公开(公告)号：US5302266A

公开(公告)日：1994-04-12

申请号：US951924

申请日：1992-09-25

申请人： Henry J. Grabarz ,  Alfred Grill ,  William M. Holber ,  Joseph S. Logan ,  James T. C. Yeh

发明人： Henry J. Grabarz ,  Alfred Grill ,  William M. Holber ,  Joseph S. Logan ,  James T. C. Yeh

IPC分类号： C23C14/34 ,  C23C14/04 ,  C23C14/32 ,  C23C14/35 ,  H01J37/32 ,  H01L21/285 ,  H01L21/768 ,  H05H1/18

CPC分类号： C23C14/046 ,  C23C14/32 ,  C23C14/357 ,  H01J37/32009 ,  H01J37/32623 ,  H01J37/32678 ,  H01L21/76877 ,  H01J2237/3327

摘要： An electron cyclotron resonance plasma heating apparatus system and process in which microwave energy is transmitted directly in an axial direction through an evacuated chamber to generate energetic electrons. These energetic electrons spiral around the magnetic field lines formed by the solenoid and spiral substantially parallel to the axis. A metal atom vapor source transmits the metal atom vapor into the chamber through a housing port in the chamber wall. The metal atom vapor source in the housing is out of the line of sight of the substrate. The metal atoms are ionized by the energized electrons, and these ionized metal atoms are confined to the plasma column substantially free of neutral atoms as such ionized metal approaches and contacts the substrate in said evacuated chamber. In this way, the ionized metal atoms substantially avoid contact with the wall of chamber. A sputter target of a second metal may be placed in the plane of the substrate and a bias voltage applied to the target. Atoms of the second metal are then sputtered off and ionized by the plasma and are deposited on the substrate with the first metal ions.

摘要翻译： 电子回旋共振等离子体加热装置系统和微波能量通过真空室沿轴向直接传递以产生高能电子的过程。 这些高能电子围绕由螺线管形成的磁场线与螺旋线基本平行。 金属原子蒸汽源通过室壁中的壳体端口将金属原子蒸气传输到室中。 壳体中的金属原子蒸汽源不在衬底的视线之内。 金属原子被激发电子电离，这些离子化的金属原子被限制在基本上不含中性原子的等离子体柱上，因为这样的电离金属靠近并接触所述真空室中的衬底。 以这种方式，电离金属原子基本上避免与室的壁接触。 可以将第二金属的溅射靶放置在基板的平面中，并将偏置电压施加到靶。 然后将第二金属的原子溅射并通过等离子体离子化，并用第一金属离子沉积在基底上。

公开(公告)号：US06773570B2

公开(公告)日：2004-08-10

申请号：US10294200

申请日：2002-11-14

申请人： Laertis Economikos ,  Hariklia Deligianni ,  John M. Cotte ,  Henry J. Grabarz ,  Bomy Chen

发明人： Laertis Economikos ,  Hariklia Deligianni ,  John M. Cotte ,  Henry J. Grabarz ,  Bomy Chen

IPC分类号： C25D522

CPC分类号： C25D7/123 ,  C25D5/48 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/32125 ,  H01L21/7684 ,  Y10S205/917

摘要： A method and apparatus are described for performing both electroplating of a metal layer and planarization of the layer on a substrate. Electroplating and electroetching of metal (such as copper) are performed in a repeated sequence, followed by chemical-mechanical polishing. An electroplating solution, electroetching solution, and a non-abrasive slurry are dispensed on a polishing pad in the respective process steps. The substrate is held against the pad with a variable force in accordance with the process, so that the spacing between substrate and pad may be less during electroplating than during electroetching.

摘要翻译： 描述了用于执行金属层的电镀和在衬底上的层的平坦化的方法和装置。 以重复的顺序进行金属（如铜）的电镀和电蚀刻，然后进行化学机械抛光。 电镀溶液，电蚀溶液和非研磨浆料在相应的工艺步骤中分配在抛光垫上。 根据该工艺，衬底以可变的力保持抵靠衬垫，使得电镀期间衬底和衬垫之间的间隔可能比在电蚀期间更小。