporate working fluid remaining on the object upon its removal to the first chamber. Upon removal of the object to the first chamber the object is thoroughly dried through control of the partial pressure of the working fluid vapor contained within the first chamber atmosphere. This control is effected by a closed devaporization loop coupled to the first chamber. In addition, any working fluid which may have been deposited on surfaces within the first chamber is revaporized by auxilliary heating means. Virtually all of this working fluid vapor is recovered by extended devaporization of the atmosphere. Throughout the process any pressure differentials which exist between an internal atmosphere within the first and second chambers and an external atmosphere are equalized by means of a snorkellike member.

    摘要翻译: 公开了用于控制挥发性工作流体系统中的损失的方法和装置。 根据该过程,要进行作业操作的物体从第一可密封室依次移动到第二这样的室并返回到第一室。 而在第二个室中,物体被暴露于工作流体蒸汽,其将物体的温度升高到接近工作流体沸点的水平。 此后,在仍然在第二室中的同时,工作流体的大部分从物体排出,使得物体在其升高温度时获得的显热量足以蒸发残留在物体上的工作流体, 第一室。 当通过控制包含在第一腔室气氛中的工作流体蒸汽的分压而将物体移除到第一室时,物体被彻底干燥。 该控制由耦合到第一室的闭合的脱气回路实现。 此外,可能已经沉积在第一室内的表面上的任何工作流体由辅助加热装置进行再蒸发。 实际上,所有这些工作流体蒸汽都是通过大气的扩大除气来回收的。 在整个过程中,存在于第一和第二室内的内部气氛与外部气氛之间的任何压差通过浮潜构件相等。

    Method for soldering, fusing or brazing
    8.
    再颁专利
    Method for soldering, fusing or brazing 失效
    焊接,熔接或钎焊的方法

    公开(公告)号:USRE30399E

    公开(公告)日:1980-09-09

    申请号:US826104

    申请日:1977-08-19

    IPC分类号: B23K1/015

    CPC分类号: B23K1/015

    摘要: .[.Article.]. .Iadd.An article .Iaddend.to be soldered, fused or brazed is placed in hot saturated vapors generated by continuously boiling .Iadd.a .Iaddend.heat transfer liquid having selected properties including .Iadd.a .Iaddend.boiling point at least equal to, and preferably above, .Iadd.the .Iaddend.temperature required for .Iadd.such .Iaddend.operation. Vapors condense on .Iadd.the .Iaddend.article and give up latent heat of vaporization to heat .Iadd.the .Iaddend.article to .Iadd.the .Iaddend.temperature for soldering, fusing or brazing. .[.Heat.]. .Iadd.The heat .Iaddend.transfer liquid may be a fluorocarbon. Apparatus is shown for soldering, fusing or brazing a single article, a batch of articles, or a continuously moving line of articles. Specifically, mass reflow soldering and mass wave soldering operations are described. .Iadd.