Molding material comprising a thermotropic, aromatic polyester from
bis(carboxy phenoxy)diphenyl sulfone
    1.
    发明授权
    Molding material comprising a thermotropic, aromatic polyester from bis(carboxy phenoxy)diphenyl sulfone 失效
    包含来自双(羧基苯氧基)二苯基砜的热致芳香族聚酯的成型材料

    公开(公告)号:US4851496A

    公开(公告)日:1989-07-25

    申请号:US240517

    申请日:1988-09-06

    IPC分类号: C08G63/60 C08G63/688

    CPC分类号: C08G63/688 C08G63/605

    摘要: A molding material, comprising the following monomer units:(A) 10-80 mole % HO--AR--COOH,(B) 0-40 mole % HOOC--Ar'--COOH,(C) 10-45 mole % HO--Ar"--OH, and(D) 5-45 mole % ##STR1## wherein Ar, Ar', and Ar", independently, are 1,3- or 1,4-phenylene; 1,4-, 1,5-, 2,6- or 2,7-naphthylene or ##STR2## wherein X is --O--, --S--, --SO.sub.2 -- or --CR.sub.2 --, R is H or C.sub.1-4 alkyl, and n is 0 or 1, wherein all monomer unit quantities relate to the sum of components A-D and their sum is 100 mol %, and wherein the molar ratio (B+D):C ranges from about 0.9:1 to 11.1:1.

    摘要翻译: 一种成型材料,其包含以下单体单元:(A)10-80摩尔%HO-AR-COOH,(B)0-40摩尔%HOOC-Ar'-COOH,(C)10-45摩尔%HO-Ar '-OH和(D)5-45摩尔%其中Ar,Ar'和Ar“独立地为1,3-或1,4-亚苯基; 1,4-,1,5-,2,6-或2,7-亚萘基或其中X为-O - , - S - , - SO 2 - 或-CR 2 - ,R为H或C 1-4 烷基,n为0或1,其中所有单体单元量涉及组分AD的总和,其和为100摩尔%,其中摩尔比(B + D):C的范围为约0.9:1至11.1:1, 1。

    Molding composition consisting of aliphatic/aromatic copolyamide
    2.
    发明授权
    Molding composition consisting of aliphatic/aromatic copolyamide 失效
    由脂肪族/芳香族共聚酰胺组成的成型组合物

    公开(公告)号:US4864009A

    公开(公告)日:1989-09-05

    申请号:US250562

    申请日:1988-09-29

    CPC分类号: C08G69/42 C08G69/26

    摘要: A molding composition, comprising an aliphatic/aromatic copolyamide polymer having statistically distributed throughout the polymer:(A) from greater than 40 to less than 100 mole % aliphatic monomer units containing amino groups, carboxyl groups or mixtures thereof; and(B) up to 60 mole % of aromatic monomer units containing amino groups, carboxy groups or mixtures thereof, said aromatic monomer units containing at least one member selected from the group consisting of 4,4'-bis(4-aminophenoxy)diphenyl sulfone, 4,4'-bis(3-aminophenoxy)diphenyl sulfone, 4,4'-bis(4-aminophenoxy)benzophenone, and 4,4'-bis(3-aminophenoxy)benzophenone.

    摘要翻译: 一种模塑组合物,其包含在整个聚合物中统计分布的脂族/芳族共聚酰胺聚合物:(A)大于40至小于100摩尔%含有氨基,羧基或其混合物的脂族单体单元; 和(B)至多60摩尔%的含氨基,羧基或其混合物的芳族单体单元,所述芳族单体单元含有至少一种选自4,4'-双(4-氨基苯氧基)二苯基 砜,4,4'-双(3-氨基苯氧基)二苯砜,4,4'-双(4-氨基苯氧基)二苯甲酮和4,4'-双(3-氨基苯氧基)二苯甲酮。

    Moldable high molecular weight aromatic polyamide from poly arylene oxy
diamine
    3.
    发明授权
    Moldable high molecular weight aromatic polyamide from poly arylene oxy diamine 失效
    来自聚亚芳基氧二胺的可成型高分子量芳族聚酰胺

    公开(公告)号:US4843139A

    公开(公告)日:1989-06-27

    申请号:US205355

    申请日:1988-06-10

    IPC分类号: C08G69/32

    CPC分类号: C08G69/32

    摘要: A high molecular weight aromatic polyamide molding composition prepared by the polycondensation reaction of:(A) An aromatic diamine of the formula:H.sub.2 N--AR'--O--Ar"--CO--Ar"--O--Ar'--NH.sub.2wherein Ar' and Ar" are meta- or para-phenylene, and wherein up to 70 mole % of said aromatic diamine can be replaced by a second aromatic diamine having the formula:H.sub.2 N--Ar--((Z).sub.q --Ar).sub.r --NH.sub.2wherein Ar is meta- or para-phenylene, Z is identical or different radicals selected from the group consisting of --O--, --S--, --SO.sub.2 --, --CO--, and --C(CH.sub.3).sub.2 --, q is 0 or 1, and r is 0, 1 or 2, with(B) An aromatic dicarboxylic acid selected from the group consisting of:(i) isophthalic acid, wherein up to 60 mole % of said isophthalic acid may be replaced with terephthalic acid, wherein said isophthalic acid and said terephthalic acid may be ring substituted with one or more substituents selected from the group consisting of C.sub.1-6 alkyl, phenyl, alkyl or aryl substituted phenyl, C.sub.1-6 alkoxy, phenoxy, alkyl or aryl substituted phenoxy and halogen substituents;(ii) a dicarboxylic acid of the formula ##STR1## (iii) a dicarboxylic acid of the formula:HO.sub.2 C--Ar--(A--Ar).sub.p --CO.sub.2 Hwherein Ar is meta- or para-phenylene, A is --O--, --S--, --SO.sub.2 --, or --CO--, and p is 0 or 1; and mixtures thereof.

    摘要翻译: 通过以下缩聚反应制备的高分子量芳族聚酰胺模塑组合物:(A)下式的芳族二胺:H 2 N-AR'-O-Ar“-CO-Ar”-O-Ar'-NH 2,其中Ar '和Ar'是间 - 或对 - 亚苯基,并且其中至多70摩尔%的所述芳族二胺可以被具有下式的第二芳族二胺替代:H 2 N-Ar - ((Z)q -Ar)r- NH 2,其中Ar是间 - 或对 - 亚苯基,Z是相同或不同的选自-O - , - S - , - SO 2 - , - CO-和-C(CH 3)2 - 的基团,q是 0或1,并且r为0,1或2,其中(B)选自以下的芳族二羧酸:(i)间苯二甲酸,其中至多60摩尔%的所述间苯二甲酸可以被对苯二甲酸 其中所述间苯二甲酸和所述对苯二甲酸可以被一个或多个选自C 1-6烷基,苯基,烷基或芳基取代的苯基,C 1-6烷氧基,苯氧基,烷基或芳基取代的phe 羟基和卤素取代基; (ii)下式的二羧酸:(iii)下式的二羧酸:HO 2 C-Ar-(A-Ar)p-CO 2 H,其中Ar是间 - 或对 - 亚苯基,A是-O- -S-,-SO 2 - 或-CO-,p为0或1; 及其混合物。

    Molding materials, containing imide group-containing aromatic polyamides
and process for their preparation
    8.
    发明授权
    Molding materials, containing imide group-containing aromatic polyamides and process for their preparation 失效
    含有含酰亚胺基团的芳族聚酰胺的成型材料及其制备方法

    公开(公告)号:US4868272A

    公开(公告)日:1989-09-19

    申请号:US250610

    申请日:1988-09-29

    CPC分类号: C08G73/14 C08G69/32

    摘要: A molding material comprising an imide group-containing aromatic polyamide, obtained by polycondensation of(A) an aromatic diamine of the general formulaH.sub.2 N--Ar--O--Ar'--X--Ar'--O--Ar--NH.sub.2wherein Ar and Ar' are m- or p-phenylene groups and X is --SO.sub.2 -- or --CO--, with at least one aromatic dicarboxylic acid B) selected from the group consisting of(B1) a mixture comprising 40 to 100 mole % of an acid of the structure ##STR1## and 60 to 0 mole % of an acid of the structure ##STR2## in which n is 0-4 and R is selected from the group consisting of (a) an alkyl group having 1-6 carbon atoms,(b) an unsubstituted phenyl or an alkyl- or aryl substituted phenyl group,(c) an alkoxy group having 1-6 atoms,(d) a phenoxy group, in which the phenyl ring is unsubstituted or is alkyl- or aryl substituted, and(e) a halogen,(B2) an acid of the structure ##STR3## and (B3) a dicarboxylic acid of the formulaHO.sub.2 C--Ar--(A--Ar).sub.p --CO.sub.2 Hwherein Ar is m-phenylene or p-phenylene, A=--O--, --S--, --SO.sub.2 --, or --CO--, and p=0 or 1, and(C) an aromatic dicarboxylic acid anhydride of the formula ##STR4## in which R and n are as defined above.

    摘要翻译: 通过(A)通式为H 2 N-Ar-O-Ar'-X-Ar'-O-Ar-NH 2的芳族二胺缩聚得到的含酰亚胺基的芳族聚酰胺的成型材料,其中Ar和Ar' 是间 - 或对亚苯基,X是-SO 2 - 或-CO-,至少一种芳族二羧酸B)选自(B1)包含40-100mol%的 结构和60〜0摩尔%的结构的酸,其中n为0-4,R选自(a)具有1-6个碳原子的烷基,(b )未取代的苯基或烷基或芳基取代的苯基,(c)具有1-6个原子的烷氧基,(d)苯氧基,其中苯环是未取代的或者是烷基或芳基取代的,和( e)卤素,(B2)结构的酸和(B3)式HO2C-Ar-(A-Ar)p-CO2H的二羧酸,其中Ar是间亚苯基或对亚苯基,A = -O-,-S-,-SO 2 - 或-CO-,p = 0或1, 和(C)式“IMAGE”的芳族二羧酸酐,其中R和n如上所定义。

    Process for producing thermoplastically processable aromatic polyamide
with phosphorus catalyst
    9.
    发明授权
    Process for producing thermoplastically processable aromatic polyamide with phosphorus catalyst 失效
    用磷催化剂生产热塑性加工性芳族聚酰胺的方法

    公开(公告)号:US4749768A

    公开(公告)日:1988-06-07

    申请号:US14841

    申请日:1987-02-13

    IPC分类号: C08G69/32 C08G69/28

    CPC分类号: C08G69/32

    摘要: The invention relates to a process for producing aromatic polyamides by melt condensation of(i) aromatic diamines of the formulaH.sub.2 N--Ar'--X--Ar"--Y--Ar"--X--Ar--NH.sub.2where X=--O-- and Y=--SO.sub.2 -- or X=--SO.sub.2 -- and Y=--O-- and Ar' and Ar"=meta-, para-phenylene, which can be replaced up to 70 mole percent by an aromatic diamine of the formulaH.sub.2 N--Ar--((Z)q--Ar).sub.r --NH.sub.2where Ar=meta-- or para-phenylene; Z=--O--, --S--, --SO.sub.2 --, --CO--, or --C(CH.sub.3).sub.2 -- or mixtures thereof; q=0 or 1; r=0, 1 or 2 and of(ii) isophthalic acid, which can be replaced up to 60 mole % by terephthalic acid, while both acids can be substituted for by an acid with the formula ##STR1## or a dicarboxylic acid with the general formulaHO.sub.2 C--Ar--(A--Ar).sub.p --CO.sub.2 H,where A=--O--, --S--, --SO.sub.2 --, --CO-- or a single bond; and p=0 or 1; in the presence of triphenylphosphite or an acid with the formula H.sub.3 PO.sub.n, where n=2, 3 or 4. The invention further relates to the aromatic polyamides produced by this process.

    摘要翻译: 本发明涉及通过(i)式IIN-Ar'-X-Ar“-Y-Ar”-X-Ar-NH2的芳族二胺的熔融缩合制备芳族聚酰胺的方法,其中X = -O- 和Y = -SO 2 - 或X = -SO 2 - 且Y = -O-,Ar'和Ar“=间 - 对 - 亚苯基,其可以被式H2N的芳族二胺替代为70摩尔% -Ar - ((Z)q-Ar)r-NH 2,其中Ar =间 - 或对 - 亚苯基; Z = -O-,-S-,-SO 2 - , - CO-或-C(CH 3)2 - 或其混合物; q = 0或1; r = 0,1或2,和(ii)间苯二甲酸,其可以通过对苯二甲酸替代为60摩尔%,而两种酸都可以被式(ⅩⅢ)的酸或二羧酸与 通式HO 2 C-Ar-(A-Ar)p-CO 2 H,其中A = -O-,-S-,-SO 2 - , - CO-或单键; 和p = 0或1; 在亚磷酸三苯酯或具有式H 3 PO n的酸的存在下,其中n = 2,3或4.本发明还涉及通过该方法制备的芳族聚酰胺。