Film-forming method and metal material
    4.
    发明授权
    Film-forming method and metal material 失效
    成膜方法和金属材料

    公开(公告)号:US06238541B1

    公开(公告)日:2001-05-29

    申请号:US09232644

    申请日:1999-01-19

    IPC分类号: C25D534

    摘要: A method is provided for forming a film having excellent anticorrosion properties on a metal surface without producing sludge, and without using phosphorus or chromium. In this method, the following steps (a)-(c) are performed on a metal material: (a) degreasing, (b-1) pretreatment if necessary, and (c) which comprises the following steps (c-1) or (c-2). The film-forming step (c-1) is a step for forming a film by bringing the metal material in contact with an aqueous solution comprising at least one of the following compositions (A), (B), (C) or (D): (A) is a monomer comprising a sulfonium group at one end of the molecule. (B) is a water-soluble polymer obtained by homopolymerization or copolymerization of the monomer (A). (C) is an emulsion or water-soluble polymer comprising a sulfonium group obtained by copolymerization of the monomer (A) and a radical-polymerizable unsaturated monomer excluding the monomer (A). (D) is a composite emulsion comprising a sulfonium group wherein inorganic particle core are coated by a layer comprising a copolymer of the aforesaid monomer (A) and a radical-polymerizable unsaturated monomer excluding the monomer (A). The film-forming step (c-2) is a step for forming a film by electrodeposition wherein the metal material is dipped in an aqueous solution comprising at least one of the above compositions (A), (B), (C), (D), and a current is passed between a cathode and an anode with the metal material as cathode.

    摘要翻译: 提供了一种形成在金属表面上具有优异的耐腐蚀性而不产生污泥并且不使用磷或铬的膜的方法。 在该方法中,对金属材料进行以下步骤(a) - (c):(a)必要时的脱脂,(b-1)预处理,和(c)包括以下步骤(c-1)或 (c-2)。 成膜步骤(c-1)是通过使金属材料与包含以下组合物(A),(B),(C)或(D)中的至少一种的水溶液接触来形成膜的步骤 ):(A)是在分子一端含有锍基的单体。 (B)是通过单体(A)的均聚或共聚得到的水溶性聚合物。 (C)是包含通过单体(A)与除单体(A)以外的可自由基聚合的不饱和单体共聚得到的锍基的乳液或水溶性聚合物。 (D)是包含锍基的复合乳液,其中无机颗粒芯由包含上述单体(A)的共聚物和除单体(A)之外的可自由基聚合的不饱和单体的层包覆。 成膜步骤(c-2)是通过电沉积形成膜的步骤,其中将金属材料浸渍在包含上述组合物(A),(B),(C),(C) D),并且电流在阴极和阳极之间通过,金属材料作为阴极。