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1.发明授权Isocyanuric ring-containing polysiloxane having vinyl groups at the terminals 有权在末端具有乙烯基的含异氰脲酸环的聚硅氧烷公开(公告)号：US08124715B2
公开(公告)日：2012-02-28
申请号：US12938639
申请日：2010-11-03
IPC分类号： C08G77/20
CPC分类号： C08G77/26 , C07F7/0838 , C08G77/20 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： The purpose of the present invention is to provide an isocyanuric ring-containing organopolysiloxane which can provide a cured product which can exploit the properties of a hydrosilylation (addition reaction), and is suitable for use in an encapsulating materials for an optical semiconductor. Thus, the present invention provides an organopolysiloxane having at least one isocyanuric ring in a molecule and vinyl siloxy groups at both terminals, and represented by the following formula (1): wherein X is, independently of each other, a monovalent organic group which does not have an unsaturated bond, R1 and R2 are, independently of each other, a methyl group or a phenyl group, and P is an integer of from 1 to 30.
摘要翻译： 本发明的目的是提供一种可以提供可以利用氢化硅烷化（加成反应）的性质的固化产物的异氰脲酸环的有机聚硅氧烷，并且适合用于光学半导体的封装材料。 因此，本发明提供了在分子中具有至少一个异氰脲酸酯环的两端的乙烯基甲硅烷氧基和由下式（1）表示的有机聚硅氧烷：其中，X彼此独立地为1价有机基， 不具有不饱和键，R 1和R 2彼此独立地为甲基或苯基，P为1〜30的整数。
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2.发明申请ISOCYANURIC RING-CONTAINING POLYSILOXANE HAVING VINYL GROUPS AT THE TERMINALS 有权在端子上具有乙烯基团的含异氰酸酯环的聚硅氧烷公开(公告)号：US20110105713A1
公开(公告)日：2011-05-05
申请号：US12938639
申请日：2010-11-03
IPC分类号： C08G77/20
CPC分类号： C08G77/26 , C07F7/0838 , C08G77/20 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： The purpose of the present invention is to provide an isocyanuric ring-containing organopolysiloxane which can provide a cured product which can exploit the properties of a hydrosilylation (addition reaction), and is suitable for use in an encapsulating materials for an optical semiconductor. Thus, the present invention provides an organopolysiloxane having at least one isocyanuric ring in a molecule and vinyl siloxy groups at both terminals, and represented by the following formula (1): wherein X is, independently of each other, a monovalent organic group which does not have an unsaturated bond, R1 and R2 are, independently of each other, a methyl group or a phenyl group, and P is an integer of from 1 to 30.
摘要翻译： 本发明的目的是提供一种可以提供可以利用氢化硅烷化（加成反应）的性质的固化产物的异氰脲酸环的有机聚硅氧烷，并且适合用于光学半导体的封装材料。 因此，本发明提供了在分子中具有至少一个异氰脲酸酯环的两端的乙烯基甲硅烷氧基和由下式（1）表示的有机聚硅氧烷：其中，X彼此独立地为1价有机基， 不具有不饱和键，R 1和R 2彼此独立地为甲基或苯基，P为1〜30的整数。
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公开(公告)号：US07737194B2
公开(公告)日：2010-06-15
申请号：US11785791
申请日：2007-04-20
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/56 , C08L83/00
摘要： A colorless transparent silicone lens produced by thermally curing a silicone resin composition comprising (A) an organopolysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3aR4bSiO(4-a-b)/2 unit wherein R1, R2, and R3 are independently methyl group, ethyl group, propyl group, cyclohexyl group, or phenyl group, R4 is vinyl group or allyl group, a is 0, 1, or 2, b is 1 or 2, and a+b is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, (B) an organohydrogen polysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3cHdSiO(4-c-d)/2 unit wherein c is 0, 1, or 2, d is 1 or 2, and c+d is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, the component, and (C) a platinum group catalyst. A silicone lens having excellent flexibility, transparency, and moldability as well as reduced surface tackiness is provided.
摘要翻译： 通过热固化硅氧烷树脂组合物制得的无色透明硅氧烷透镜，其包含（A）具有包含R1SiO1.5单元，R22SiO单元和R3aR4bSiO（4-ab）/ 2单元的树脂结构的有机聚硅氧烷，其中R1，R2和R3为 乙基，丙基，环己基或苯基，R4为乙烯基或烯丙基，a为0,1或2，b为1或2，a + b为2或3，以及 其中R22SiO单元的重复数为5〜300，（B）具有包含R1SiO1.5单元，R22SiO单元和R3cHdSiO（4-cd）/ 2单元的树脂结构的有机氢聚硅氧烷，其中c为0,1或 2，d为1或2，c + d为2或3，R22SiO单元的重复数为5〜300，该成分为（C）铂族催化剂。 提供了具有优异的柔性，透明性和成型性以及降低的表面粘性的硅氧烷透镜。
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4.发明申请Phosphor-containing adhesive silicone composition, composition sheet formed of the composition, and method of producing light emitting device using the sheet 有权含有荧光体的粘合性硅酮组合物，由该组合物形成的组合物片材，以及使用该片材的发光装置的制造方法公开(公告)号：US20080308828A1
公开(公告)日：2008-12-18
申请号：US12078909
申请日：2008-04-08
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： H01L33/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , H01L33/56 , Y10T428/31663 , C08L83/00
摘要： An addition curable adhesive silicone composition containing a phosphor dispersed uniformly therein is provided. The dispersive state of the phosphor remains stable over time. The composition, in an uncured state at room temperature, is either a solid or a semisolid, and is therefore easy to handle, and is suited to an adhesive silicone composition sheet which is able to be formed easily on an LED chip using a conventional assembly apparatus.
摘要翻译： 提供含有均匀分布的荧光体的可固化粘合性有机硅组合物。 荧光体的分散状态随时间保持稳定。 在室温未固化状态下的组合物是固体或半固体，因此易于处理，并且适用于能够使用常规组合容易地在LED芯片上形成的粘合性有机硅组合物片材 仪器。
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5.发明申请Epoxy-silicone mixed resin composition, cured article thereof, and light-emitting semiconductor device 审中-公开环氧硅酮类混合树脂组合物，其固化物，发光半导体装置公开(公告)号：US20060270808A1
公开(公告)日：2006-11-30
申请号：US11438444
申请日：2006-05-23
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/20 , C08L63/00 , C08L83/00 , C08L2666/14 , C08K5/56 , C08K5/0091
摘要： An epoxy-silicone mixed resin composition comprising (A) an organopolysiloxane having at least one vinyl or allyl group and at least one hydroxyl group, (B) an organic resin having at least one epoxy group, (C) an organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, (E) an aluminum compound, and (F) 0.1-15% by weight of an organic mold release agent is molded and cured in a metal mold into a transparent product which can be smoothly removed from the mold. The cured product has a satisfactory bond strength to metal frames and maintains heat resistance. LED devices can be fabricated by continuous mechanical molding.
摘要翻译： 一种环氧硅树脂混合树脂组合物，其包含（A）具有至少一个乙烯基或烯丙基和至少一个羟基的有机聚硅氧烷，（B）具有至少一个环氧基的有机树脂，（C）有机氢聚硅氧烷，（D） 铂族金属类催化剂（E）铝化合物和（F）0.1-15％重量的有机脱模剂在金属模具中成型并固化成透明产品，其可以从 模子。 固化产品对金属框架具有令人满意的粘合强度，并保持耐热性。 LED器件可以通过连续机械成型制造。
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公开(公告)号：US20060264583A1
公开(公告)日：2006-11-23
申请号：US11437664
申请日：2006-05-22
IPC分类号： C08L83/04
摘要： Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds and having a viscosity of 100-1,000,000 mPa·s at 25° C., (B) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms (SiH groups) in the form of HR62SiO-, and (C) a platinum group metal base catalyst cure into colorless transparent parts which are useful lenses.
摘要翻译： 硅氧烷树脂组合物，其包含（A）含有至少两个脂族不饱和键并且在25℃下具有100-1,000,000mPa.s粘度的有机聚硅氧烷，（B）具有至少三个与硅键合的氢原子的有机氢聚硅氧烷（SiH基） ），和（C）铂族金属碱催化剂固化成无色透明部分，这是有用的透镜。
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公开(公告)号：US20060229408A1
公开(公告)日：2006-10-12
申请号：US11399434
申请日：2006-04-07
CPC分类号： H01L23/293 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08L83/04 , H01L2924/0002 , C08L2666/52 , C08L2666/54 , H01L2924/00
摘要： A curable resin composition for sealing an LED element is provided. The composition includes (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×103, (ii) a condensation catalyst, (iii) a solvent, and (iv) a finely powdered inorganic filler. It is suited to formation of a coating film or the like with excellent heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and is ideal for applications such as the sealing of LED elements.
摘要翻译： 提供一种用于密封LED元件的可固化树脂组合物。 组合物包括（i）聚苯乙烯当量重均分子量为至少5×10 3的有机聚硅氧烷，（ii）缩合催化剂，（iii）溶剂和（iv）细粉末状无机物 填料。 适合于形成具有优异的耐热性，耐紫外光性，光学透明性，韧性和粘合性的涂膜等，并且是诸如LED元件的密封等应用的理想选择。
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公开(公告)号：US07056772B2
公开(公告)日：2006-06-06
申请号：US10885678
申请日：2004-07-08
申请人： Toshio Shiobara , Tsutomu Kashiwagi
发明人： Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： H01L21/48
CPC分类号： H01L23/3157 , H01L21/56 , H01L33/52 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/12044 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In connection with a semiconductor component having a circuit region and electrodes formed on a substrate surface, the circuit region is sealed by (1) applying a resist material onto the substrate surface to form a resist layer, (2) selectively exposing the resist layer to radiation and developing the resist with a liquid developer for thereby removing only the portion of the resist layer which overlies the circuit region, (3) applying a resin sealant onto the circuit region and curing the resin sealant into a cured resin layer that covers the circuit region, and (4) removing the residual resist layer using a solvent.
摘要翻译： 结合具有电路区域和形成在基板表面上的电极的半导体部件，通过（1）在基板表面上施加抗蚀剂材料以形成抗蚀剂层来密封电路区域，（2）将抗蚀剂层选择性地暴露于 辐射并用液体显影剂显影抗蚀剂，从而仅去除覆盖电路区域的抗蚀剂层的部分，（3）将树脂密封剂施加到电路区域上并将树脂密封剂固化成覆盖电路的固化树脂层 区域，（4）使用溶剂除去残留抗蚀剂层。
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公开(公告)号：US20050025442A1
公开(公告)日：2005-02-03
申请号：US10911686
申请日：2004-08-05
申请人： Kinya Kodama , Tsutomu Kashiwagi , Toshio Shiobara
发明人： Kinya Kodama , Tsutomu Kashiwagi , Toshio Shiobara
摘要： An optical waveguide comprising a substrate, a lower clad layer on the substrate, a core layer and an upper clad layer, at least one of the lower clad layer, the core layer and the upper clad layer is formed of a cured product of a photo-curable organopolysiloxane composition comprising (A) a (meth)acryloyloxy group-containing organopolysiloxane of the following average compositional formula (1): (CH2═CR1COO(CH2)n)a(Ph)bR2c(R3O)dSiO(4-a-b-c-d)/2 (1) wherein R1 is hydrogen or methyl, R2 is an C1-C8 alkyl or C2-C8 alkenyl group, Ph is phenyl, R3 is hydrogen or an unsubstituted or alkoxy-substituted C1-C4 alkyl group, subscripts a, b, c and d are numbers satisfying: 0.05≦a≦0.9, 0.1≦b≦0.9, 0≦c≦0.2, 0
摘要翻译： 一种光波导，包括基板，基底上的下覆盖层，芯层和上覆盖层，下包层，芯层和上覆层中的至少一个由照相的固化产物形成 （A）含有下列平均组成式（1）的（甲基）丙烯酰氧基的有机聚硅氧烷：（CH 2 = CR 1 COO（CH 2）n）a（Ph）b R c R 3 O）dSiO（4-abcd）/ 2（1）其中R 1是氢或甲基，R 2是C 1 -C 8烷基或C 2 -C 8烯基，Ph是苯基， 3>是氢或未取代的或烷氧基取代的C 1 -C 4烷基，下标a，b，c和d是满足：0.05 <= a <= 0.9,0.1 <= b <= 0.9,0 <= c < = 0.2,0
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公开(公告)号：US08497024B2
公开(公告)日：2013-07-30
申请号：US12860682
申请日：2010-08-20
申请人： Manabu Ueno , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Manabu Ueno , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： B32B9/04
摘要： Organopolysilmethylene-siloxane of the formula (1): wherein each R1 is, independently of one another, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, and a halogen atom; each R2 is, independently of one another, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, a halogen atom, and (R1)3SiCH2—, wherein each R3 is, independently of one another, a hydrogen atom and an alkyl group having 1 to 4 carbon atoms; k is an integer of 1 to 100; and n is an integer of 1 to 1000; said organopolysilmethylene-siloxane having, in a molecule, at least two out of alkoxy groups, hydroxy groups, and halogen atoms bonded to one or more silicon atoms.
摘要翻译： 式（1）的有机聚硅氧烷 - 硅氧烷：其中每个R 1彼此独立地是除烯基，烷氧基，羟基和卤素以外的未取代或取代的碳原子数1〜10的一价烃基 原子; 每个R 2彼此独立地是除烯基，烷氧基，羟基，卤素原子和（R 1）3 SiCH 2 - 以外具有1至10个碳原子的未取代或取代的一价烃基，其中每个R 3 彼此独立地是氢原子和具有1至4个碳原子的烷基; k为1〜100的整数， n为1〜1000的整数。 所述有机聚硅氧烷 - 硅氧烷在分子中具有至少两个烷氧基，羟基和与一个或多个硅原子键合的卤素原子。
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