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1.发明授权Digital measuring system and method for integrated circuit chip operating parameters 有权数字测量系统及其集成电路芯片工作参数的方法公开(公告)号：US07813815B2
公开(公告)日：2010-10-12
申请号：US11557745
申请日：2006-11-08
CPC分类号： G01K1/028 , G01K7/42 , G01K2219/00
摘要： An integrated circuit contains within the chip one or more measuring devices that provide a digital value corresponding to respective physical operating parameters of the chip. The digital values can be communicated to other devices using an interrupt handler.
摘要翻译： 集成电路在芯片内包含一个或多个测量装置，其提供对应于芯片的相应物理操作参数的数字值。 数字值可以使用中断处理程序传送到其他设备。
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2.发明授权Digital measuring system and method for integrated circuit chip operating parameters 失效数字测量系统及其集成电路芯片工作参数的方法公开(公告)号：US07168853B2
公开(公告)日：2007-01-30
申请号：US10339992
申请日：2003-01-10
申请人： Herschel Ainspan , Philip G. Emma , Rick A. Rand , Arthur Zingher
发明人： Herschel Ainspan , Philip G. Emma , Rick A. Rand , Arthur Zingher
CPC分类号： G01K1/028 , G01K7/42 , G01K2219/00
摘要： This invention relates to digitally measuring operating parameters, for example, temperature, within a semiconductor chip and making those measurements internally available to hardware, firmware, and software.
摘要翻译： 本发明涉及数字测量半导体芯片内的操作参数，例如温度，并且使这些测量在内部可用于硬件，固件和软件。
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公开(公告)号：US20090315168A1
公开(公告)日：2009-12-24
申请号：US12543104
申请日：2009-08-18
CPC分类号： H05K3/325 , H05K2201/0314 , H05K2201/10545 , H05K2201/10719 , H05K2201/2018
摘要： A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
摘要翻译： 提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。 芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。 该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。
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公开(公告)号：US20080054430A1
公开(公告)日：2008-03-06
申请号：US11511815
申请日：2006-08-29
IPC分类号： H01L23/02
CPC分类号： H05K3/325 , H05K2201/0314 , H05K2201/10545 , H05K2201/10719 , H05K2201/2018
摘要： A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
摘要翻译： 提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。 芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。 该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。
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公开(公告)号：US08278745B2
公开(公告)日：2012-10-02
申请号：US12543104
申请日：2009-08-18
IPC分类号： H01L23/52
CPC分类号： H05K3/325 , H05K2201/0314 , H05K2201/10545 , H05K2201/10719 , H05K2201/2018
摘要： A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
摘要翻译： 提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。 芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。 该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。
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公开(公告)号：US08174106B2
公开(公告)日：2012-05-08
申请号：US11511815
申请日：2006-08-29
IPC分类号： H01L23/02
CPC分类号： H05K3/325 , H05K2201/0314 , H05K2201/10545 , H05K2201/10719 , H05K2201/2018
摘要： A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
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公开(公告)号：US4920429A
公开(公告)日：1990-04-24
申请号：US301622
申请日：1989-01-24
申请人： Robert S. Jaffe , Mark A. Lavin , Rick A. Rand , Paul Schreiner
发明人： Robert S. Jaffe , Mark A. Lavin , Rick A. Rand , Paul Schreiner
CPC分类号： H04N5/2353
摘要： A scanning imager is described which includes a line camera and a table to mechanically present successive regions of an item to be imaged. The time of exposure of the camera for each successive region presented is controlled by encoding strips connected to the table. Thus, if the table is subjected to motion variations, the encoding strips are likewise affected and vary the exposure time for each analog image pixel scan. To compensate, an exposure correction system is provided which includes an analog voltage generator whose output is related to each successive region exposure time. An A to D conversion circuit is responsive to the analog voltage to normalize the analog image value from the camera so that, in effect, equal exposure images result.
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