Palladium plating procedure
    2.
    发明授权
    Palladium plating procedure 失效
    镀钯步骤

    公开(公告)号:US4454010A

    公开(公告)日:1984-06-12

    申请号:US412512

    申请日:1982-08-30

    申请人: Harvey S. Trop

    发明人: Harvey S. Trop

    IPC分类号: C25D3/52

    CPC分类号: C25D3/52

    摘要: A palladium electroplating process is described in which a unique compound is used to supply palladium to the electroplating bath. The procedure is particularly useful where a polyamine such as 1,3-diaminopropane is used as the complexing agent for palladium in a palladium electroplating bath. The unique compound is palladium-1,3-diaminopropanedichloride which is highly stable, can be made in pure form, and is readily soluble in water, aqueous solutions, and typical palladium baths.

    摘要翻译: 描述了钯电镀方法,其中使用独特的化合物将钯供应到电镀浴中。 当使用诸如1,3-二氨基丙烷的多胺作为钯电镀浴中的钯络合剂时,该方法特别有用。 独特的化合物是高度稳定的钯-1,3-二氨基丙二氯化物,可以制成纯的形式,并且易溶于水,水溶液和典型的钯浴。

    Etching optical surfaces on GaAs
    3.
    发明授权
    Etching optical surfaces on GaAs 失效
    蚀刻GaAs上的光学表面

    公开(公告)号:US4576691A

    公开(公告)日:1986-03-18

    申请号:US636177

    申请日:1984-07-31

    IPC分类号: C25F3/12 C25F3/14 H01L21/3063

    摘要: Photoelectrochemical etching of gallium arsenide in highly alkaline aqueous solution yields optically smooth etched surfaces suitable for many optical devices. Higher optical quality is obtained for lower irradiation energy provided sufficient energy is available to produce holes in the valence band.

    摘要翻译: 在高碱性水溶液中对砷化镓的光电化学蚀刻产生适合于许多光学器件的光学平滑蚀刻表面。 获得较低的照射能量的较高的光学质量,只要有足够的能量可用于产生价带中的空穴。

    Palladium plating prodedure
    4.
    发明授权
    Palladium plating prodedure 失效
    钯电镀

    公开(公告)号:US4486274A

    公开(公告)日:1984-12-04

    申请号:US477588

    申请日:1983-03-21

    CPC分类号: C25D3/52

    摘要: A palladium electroplating procedure is disclosed which permits rapid and efficient plating and yields ductile, adherent palladium films. The electroplating bath comprises a unique palladium complex. The procedure is also useful for electroplating a variety of palladium alloys. In addition, the bath is highly stable and does not adversely affect the base material being plated.

    摘要翻译: 公开了一种钯电镀方法,其允许快速且有效的电镀并产生延性,附着的钯膜。 电镀浴包含独特的钯络合物。 该方法对于电镀各种钯合金也是有用的。 此外,浴是高度稳定的,并且不会对被镀的基材产生不利影响。