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公开(公告)号：US20060151203A1
公开(公告)日：2006-07-13
申请号：US10523875
申请日：2003-06-23
申请人： Hans Krueger , Jurgen Portmann , Karl Nicolaus , Gregor Feiertag , Alois Stelzl
发明人： Hans Krueger , Jurgen Portmann , Karl Nicolaus , Gregor Feiertag , Alois Stelzl
CPC分类号： H03H9/0557 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10157 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15313 , H01L2924/18161 , H01L2924/3025 , H01L2924/3511 , H03H9/059 , H03H9/1071 , H03H9/1078 , Y10T29/49146 , H01L2924/00 , H01L2924/00014
摘要： The present invention relates to an encapsulated component that includes a carrier substrate and at least one chip positioned on the top of the carrier substrate and electrically connected to it by means of electrically conductive connections. The encapsulation of the chip is accomplished with a seal or dielectric layer. As a result of differing coefficients of expansion of the seal or dielectric layer and the electrically conductive connections, with changing temperatures stresses occur in the electrically conductive connections, which can lead to cracks, breaks and even to interruption of the electrically conductive connections. To mechanically relieve the electrically conductive connections of stresses from changing temperatures (in particular under extreme thermal loads), it is proposed that the carrier substrate be provided with a support element that encircles the chip, which serves to support the seal or dielectric layer, and/or that the material and the arrangement of the encapsulation be selected accordingly.
摘要翻译： 本发明涉及一种封装的部件，其包括载体基板和位于载体基板顶部上的至少一个芯片，并且通过导电连接与其电连接。 芯片的封装是用密封或介电层完成的。 由于密封或电介质层和导电连接的膨胀系数不同，在导电连接中会发生变化的温度应力，这可导致导电连接的裂纹，断裂甚至中断。 为了机械地减轻应力从变化的温度（特别是在极端热负荷下）的导电连接，提出载体基板设置有环绕芯片的支撑元件，其用于支撑密封或介电层，以及 /或相应地选择封装的材料和布置。
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公开(公告)号：US07388281B2
公开(公告)日：2008-06-17
申请号：US10523875
申请日：2003-06-23
申请人： Hans Krueger , Jürgen Portmann , Karl Nicolaus , Gregor Feiertag , Alois Stelzl
发明人： Hans Krueger , Jürgen Portmann , Karl Nicolaus , Gregor Feiertag , Alois Stelzl
CPC分类号： H03H9/0557 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10157 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15313 , H01L2924/18161 , H01L2924/3025 , H01L2924/3511 , H03H9/059 , H03H9/1071 , H03H9/1078 , Y10T29/49146 , H01L2924/00 , H01L2924/00014
摘要： The present invention relates to an encapsulated component that includes a carrier substrate and at least one chip positioned on the top of the carrier substrate and electrically connected to it by means of electrically conductive connections. The encapsulation of the chip is accomplished with a seal or dielectric layer. As a result of differing coefficients of expansion of the seal or dielectric layer and the electrically conductive connections, with changing temperatures stresses occur in the electrically conductive connections, which can lead to cracks, breaks and even to interruption of the electrically conductive connections. To mechanically relieve the electrically conductive connections of stresses from changing temperatures (in particular under extreme thermal loads), it is proposed that the carrier substrate be provided with a support element that encircles the chip, which serves to support the seal or dielectric layer, and/or that the material and the arrangement of the encapsulation be selected accordingly.
摘要翻译： 本发明涉及一种封装的部件，其包括载体基板和位于载体基板顶部上的至少一个芯片，并且通过导电连接与其电连接。 芯片的封装是用密封或介电层完成的。 由于密封或电介质层和导电连接的膨胀系数不同，在导电连接中会发生变化的温度应力，这可导致导电连接的裂纹，断裂甚至中断。 为了机械地减轻应力从变化的温度（特别是在极端热负荷下）的导电连接，提出载体基板设置有环绕芯片的支撑元件，其用于支撑密封或介电层，以及 /或相应地选择封装的材料和布置。
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公开(公告)号：US20080048317A1
公开(公告)日：2008-02-28
申请号：US11659146
申请日：2005-06-08
申请人： Hans Krueger , Karl Nicolaus , Juergen Portmann , Peter Selmeier
发明人： Hans Krueger , Karl Nicolaus , Juergen Portmann , Peter Selmeier
IPC分类号： H01L21/60
CPC分类号： H01L23/49838 , H01L23/50 , H01L23/562 , H01L24/14 , H01L24/73 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/10135 , H01L2224/14132 , H01L2224/81136 , H01L2224/81139 , H01L2224/81801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A component includes a carrier substrate having a coefficient of thermal expansion αp and a chip mounted on the carrier substrate by a plurality of bumps. The chip has a first coefficient of thermal expansion α1 in a first direction x1 and a first expansion difference, Δα1 equal to the absolute value of αp−α1. The chip also has a second coefficient of thermal expansion α2 in a second direction x2 and a second expansion difference Δα2 is equal to the absolute value of αp−α2,. The bumps are arranged such that a first distance, Δx1, corresponding to a normal projection of a line between centers of terminally situated bumps in the first direction onto an axis running parallel to direction x1 is less than a second distance corresponding to a normal projection of a line between centers of terminally situated bumps in the second direction onto an axis parallel to direction x2.
摘要翻译： 一种组件包括具有热膨胀系数α载体的载体衬底和通过多个凸块安装在载体衬底上的芯片。 该芯片在第一方向x 1上具有第一热膨胀系数α1，并且第一膨胀差Δalpha1等于绝对值 αα-α1的值。 芯片还具有在第二方向x 2 2上的第二热膨胀系数α2 2和第二膨胀差Δα2 2等于 α2α2的绝对值。 凸块被布置成使得与第一方向上的终端位置的凸块的中心之间的线的正常投影对应于平行于方向x的轴线上的第一距离Deltax 1 小于与第二方向上的终端位置的凸块的中心之间的线的正常投影对应于平行于方向x 2的轴线的第二距离。
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公开(公告)号：US07518249B2
公开(公告)日：2009-04-14
申请号：US11659146
申请日：2005-06-08
申请人： Hans Krueger , Karl Nicolaus , Juergen Portmann , Peter Selmeier
发明人： Hans Krueger , Karl Nicolaus , Juergen Portmann , Peter Selmeier
CPC分类号： H01L23/49838 , H01L23/50 , H01L23/562 , H01L24/14 , H01L24/73 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/10135 , H01L2224/14132 , H01L2224/81136 , H01L2224/81139 , H01L2224/81801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A component includes a carrier substrate having a coefficient of thermal expansion αp and a chip mounted on the carrier substrate by a plurality of bumps. The chip has a first coefficient of thermal expansion α1 in a first direction x1 and a first expansion difference, Δα1 equal to the absolute value of αp−α1. The chip also has a second coefficient of thermal expansion α2 in a second direction x2 and a second expansion difference Δα2 is equal to the absolute value of αp−α2,. The bumps are arranged such that a first distance, Δx1, corresponding to a normal projection of a line between centers of terminally situated bumps in the first direction onto an axis running parallel to direction x1 is less than a second distance corresponding to a normal projection of a line between centers of terminally situated bumps in the second direction onto an axis parallel to direction x2.
摘要翻译： 组件包括具有热膨胀系数的载体衬底和通过多个凸块安装在载体衬底上的芯片。 芯片在第一方向x1具有第一热膨胀系数α1和第一膨胀差，Δalpha1等于alphap-α1的绝对值。 该芯片还具有第二方向x2的第二热膨胀系数α2，第二扩张差Δalpha2等于alphap-α2的绝对值。 凸块被布置成使得对应于在第一方向上的终端位置的凸块的中心之间的线的正常投影的平行于方向x1的轴线的第一距离Deltax1小于对应于方向x1的正常投影的第二距离 在第二方向上的终端位置的中心之间的线与平行于方向x2的轴线之间的线。
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