公开(公告)号：US20050042867A1

公开(公告)日：2005-02-24

申请号：US10946758

申请日：2004-09-22

申请人： Hector Sanchez ,  Michael Mendicino ,  Byoung Min ,  Kathleen Yu

发明人： Hector Sanchez ,  Michael Mendicino ,  Byoung Min ,  Kathleen Yu

IPC分类号： H01L21/02 ,  H01L21/768 ,  H01L21/84 ,  H01L23/48 ,  H01L23/522 ,  H01L27/06 ,  H01L27/12 ,  H01L21/20

CPC分类号： H01L27/0688 ,  H01L21/76838 ,  H01L21/76898 ,  H01L21/84 ,  H01L23/481 ,  H01L23/5223 ,  H01L27/1203 ,  H01L28/40 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor (10) has an active device, such as a transistor, with a directly underlying passive device, such as a capacitor (75, 77, 79), that are connected by a via or conductive region (52) and interconnect (68, 99). The via or conductive region (52) contacts a bottom surface of a diffusion or source region (22) of the transistor and contacts a first (75) of the capacitor electrodes. A laterally positioned vertical via (32, 54, 68) and interconnect (99) contacts a second (79) of the capacitor electrodes. A metal interconnect or conductive material (68) may be used as a power plane that saves circuit area by implementing the power plane underneath the transistor rather than adjacent the transistor.

摘要翻译： 半导体（10）具有诸如晶体管的有源器件，其具有通过通孔或导电区域（52）和互连（68）连接的直接下伏的无源器件，例如电容器（75,77,79） ，99）。 通孔或导电区域（52）接触晶体管的扩散或源极区域（22）的底表面并与第一（75）电容器电极接触。 横向定位的垂直通孔（32,54,68）和互连件（99）接触电容器电极的第二（79）。 金属互连或导电材料（68）可以用作通过在晶体管下面实现功率平面而不是与晶体管相邻来节省电路面积的功率面。

公开(公告)号：US20050167782A1

公开(公告)日：2005-08-04

申请号：US11098070

申请日：2005-04-04

申请人： Hector Sanchez ,  Michael Mendicino ,  Byoung Min ,  Kathleen Ju

发明人： Hector Sanchez ,  Michael Mendicino ,  Byoung Min ,  Kathleen Ju

IPC分类号： H01L21/02 ,  H01L21/768 ,  H01L21/84 ,  H01L23/48 ,  H01L23/522 ,  H01L27/06 ,  H01L27/12 ,  H01L23/053

CPC分类号： H01L27/0688 ,  H01L21/76838 ,  H01L21/76898 ,  H01L21/84 ,  H01L23/481 ,  H01L23/5223 ,  H01L27/1203 ,  H01L28/40 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor (10) has an active device, such as a transistor, with a directly underlying passive device, such as a capacitor (75, 77, 79), that are connected by a via or conductive region (52) and interconnect (68, 99). The via or conductive region (52) contacts a bottom surface of a diffusion or source region (22) of the transistor and contacts a first (75) of the capacitor electrodes. A laterally positioned vertical via (32, 54, 68) and interconnect (99) contacts a second (79) of the capacitor electrodes. A metal interconnect or conductive material (68) may be used as a power plane that saves circuit area by implementing the power plane underneath the transistor rather than adjacent the transistor.

摘要翻译： 半导体（10）具有诸如晶体管的有源器件，其具有通过通孔或导电区域（52）和互连（68）连接的直接下伏的无源器件，例如电容器（75,77,79） ，99）。 通孔或导电区域（52）接触晶体管的扩散或源极区域（22）的底表面并与第一（75）电容器电极接触。 横向定位的垂直通孔（32,54,68）和互连件（99）接触电容器电极的第二（79）。 金属互连或导电材料（68）可以用作通过在晶体管下面实现功率平面而不是与晶体管相邻来节省电路面积的功率面。

公开(公告)号：US20050280088A1

公开(公告)日：2005-12-22

申请号：US10872025

申请日：2004-06-18

申请人： Byoung Min ,  Scott Pozder ,  Hector Sanchez

发明人： Byoung Min ,  Scott Pozder ,  Hector Sanchez

IPC分类号： H01L27/01 ,  H01L27/12 ,  H01L29/786

CPC分类号： H01L29/78615 ,  H01L21/743 ,  H01L21/76898 ,  H01L27/1203 ,  H01L29/78648

摘要： A back side body contact for a transistor that extends through an opening in an insulating layer located adjacent to the backside of the body. The backside contact is coupled to an interconnect on the backside. In some examples, the interconnect is coupled to an interconnect located with respect the other side of an active layer which is coupled to a body voltage bias source.

摘要翻译： 用于晶体管的背侧体接触，其延伸穿过位于邻近身体背侧的绝缘层中的开口。 背面触点耦合到背面的互连。 在一些示例中，互连耦合到相对于耦合到体电压偏压源的有源层的另一侧定位的互连。

公开(公告)号：US20050035459A1

公开(公告)日：2005-02-17

申请号：US10946675

申请日：2004-09-22

申请人： Kathleen Yu ,  Kirk Strozewski ,  Janos Farkas ,  Hector Sanchez ,  Yeong-Jyh Lii

发明人： Kathleen Yu ,  Kirk Strozewski ,  Janos Farkas ,  Hector Sanchez ,  Yeong-Jyh Lii

IPC分类号： H01L21/3205 ,  H01L21/768 ,  H01L23/52 ,  H01L23/528 ,  H01L21/4763 ,  H01L21/44 ,  H01L29/40

CPC分类号： H01L23/5283 ,  H01L21/76807 ,  H01L21/76816 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A conductive line varies in thickness to assist in overcoming RC delays and noise coupling. By varying line thickness, variation in conductor width is avoided if necessary to maintain a specified minimum pitch between conductors while maintaining predetermined desired RC parameters and noise characteristics of the conductive line. Conductor depth variation is achieved by etching a dielectric layer to different thicknesses. A subsequent conductive fill over the dielectric layer and in the differing thicknesses results in a conductive line that varies in thickness. Different conductive line thicknesses available at a particular metal level can additionally be used for semiconductor structures other than a signal or a power supply conductive line, such as a contact, a via or an electrode of a device. The thickness analysis required to determine how interconnect thickness is varied in order to meet a desired design criteria may be automated and provided as a CAD tool.

摘要翻译： 导线的厚度变化，有助于克服RC延迟和噪声耦合。 通过改变线路厚度，如果需要在导体之间保持规定的最小间距，同时保持预定的期望的RC参数和导线的噪声特性，则避免导体宽度的变化。 通过将介电层蚀刻成不同的厚度来实现导体深度变化。 电介质层上的不同厚度的导电填充导致厚度变化的导线。 在特定金属水平可用的不同的导线厚度可以另外用于除信号或电源导线之外的半导体结构，例如器件的触点，通孔或电极。 为了满足期望的设计标准，确定互连厚度如何变化所需的厚度分析可以是自动化的并且作为CAD工具提供。

公开(公告)号：US08823454B2

公开(公告)日：2014-09-02

申请号：US13435981

申请日：2012-03-30

申请人： Hector Sanchez

发明人： Hector Sanchez

IPC分类号： H03F3/45

CPC分类号： H03F3/4521 ,  H03F3/45381 ,  H03F3/72 ,  H03F2203/45466 ,  H03F2203/45674 ,  H03F2203/7227

摘要： In accordance with at least one embodiment, an improved voltage headroom self-biased receiver is provided. In accordance with at least one embodiment, tail current sources are biased so as to be cross-coupled with respect to each other. In accordance with at least one embodiment, startup control is provided to counter defect-induced current and to ensure the circuit can function properly even with large amounts of defect current. In accordance with at least one embodiment, a positive type (p type) channel metal oxide semiconductor (PMOS) tail current transistor is modulated by a negative type (n type) channel metal oxide semiconductor (NMOS) differential pair virtual negative supply voltage and a NMOS tail current transistor is modulated by a PMOS differential pair virtual positive supply voltage. The amplifier's output common mode is thus self correcting to p type to n type transistor strength differences.

摘要翻译： 根据至少一个实施例，提供了改进的电压余量自偏置接收器。 根据至少一个实施例，尾电流源被偏置以相对于彼此交叉耦合。 根据至少一个实施例，提供启动控制以对抗缺陷感应电流，并且确保即使在大量缺陷电流下电路也能正常工作。 根据至少一个实施例，正型（p型）沟道金属氧化物半导体（PMOS）尾电流晶体管由负型（n型）沟道金属氧化物半导体（NMOS）差分对虚拟负电源电压和 NMOS尾电流晶体管由PMOS差分对虚拟正电源电压调制。 放大器的输出共模因此自校正为p型至n型晶体管强度差。

公开(公告)号：US08319548B2

公开(公告)日：2012-11-27

申请号：US12622277

申请日：2009-11-19

申请人： Ravindraraj Ramaraju ,  David R. Bearden ,  Kenneth R. Burch ,  Charles E. Seaberg ,  Hector Sanchez ,  Bradley J. Garni

发明人： Ravindraraj Ramaraju ,  David R. Bearden ,  Kenneth R. Burch ,  Charles E. Seaberg ,  Hector Sanchez ,  Bradley J. Garni

IPC分类号： G05F1/10

CPC分类号： G05F1/56 ,  G11C5/147

摘要： A voltage regulator regulates voltage at a node and has circuitry coupled to the node for providing a current to the node. A regulating transistor coupled between the node and a first power supply voltage terminal has a disabling transistor coupled in parallel and is selectively disabled by directly connecting the first power supply voltage terminal to the node. An inverting stage has an output connected to the regulating transistor. A load transistor has a first current electrode coupled to a second power supply voltage terminal, and a control electrode and second current electrode connected together and coupled to an input of the inverting stage. A sensing transistor has a first current electrode coupled to the second current electrode of the load transistor, a control electrode connected directly to the node and a second current electrode coupled to the first power supply voltage terminal.

摘要翻译： 电压调节器调节节点处的电压，并且具有耦合到节点的电路以向节点提供电流。 耦合在节点和第一电源电压端子之间的调节晶体管具有并联耦合的禁用晶体管，并且通过将第一电源电压端子直接连接到节点来选择性地禁止。 反相级具有连接到调节晶体管的输出端。 负载晶体管具有耦合到第二电源电压端子的第一电流电极和连接在一起并耦合到反相级的输入端的控制电极和第二电流电极。 感测晶体管具有耦合到负载晶体管的第二电流电极的第一电流电极，直接连接到节点的控制电极和耦合到第一电源电压端子的第二电流电极。

公开(公告)号：US08094769B2

公开(公告)日：2012-01-10

申请号：US12180166

申请日：2008-07-25

申请人： Gayathri A. Bhagavatheeswaran ,  Lipeng Cao ,  Hector Sanchez

发明人： Gayathri A. Bhagavatheeswaran ,  Lipeng Cao ,  Hector Sanchez

IPC分类号： H03D3/24

CPC分类号： H03L7/099 ,  H03L7/0891 ,  H03L2207/06

摘要： A phase-locked loop (PLL) system including a phase-frequency detector for generating an up signal or a down signal based on a phase difference between a reference clock and a feedback clock is provided. The PLL system further includes a phase-error spreading circuit for generating phase-spread pulses based on a relationship between a first time attribute of the up signal or the down signal and a second time attribute of the phase-spread pulses. The PLL system further includes a voltage-controlled oscillator (VCO) for generating a VCO clock based on the phase-spread pulses. The PLL system may also include a charge pump that generates a pumping signal based on the phase-spread pulses.

摘要翻译： 提供一种锁相环（PLL）系统，其包括用于基于参考时钟和反馈时钟之间的相位差产生上行信号或下降信号的相位频率检测器。 PLL系统还包括一个相位误差扩展电路，用于根据上升信号或下降信号的第一时间属性与相位扩展脉冲的第二时间属性之间的关系产生相位扩展脉冲。 PLL系统还包括用于基于相位扩展脉冲产生VCO时钟的压控振荡器（VCO）。 PLL系统还可以包括基于相位扩展脉冲产生泵浦信号的电荷泵。

公开(公告)号：US07816948B1

公开(公告)日：2010-10-19

申请号：US12481319

申请日：2009-06-09

申请人： Hector Sanchez

发明人： Hector Sanchez

IPC分类号： H03K19/0175

CPC分类号： H03K19/018507 ,  H03K3/037

摘要： A voltage translator having an input which receives an input signal and an output which provides a level shifted output signal includes a first inverter having an input coupled to receive the input signal, a second inverter having an input coupled to an output of the first inverter, a third inverter having an input coupled to an output of the second inverter, a fourth inverter having an input coupled to receive the input signal and an output coupled to an output of the third inverter, a fifth inverter having an input coupled to an output of the fourth inverter and having an output coupled to the input of the third inverter, and a sixth inverter having an input coupled to the output of the fifth inverter and an output coupled to the output of the voltage translator. The second and fourth inverters are coupled to a calibration voltage supply terminal.

摘要翻译： 具有接收输入信号的输入端和提供电平移位输出信号的输出的电压转换器包括具有耦合以接收输入信号的输入的第一反相器，具有耦合到第一反相器的输出的输入的第二反相器， 具有耦合到所述第二反相器的输出的输入的第三反相器，具有耦合以接收所述输入信号的输入和耦合到所述第三反相器的输出的输出的第四反相器，具有耦合到所述第三反相器的输出的输入的第五反相器 所述第四反相器具有耦合到所述第三反相器的输入的输出，以及第六反相器，具有耦合到所述第五反相器的输出的输入端和耦合到所述电压转换器的输出的输出。 第二和第四反相器耦合到校准电压提供端子。

公开(公告)号：US07176574B2

公开(公告)日：2007-02-13

申请号：US10946675

申请日：2004-09-22

申请人： Kathleen C. Yu ,  Kirk J. Strozewski ,  Janos Farkas ,  Hector Sanchez ,  Yeong-Jyh T. Lii

发明人： Kathleen C. Yu ,  Kirk J. Strozewski ,  Janos Farkas ,  Hector Sanchez ,  Yeong-Jyh T. Lii

IPC分类号： H01L23/52

CPC分类号： H01L23/5283 ,  H01L21/76807 ,  H01L21/76816 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A conductive line varies in thickness to assist in overcoming RC delays and noise coupling. By varying line thickness, variation in conductor width is avoided if necessary to maintain a specified minimum pitch between conductors while maintaining predetermined desired RC parameters and noise characteristics of the conductive line. Conductor depth variation is achieved by etching a dielectric layer to different thicknesses. A subsequent conductive fill over the dielectric layer and in the differing thicknesses results in a conductive line that varies in thickness. Different conductive line thicknesses available at a particular metal level can additionally be used for semiconductor structures other than a signal or a power supply conductive line, such as a contact, a via or an electrode of a device. The thickness analysis required to determine how interconnect thickness is varied in order to meet a desired design criteria may be automated and provided as a CAD tool.

摘要翻译： 导线的厚度变化，有助于克服RC延迟和噪声耦合。 通过改变线路厚度，如果需要在导体之间保持规定的最小间距，同时保持预定的期望的RC参数和导线的噪声特性，则避免导体宽度的变化。 通过将介电层蚀刻成不同的厚度来实现导体深度变化。 电介质层上的不同厚度的导电填充导致厚度变化的导线。 在特定金属水平可用的不同的导线厚度可以另外用于除信号或电源导线之外的半导体结构，例如器件的触点，通孔或电极。 为了满足期望的设计标准，确定互连厚度如何变化所需的厚度分析可以是自动化的并且作为CAD工具提供。

公开(公告)号：US20070001716A1

公开(公告)日：2007-01-04

申请号：US11169862

申请日：2005-06-29

申请人： Hector Sanchez ,  Xinghai Tang ,  Carlos Greaves ,  Jim Nissen

发明人： Hector Sanchez ,  Xinghai Tang ,  Carlos Greaves ,  Jim Nissen

IPC分类号： H03B1/00

CPC分类号： H03K19/00315 ,  H03K19/018585

摘要： A high speed output buffer including an input circuit providing first and second signals within a first voltage range having a first common mode voltage, an AC interface receiving the first and second signals and providing first and second preliminary drive signals, a detection and correction circuit that corrects a state of the first preliminary drive signal AC coupled to the first signal, first and second drive circuits receiving the preliminary drive signals and providing first and second drive signals, where the first drive circuit operates within a second voltage range having a greater common mode voltage and where the second drive circuit operates within a third voltage range, and an output that switches an output node within a voltage range that is greater than a maximum voltage range. The first, second and third voltage ranges are each within the maximum voltage range suitable for thin-gate devices.