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公开(公告)号：US5341162A
公开(公告)日：1994-08-23
申请号：US933560
申请日：1992-08-24
申请人： Herman A. Hermanson , Donald J. Drake , Ivan Rezanka , Robert S. Karz , Roger G. Teumer , Robert P. Altavela
发明人： Herman A. Hermanson , Donald J. Drake , Ivan Rezanka , Robert S. Karz , Roger G. Teumer , Robert P. Altavela
摘要： Disclosed is an apparatus for degassing a liquid, comprising: a liquid supply and an outlet communicating with the liquid supply via a flow path; a degassing tank, disposed in the flow path between the liquid supply and the outlet, the degassing tank incorporating a gas-permeable vent; a means for moving the liquid along the flow path; and a heater, disposed in the flow path between the degassing tank and the outlet, for heating the liquid and thereby removing gas therefrom. The apparatus is particularly suited to the ink supply system of a thermal ink jet printer where the removal of gases dissolved in the ink improves print quality.
摘要翻译： 公开了一种用于对液体进行脱气的设备，包括：液体供应源和经由流路与液体供应连通的出口; 设置在液体供应和出口之间的流动路径中的脱气罐，排气罐结合有透气孔; 用于沿着流动路径移动液体的装置; 以及设置在脱气罐和出口之间的流路中的加热器，用于加热液体，从而从中除去气体。 该设备特别适用于热喷墨打印机的墨水供应系统，其中溶解在墨水中的气体的去除改善了打印质量。
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公开(公告)号：US3988060A
公开(公告)日：1976-10-26
申请号：US476186
申请日：1974-06-04
CPC分类号： G03G17/04
摘要： A system for separating one surface, preferably a web, from another surface to enable a bead of accumulated material built up at the line of contact between the two surfaces to pass therebetween. During the separation period, the advancing velocity of at least one surface is reduced so that at least one surface is advanced at a slower rate than its rate prior to separation, or stopped. In a preferred embodiment, the system is employed in photoelectrophoretic imaging to bypass a bead of imaging suspension built up at the imaging nip during separation of two webs immediately after completion of imaging to thereby permit dissipation or passage of the liquid bead. During the separation period, the surface, preferably a web, which does not carry the desired image, is advanced at a slower rate than its prior rate and slower than the other surface, or stopped.
摘要翻译： 一种用于将一个表面，优选腹板从另一个表面分离的系统，以使得能够在两个表面之间的接触线处形成的累积材料的胎圈通过。 在分离期间，减少至少一个表面的推进速度，使得至少一个表面以比其分离之前的速率更慢的速度前进，或停止。 在一个优选实施例中，该系统被用于光电泳成像以在成像完成之后立即分离两个网络，绕过在成像压区处建立的成像悬架的珠粒，从而允许液珠的耗散或通过。 在分离期间，不携带所需图像的表面，优选地，纸幅以比其先前的速率慢并且比另一表面慢的速度前进，或停止。
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3.发明授权Overlapping chip replaceable subunits, methods of making same, and methods of making RIS or ROS array bars incorporating these subunits 失效重叠芯片可替换亚基，制备方法，以及制备融合这些亚基的RIS或ROS阵列的方法
公开(公告)号：US5097274A
公开(公告)日：1992-03-17
申请号：US732540
申请日：1991-07-19
CPC分类号： B41J2/1604 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1632 , B41J2/34
摘要： Overlapping chip replaceable subunits for RIS or ROS array bars are disclosed. The subunits include a planar semiconductive substrate having at least one component and supporting circuitry on a surface thereof. The semiconductive substrate has first and second side edges, a front edge and a width equal to a distance between the first and second side edges. The planar semiconductive substrate is mounted on a planar support which can be, for example, a daughterboard/heat sink assembly having at least one electrode having a terminal at one end thereof. The planar support also has first and second side edges, a front edge and a width equal to a distance between the first and second side edges. The width of the support is less than the width of the semiconductive substrate so that the first and second side edges of the planar semiconductive substrate extend outwardly beyond the first and second side edges, respectively, of the support. The structure of the present invention enables extended arrays of subunits to be accurately placed on one surface of a substrate, while permitting individual subunits to be removed from the substrate easily and without damaging adjacent subunits or their electrical connections to the host machine.
摘要翻译： 公开了用于RIS或ROS阵列的重叠芯片可替换子单元。 该子单元包括在其表面上具有至少一个部件和支撑电路的平面半导体基板。 半导体衬底具有第一和第二侧边缘，前边缘和宽度等于第一和第二侧边缘之间的距离。 平面半导体基板安装在平面支撑件上，该平面支撑件可以是例如具有在其一端具有端子的至少一个电极的子板/散热器组件。 平面支撑件还具有第一和第二侧边缘，前边缘和宽度等于第一和第二侧边缘之间的距离。 支撑件的宽度小于半导体基板的宽度，使得平面半导体基板的第一和第二侧边缘分别向外延伸超过支撑件的第一和第二侧边缘。 本发明的结构使得能够将扩展的亚基阵列精确地放置在基底的一个表面上，同时允许单独的亚单元从基底中轻松地移除而不会损坏相邻的子单元或者它们与主机的电连接。
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4.发明授权
公开(公告)号：US5079189A
公开(公告)日：1992-01-07
申请号：US539340
申请日：1990-06-18
CPC分类号： B41J2/1623 , B41J2/1604 , B41J2/1628 , B41J2/1631 , B41J2/1632 , B41J2/34 , Y10S438/975
摘要： Overlapping chip replaceable subunits for RIS or ROS array bars are disclosed. The subunits include a planar semiconductive substrate having at least one component and supporting circuitry on a surface thereof. The semiconductive substrate has first and second side edges, a front edge and a width equal to a distance between the first and second side edges. The planar semiconductive substrate is mounted on a planar support which can be, for example, a daughterboard/heat sink assembly having at least one electrode having a terminal at one end thereof. The planar support also has first and second side edges, a front edge and a width equal to a distance between the first and second side edges. The width of the support is less than the width of the semiconductive substrate so that the first and second side edges of the planar semiconductive substrate extend outwardly beyond the first and second side edges, respectively, of the support. The structure of the present invention enables extended arrays of subunits to be accurately placed on one surface of a substrate, while permitting individual subunits to be removed from the substrate easily and without damaging adjacent subunits or their electrical connections to the host machine.
摘要翻译： 公开了用于RIS或ROS阵列的重叠芯片可替换子单元。 该子单元包括在其表面上具有至少一个部件和支撑电路的平面半导体基板。 半导体衬底具有第一和第二侧边缘，前边缘和宽度等于第一和第二侧边缘之间的距离。 平面半导体基板安装在平面支撑件上，该平面支撑件可以是例如具有在其一端具有端子的至少一个电极的子板/散热器组件。 平面支撑件还具有第一和第二侧边缘，前边缘和宽度等于第一和第二侧边缘之间的距离。 支撑件的宽度小于半导体基板的宽度，使得平面半导体基板的第一和第二侧边缘分别向外延伸超过支撑件的第一和第二侧边缘。 本发明的结构使得能够将扩展的亚基阵列精确地放置在基底的一个表面上，同时允许单独的亚单元从基底中轻松地移除而不会损坏相邻的子单元或者它们与主机的电连接。
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5.发明授权
公开(公告)号：US3957510A
公开(公告)日：1976-05-18
申请号：US465644
申请日：1974-04-30
申请人： Herman A. Hermanson
发明人： Herman A. Hermanson
IPC分类号： G03G17/04
CPC分类号： G03G17/04
摘要： Method and apparatus for preventing the overflow of liquid from between flexible layers on a solid surface. A groove is provided in the solid surface at a location not beyond the edge of at least the bottom flexible layer and preferably not beyond the edge of both flexible layers, to reduce, at the groove, the mechanical pressure (and optionally electrical pressure) forcing the flexible layers together to permit a liquid bead to form at layer portions adjacent the groove instead of having the liquid squeezed out and off the edge of both flexible layers.In a preferred embodiment, this system is used in photoelectrophoretic imaging using photoelectrophoretic suspension between webs having an electrical field thereacross, on a grooved curved surface, preferably a roller. The suspension is prevented from dripping out the edges of the webs which, inter alia, prevents the ink from seeping back along the web/roller interface which may adversely effect imaging.
摘要翻译： 用于防止液体从固体表面上的柔性层之间溢出的方法和装置。 在不超过至少底部柔性层的边缘的位置处的固体表面中设置凹槽，优选地不超过两个柔性层的边缘，以在凹槽处减小机械压力（和任选的电压）强迫 柔性层在一起以允许在与槽相邻的层部分处形成液体珠，而不是使液体从两个柔性层的边缘挤出和离开。
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公开(公告)号：US5665249A
公开(公告)日：1997-09-09
申请号：US330146
申请日：1994-10-17
申请人： Cathie J. Burke , William G. Hawkins , Herman A. Hermanson , Michael C. Ferringer , Almon P. Fisher , Diane Atkinson
发明人： Cathie J. Burke , William G. Hawkins , Herman A. Hermanson , Michael C. Ferringer , Almon P. Fisher , Diane Atkinson
CPC分类号： B41J2/1623 , B24B37/04 , B41J2/1604 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2/1635 , B41J2/1642 , B41J2/1645 , B41J2202/03 , Y10T29/49401
摘要： An improved microelectromechanical device, such as a thermal ink jet die or printhead, is formed by the alignment of two planar substrates bonded together by an intermediate thick film layer of patterned polymeric material, such as polyimide. The improved device has a fully cured, patterned thick film layer which is planarized by chemical-mechanical polishing-to improve the bonding strength between the substrates. The planarization removes topographical formations generated during the deposition of the thick film layer and/or during the patterning of the recesses therein.
摘要翻译： 通过由诸如聚酰亚胺的图案化聚合物材料的中间厚膜层粘合在一起的两个平面基板的对准来形成改进的微电子机械装置，例如热喷墨模头或打印头。 改进的装置具有完全固化的图案化的厚膜层，其通过化学机械抛光进行平面化，以提高基板之间的结合强度。 平坦化消除了在沉积厚膜层期间和/或在其中凹陷图案化期间产生的形貌结构。
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公开(公告)号：US5333007A
公开(公告)日：1994-07-26
申请号：US116816
申请日：1993-08-11
CPC分类号： B41J2/16508 , Y10T29/49401
摘要： A printhead with a printhead die, an ink manifold and heat sink substrate has a continuous sealing surface surrounding the printhead die which is formed by the ink manifold, heat sink substrate and filler material disposed therebetween. The filler material acts as caulking to eliminate gaps around the printhead die, particularly between the ink manifold and heat sink substrate, and to provide a smooth surface for abutment with a capping member. A fluid-tight seal is obtained between the capping member and the continuous sealing surface on the printhead, thus preventing the drying out of ink in the nozzles through evaporation of volatile ink components. In some priming nozzle configurations, the leaktight seal also facilitates priming of the printhead.
摘要翻译： 具有打印头芯片，墨水歧管和散热器基板的打印头具有围绕打印头芯片的连续密封表面，该密封表面由墨水歧管，散热基板和设置在其间的填充材料形成。 填充材料用作填缝以消除打印头芯片周围的间隙，特别是在墨水歧管和散热器基板之间，并且提供用于与封盖构件邻接的光滑表面。 在封盖构件和打印头上的连续密封表面之间获得流体密封，从而通过挥发性油墨组分的蒸发来防止喷嘴中的油墨干燥。 在一些起动喷嘴构造中，密封密封件还有助于打印头的启动。
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公开(公告)号：US4049343A
公开(公告)日：1977-09-20
申请号：US571174
申请日：1975-04-24
申请人： Herman A. Hermanson
发明人： Herman A. Hermanson
CPC分类号： G03G17/04
摘要： An imaging or transfer roller comprising mechanism to couple the roller to a ground potential close to the imaging or transfer zone, is provided. The roller includes insulator members concentric with the roller shaft and conductive sleeves on the ends of the roller.
摘要翻译： 提供了一种包括将辊连接到靠近成像或转移区的地电位的机构的成像或转印辊。 辊子包括与辊轴同心的绝缘体构件和辊的端部上的导电套筒。
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公开(公告)号：US5581284A
公开(公告)日：1996-12-03
申请号：US344913
申请日：1994-11-25
申请人： Herman A. Hermanson
发明人： Herman A. Hermanson
CPC分类号： B41J2/2139 , B41J2/04505 , B41J2/0458 , B41J2/155 , B41J2/16579 , B41J2/2132 , G06K15/102 , B41J2202/20 , G06K2215/0082 , G06K2215/0094
摘要： A method of extending the useful life of a printbar for black ink in a multi-color printbar, full width array color ink jet printer by checking each nozzle in the printbar for droplet ejection; identifying any nozzle which fails to eject a droplet as a problem nozzle, and substituting at least one droplet from a nozzle in another printbar having a different color of ink. The substitute fill-in with a cyan droplet, cyan and magenta droplets, or cyan, magenta, and yellow droplets for process black prevents a missing spot and provides adequate printing quality for black printing, such as, for text, so that immediate printbar replacement is avoided, thereby extending the printbar life.
摘要翻译： 一种通过检查打印棒中的每个喷嘴以进行液滴喷射来延长多色印刷条，全宽阵列彩色喷墨打印机中的黑色墨水的打印条的使用寿命的方法; 识别不能喷射液滴作为问题喷嘴的任何喷嘴，并且在具有不同颜色墨水的另一个印刷条中从喷嘴中取代至少一个液滴。 用于处理黑色的青色液滴，青色和品红色液滴或青色，品红色和黄色液滴的替代品填充可防止缺失点，并为黑色打印（例如文本）提供足够的打印质量，以便立即打印更换 从而延长打印纸的使用寿命。
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公开(公告)号：US5545283A
公开(公告)日：1996-08-13
申请号：US385234
申请日：1995-02-08
CPC分类号： H01L21/67144 , B29C43/32
摘要： An apparatus and method for bonding wafer pairs. The apparatus includes a heated platen surrounded by a pressurization vessel. The heated platen includes channels connected to a hole which runs through the heated platen. Wafer pairs are placed on the top surface of the platen, a rubber mat is placed over the top of the wafer pairs, and a vacuum is drawn through the hole and the channels. The rubber mat compresses the wafer pairs. The platen is heated for the bonding process. The pressurization chamber is pressurized supplying additional bonding pressure to the wafer pair. Once sufficiently heated, the heated platen is liquid cooled completing the bonding process.
摘要翻译： 一种用于接合晶片对的装置和方法。 该装置包括被加压容器包围的加热台。 加热的压板包括连接到穿过加热压板的孔的通道。 晶片对放置在压板的顶表面上，橡胶垫放置在晶片对的顶部上，并且通过孔和通道抽取真空。 橡胶垫压缩晶圆对。 加热压板以进行粘合工艺。 加压室被加压，为晶片对提供附加的结合压力。 一旦被充分加热，加热的压板是完成粘合过程的液体冷却。
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