公开(公告)号：US09033248B2

公开(公告)日：2015-05-19

申请号：US13553997

申请日：2012-07-20

申请人： Hidetoshi Suzuki ,  Yuichi Hotta ,  Yuji Shimoda ,  Yuuji Ogawa ,  Taku Nishiyama ,  Tadanobu Okubo ,  Junichi Onodera ,  Takeshi Ikuta ,  Naohisa Okumura ,  Katsuyoshi Watanabe ,  Kazuhide Doi

发明人： Hidetoshi Suzuki ,  Yuichi Hotta ,  Yuji Shimoda ,  Yuuji Ogawa ,  Taku Nishiyama ,  Tadanobu Okubo ,  Junichi Onodera ,  Takeshi Ikuta ,  Naohisa Okumura ,  Katsuyoshi Watanabe ,  Kazuhide Doi

IPC分类号： G06K19/06 ,  H01L23/28 ,  G06K19/077 ,  H01L23/00 ,  H01L23/31 ,  H01L23/544 ,  H01L25/065 ,  H01L25/18 ,  H01L25/16 ,  H01L23/498

CPC分类号： G06K19/07732 ,  H01L23/3107 ,  H01L23/49838 ,  H01L23/49855 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/165 ,  H01L25/18 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0259 ,  H05K1/0269 ,  H05K1/113 ,  H05K1/117 ,  H05K3/284 ,  H05K3/321 ,  H05K2201/09563 ,  H05K2201/0979 ,  H05K2201/09936 ,  H05K2201/10287 ,  H05K2203/1327 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, a semiconductor storage device is provided with a memory chip including a storage circuit, a controller chip that controls a memory chip, and a substrate having a first surface and a second surface opposing one another, on the first surface of which the controller chip is mounted. Further, the semiconductor storage device is provided with an external connection terminal formed on the second surface of the substrate, and resin that encapsulates the memory chip, the controller chip, and the substrate, includes a third surface and a fourth surface opposing one another, and has a predetermined mark directly printed only on the fourth surface that is adjacent to the second surface of the substrate.

摘要翻译： 根据一个实施例，半导体存储装置设置有存储芯片，存储芯片包括存储电路，控制存储芯片的控制器芯片和具有第一表面和第二表面的基板，第一表面和第二表面在其第一表面上 安装控制器芯片。 此外，半导体存储装置设置有形成在基板的第二表面上的外部连接端子，并且封装存储芯片，控制器芯片和基板的树脂包括彼此相对的第三表面和第四表面， 并且具有仅在与基板的第二表面相邻的第四表面上直接印刷的预定标记。

公开(公告)号：US20130186960A1

公开(公告)日：2013-07-25

申请号：US13553997

申请日：2012-07-20

申请人： Hidetoshi SUZUKI ,  Yuichi Hotta ,  Yuji Shimoda ,  Yuuji Ogawa ,  Taku Nishiyama ,  Tadanobu Okubo ,  Junichi Onodera ,  Takeshi Ikuta ,  Naohisa Okumura ,  Katsuyoshi Watanabe ,  Kazuhide Doi

发明人： Hidetoshi SUZUKI ,  Yuichi Hotta ,  Yuji Shimoda ,  Yuuji Ogawa ,  Taku Nishiyama ,  Tadanobu Okubo ,  Junichi Onodera ,  Takeshi Ikuta ,  Naohisa Okumura ,  Katsuyoshi Watanabe ,  Kazuhide Doi

IPC分类号： G06K19/077

CPC分类号： G06K19/07732 ,  H01L23/3107 ,  H01L23/49838 ,  H01L23/49855 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/165 ,  H01L25/18 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0259 ,  H05K1/0269 ,  H05K1/113 ,  H05K1/117 ,  H05K3/284 ,  H05K3/321 ,  H05K2201/09563 ,  H05K2201/0979 ,  H05K2201/09936 ,  H05K2201/10287 ,  H05K2203/1327 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, a semiconductor storage device is provided with a memory chip including a storage circuit, a controller chip that controls a memory chip, and a substrate having a first surface and a second surface opposing one another, on the first surface of which the controller chip is mounted. Further, the semiconductor storage device is provided with an external connection terminal formed on the second surface of the substrate, and resin that encapsulates the memory chip, the controller chip, and the substrate, includes a third surface and a fourth surface opposing one another, and has a predetermined mark directly printed only on the fourth surface that is adjacent to the second surface of the substrate.

摘要翻译： 根据一个实施例，半导体存储装置设置有存储芯片，存储芯片包括存储电路，控制存储芯片的控制器芯片和具有第一表面和第二表面的基板，第一表面和第二表面在其第一表面上 安装控制器芯片。 此外，半导体存储装置设置有形成在基板的第二表面上的外部连接端子，并且封装存储芯片，控制器芯片和基板的树脂包括彼此相对的第三表面和第四表面， 并且具有仅在与基板的第二表面相邻的第四表面上直接印刷的预定标记。