公开(公告)号：US20060151203A1

公开(公告)日：2006-07-13

申请号：US10523875

申请日：2003-06-23

申请人： Hans Krueger ,  Jurgen Portmann ,  Karl Nicolaus ,  Gregor Feiertag ,  Alois Stelzl

发明人： Hans Krueger ,  Jurgen Portmann ,  Karl Nicolaus ,  Gregor Feiertag ,  Alois Stelzl

IPC分类号： H01L23/31 ,  H05K3/30 ,  H01L23/48 ,  H05K1/18

CPC分类号： H03H9/0557 ,  H01L29/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10157 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/3511 ,  H03H9/059 ,  H03H9/1071 ,  H03H9/1078 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2924/00014

摘要： The present invention relates to an encapsulated component that includes a carrier substrate and at least one chip positioned on the top of the carrier substrate and electrically connected to it by means of electrically conductive connections. The encapsulation of the chip is accomplished with a seal or dielectric layer. As a result of differing coefficients of expansion of the seal or dielectric layer and the electrically conductive connections, with changing temperatures stresses occur in the electrically conductive connections, which can lead to cracks, breaks and even to interruption of the electrically conductive connections. To mechanically relieve the electrically conductive connections of stresses from changing temperatures (in particular under extreme thermal loads), it is proposed that the carrier substrate be provided with a support element that encircles the chip, which serves to support the seal or dielectric layer, and/or that the material and the arrangement of the encapsulation be selected accordingly.

摘要翻译： 本发明涉及一种封装的部件，其包括载体基板和位于载体基板顶部上的至少一个芯片，并且通过导电连接与其电连接。 芯片的封装是用密封或介电层完成的。 由于密封或电介质层和导电连接的膨胀系数不同，在导电连接中会发生变化的温度应力，这可导致导电连接的裂纹，断裂甚至中断。 为了机械地减轻应力从变化的温度（特别是在极端热负荷下）的导电连接，提出载体基板设置有环绕芯片的支撑元件，其用于支撑密封或介电层，以及 /或相应地选择封装的材料和布置。

公开(公告)号：US20050034888A1

公开(公告)日：2005-02-17

申请号：US10500371

申请日：2002-12-11

申请人： Christian Hoffmann ,  Jurgen Portmann ,  Hans Krueger

发明人： Christian Hoffmann ,  Jurgen Portmann ,  Hans Krueger

IPC分类号： H01L23/12 ,  H01L29/06 ,  H03H3/02 ,  H03H3/06 ,  H03H3/08 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/25 ,  H03H9/56 ,  H01L23/02

CPC分类号： H03H9/1078 ,  H01L24/31 ,  H01L29/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/73203 ,  H01L2224/83136 ,  H01L2224/83951 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/09701 ,  H01L2924/10157 ,  H01L2924/12042 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/351 ,  H03H9/059 ,  H01L2924/0105 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： For simpler and safer encapsulation of components, it is proposed to generate the connection between a chip and a carrier substrate by means of bump connections that are sunk into recesses on the carrier substrate. The component thereby lies directly on the carrier substrate, in particular on a frame circumscribing the component structures on the chip.

摘要翻译： 为了更简单和更安全地封装组件，建议通过沉积在载体衬底上的凹陷中的凸块连接来产生芯片和载体衬底之间的连接。 因此，该部件直接位于载体基板上，特别是在限定芯片上的部件结构的框架上。