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1.发明授权Techniques for distributing power in electronic circuits and computer systems 失效在电子电路和计算机系统中分配电力的技术公开(公告)号：US07698114B2
公开(公告)日：2010-04-13
申请号：US11264968
申请日：2005-11-02
申请人： Hendrik F. Hamann , James A. Lacey , Jamil Wakil , Alan J. Weger
发明人： Hendrik F. Hamann , James A. Lacey , Jamil Wakil , Alan J. Weger
CPC分类号： G01K7/42 , G01K7/425 , G01K2215/00
摘要： Techniques for enhancing thermal design of a system having a number of boundary values are provided. A method for such enhancement includes representing thermal response of the system to the boundary values, obtaining at least one constraining parameter, and determining spatial and/or temporal distribution of the boundary values. The thermal response is represented as a superposition of temperature fields associated with given boundary values. The spatial and/or temporal distribution of the boundary values is determined based on the thermal response represented in the representing step, so as to satisfy the constraining parameter. The boundary values can be, for example, power sources, and the at least one constraining parameter can be, for example, a spatial or temporal location of one of the power sources.
摘要翻译： 提供了一种用于增强具有多个边界值的系统的热设计的技术。 用于这种增强的方法包括表示系统对边界值的热响应，获得至少一个约束参数，以及确定边界值的空间和/或时间分布。 热响应表示为与给定边界值相关联的温度场的叠加。 基于代表步骤中表示的热响应来确定边界值的空间和/或时间分布，以满足约束参数。 边界值可以是例如电源，并且至少一个约束参数可以是例如电源之一的空间或时间位置。
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2.发明授权公开(公告)号：US07167806B2
公开(公告)日：2007-01-23
申请号：US10919692
申请日：2004-08-17
申请人： Hendrik F. Hamann , James A. Lacey , Martin P. O'Boyle , Robert J. von Gutfeld , Jamil A. Wakil , Alan J. Weger
发明人： Hendrik F. Hamann , James A. Lacey , Martin P. O'Boyle , Robert J. von Gutfeld , Jamil A. Wakil , Alan J. Weger
IPC分类号： G06F15/00
CPC分类号： H01L22/34 , H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： A present invention provides real-time temperature and power mapping of fully operating electronic devices. The method utilizes infrared (IR) temperature imaging, while an IR-transparent coolant flows through a specially designed cell directly over the electronic device. In order to determine the chip power distributions the individual temperature fields for each heat source of a given power and size on the chip (as realized by a scanning focused laser beam) are measured under the same cooling conditions. Then the measured chip temperature distribution is represented as a superposition of the temperature fields of these individual heat sources and the corresponding power distribution is calculated with a set of linear equations.
摘要翻译： 本发明提供了完全操作的电子设备的实时温度和功率映射。 该方法利用红外（IR）温度成像，而IR透明冷却剂直接通过电子设备流经专门设计的单元。 为了确定芯片功率分布，在相同的冷却条件下测量芯片上给定功率和尺寸（通过扫描聚焦激光束实现）的每个热源的各个温度场。 然后，测量的芯片温度分布被表示为这些单个热源的温度场的叠加，并且用一组线性方程计算相应的功率分布。
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公开(公告)号：US08173965B2
公开(公告)日：2012-05-08
申请号：US11519393
申请日：2006-09-12
IPC分类号： G01J5/02
CPC分类号： G01Q60/22
摘要： A high resolution material observation system includes an object having at least one spatial dimension sufficient to support production of near-field infrared emissions, a holder adapted to receive a sample to be observed, the holder further adapted to position the sample in the near-field infrared emissions, and a thermal excitation unit, adapted to be thermally coupled to at least one of the object and the sample. The thermal excitation unit is further adapted to causing black body radiation in either the object or the sample within the infrared spectrum.
摘要翻译： 高分辨率材料观察系统包括具有足以支持近场红外发射的产生的至少一个空间尺寸的物体，适于接收待观察的样品的保持器，所述保持器还适于将样品定位在近场 红外发射和热激发单元，适于热耦合到物体和样品中的至少一个。 热激发单元还适于在红外光谱内的物体或样品中引起黑体辐射。
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公开(公告)号：US08636406B2
公开(公告)日：2014-01-28
申请号：US13445641
申请日：2012-04-12
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： An apparatus determines cooling characteristics of an operational cooling device used for transferring heat from an electronic device. The operational cooling device is thermally coupled to a heat pipe. The heat pipe has an exposed surface for selective application of heat thereon. Heat from a localized heat source is selectively applied to at least one region of the exposed surface. The heat source is preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the heat from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the operational cooling device.
摘要翻译： 设备确定用于从电子设备传送热量的操作冷却装置的冷却特性。 操作冷却装置热耦合到热管。 热管具有用于选择性地在其上施加热量的暴露表面。 来自局部热源的热量被选择性地施加到暴露表面的至少一个区域。 热源优选能够相对于暴露的表面和热强度在位置上都变化。 优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与来自局部热源的热隔离。 当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。 然后将温度分布用于热操作冷却装置的特征。
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公开(公告)号：US08029186B2
公开(公告)日：2011-10-04
申请号：US10982575
申请日：2004-11-05
IPC分类号： G01K3/00
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.
摘要翻译： 所公开的是用于确定用于从电子设备传递热量的冷却装置的冷却特性的装置。 该装置包括热耦合到热管的冷却装置。 该热管具有用于选择性地在其上施加热量的暴露表面。 选择性地将局部热源施加到暴露表面的至少一个区域。 热源优选地能够相对于暴露的表面和热强度都在位置上变化。 优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与局部热源隔离。 当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。 然后使用温度分布来热定形冷却装置。
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公开(公告)号：US07366632B2
公开(公告)日：2008-04-29
申请号：US11195426
申请日：2005-08-02
申请人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
IPC分类号： G01K1/06
CPC分类号： G01K1/026 , G01K2213/00
摘要： An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.
摘要翻译： 公开了一种用于在操作期间测量数据中心的物理量的装置和方法以及用于维护大规模计算系统的方法。 该装置包括支撑多个传感器的推车。 购物车可在数据中心内移动。 传感器捕获房间内的温度或其他物理参数。 传感器读数以及与推车相关的位置和方向信息被传送到计算机系统，在该系统中分析数据以选择数据中心的最佳温度或其他系统环境参数。
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公开(公告)号：US20080087825A1
公开(公告)日：2008-04-17
申请号：US11519393
申请日：2006-09-12
IPC分类号： G01J5/02
CPC分类号： G01Q60/22
摘要： A high resolution material observation system includes an object having at least one spatial dimension sufficient to support production of near-field infrared emissions, a holder adapted to receive a sample to be observed, the holder further adapted to position the sample in the near-field infrared emissions, and a thermal excitation unit, adapted to be thermally coupled to at least one of the object and the sample. The thermal excitation unit is further adapted to causing black body radiation in either the object or the sample within the infrared spectrum.
摘要翻译： 高分辨率材料观察系统包括具有足以支持近场红外发射的产生的至少一个空间尺寸的物体，适于接收待观察的样品的保持器，所述保持器还适于将样品定位在近场 红外发射和热激发单元，适于热耦合到物体和样品中的至少一个。 热激发单元还适于在红外光谱内的物体或样品中引起黑体辐射。
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公开(公告)号：US08038343B2
公开(公告)日：2011-10-18
申请号：US12048635
申请日：2008-03-14
IPC分类号： G01K3/00
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： A novel computer program product and method for thermally characterizing a device used for cooling an electronic device is disclosed. A cooling device, being operated, is thermally coupled to a heat pipe having a surface to receive a test chip. A heater is patterned on a circuitry side of the test chip. The heater is separate from operational circuitry of the test chip. A localized heat source is applied to at least one region on a test chip thermally coupled to the heat pipe to locally heat more than one region on a second surface of the test chip to test more than one hot spot. The second surface is the circuitry side of the test chip. The heater provides a bias heat to the test chip, independent of operating the test chip, while the localized heat source is selectively applied directly to the test chip. A temperature detector is used to measure a temperature distribution on the second surface of the test chip. The temperature distribution is used to thermally characterize said cooling device during operation.
摘要翻译： 公开了一种用于热表征用于冷却电子设备的设备的新颖的计算机程序产品和方法。 被操作的冷却装置热耦合到具有接收测试芯片的表面的热管。 加热器在测试芯片的电路侧进行图案化。 加热器与测试芯片的操作电路分开。 将局部热源施加到热耦合到热管的测试芯片上的至少一个区域，以局部加热测试芯片的第二表面上的多于一个区域，以测试多于一个热点。 第二个表面是测试芯片的电路侧。 加热器对测试芯片提供偏置热量，与操作测试芯片无关，同时局部热源被选择性地直接应用于测试芯片。 温度检测器用于测量测试芯片第二表面上的温度分布。 温度分布用于在操作期间热定形所述冷却装置。
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9.发明授权公开(公告)号：US07739073B2
公开(公告)日：2010-06-15
申请号：US12110732
申请日：2008-04-28
申请人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
CPC分类号： G01K1/026 , G01K2213/00
摘要： An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.
摘要翻译： 公开了一种用于在操作期间测量数据中心的物理量的装置和方法以及用于维护大规模计算系统的方法。 该装置包括支撑多个传感器的推车。 购物车可在数据中心内移动。 传感器捕获房间内的温度或其他物理参数。 传感器读数以及与推车相关的位置和方向信息被传送到计算机系统，在该系统中分析数据以选择数据中心的最佳温度或其他系统环境参数。
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公开(公告)号：US20100046574A1
公开(公告)日：2010-02-25
申请号：US12611519
申请日：2009-11-03
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.
摘要翻译： 所公开的是用于确定用于从电子设备传递热量的冷却装置的冷却特性的装置。 该装置包括热耦合到热管的冷却装置。 该热管具有用于选择性地在其上施加热量的暴露表面。 选择性地将局部热源施加到暴露表面的至少一个区域。 热源优选地能够相对于暴露的表面和热强度都在位置上变化。 优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与局部热源隔离。 当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。 然后使用温度分布来热定形冷却装置。
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