摘要:
An adhesive composition of the present invention is an adhesive composition including a polymer obtained by copolymerizing a monomer composition containing a (meth)acrylic acid ester and a monomer having a maleimide group, the (meth)acrylic acid ester has a structure represented by General Formula (1): wherein R1 is a hydrogen atom or a methyl group, and R2 is a C4 to C20 alkyl group, and the (meth)acrylic acid ester is contained in the monomer composition by 10 to 50 parts by mass where an amount of the monomer composition is 100 parts by mass. With the arrangement, it is possible to provide an adhesive agent and a film adhesive each of which can be suitably used in high temperature processing.
摘要:
The present invention provides (i) a processed substrate having a through-hole whose openings on respective surfaces of the processed substrate are matched to each other in size, and (ii) a method for easily manufacturing the processed substrate with high efficiency. A processed substrate 1 of the present invention is a processed substrate 1 including a light transmissive substrate having a plurality of through-holes, each of which plurality of the through-holes has a larger opening diameter and a smaller opening, wherein the larger opening diameter is larger in size than the smaller opening diameter by a difference of 5% or less of a size of the larger diameter. As such, a through-hole 6 whose opening on the respective surfaces are matched to each other in size can be provided.
摘要:
An adhesive composition of the present invention is an adhesive composition including a polymer obtained by copolymerizing a monomer composition containing a (meth)acrylic acid ester and a monomer having a maleimide group, the (meth)acrylic acid ester has a structure represented by General Formula (1): wherein R1 is a hydrogen atom or a methyl group, and R2 is a C4 to C20 alkyl group, and the (meth)acrylic acid ester is contained in the monomer composition by 10 to 50 parts by mass where an amount of the monomer composition is 100 parts by mass. With the arrangement, it is possible to provide an adhesive agent and a film adhesive each of which can be suitably used in high temperature processing.
摘要:
An adhesive composition of the present invention is an adhesive composition including a polymer obtained by polymerizing a monomer composition containing a (meth)acrylic acid ester having a structure represented by General Formula (1): wherein R1 is a hydrogen atom or a methyl group and R2 is a C4 to C20 chain alkyl group, the (meth)acrylic acid ester is such that a homopolymer thereof has a glass transition temperature of not less than 0° C., and the (meth)acrylic acid is contained in the monomer composition in a range of 5 to 90 parts by mass where an amount of the monomer composition is 100 parts by mass. The arrangement can attain an adhesive agent and a film adhesive that can be suitably used in high temperature processing.
摘要:
An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.
摘要:
An adhesive composition is disclosed which includes a polymer prepared by copolymerizing a monomer containing a polymerizable group, the polymer including a low-molecular-weight component having a molecular weight equivalent to 1% or less of the weight-average molecular weight of the polymer, the low-molecular-weight component is contained in a range of not less than 0 weight % to less than 0.3 weight % of the total weight of the polymer. This allows provision of an adhesive composition having great adhesive strength in a high-temperature environment, especially at temperatures from 140° C. to 200° C., as well as high heat resistance and favorable crack resistance.
摘要:
An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.
摘要:
The removal method of the present invention includes: providing a support plate and a substrate being combined to each other via a first adhesive layer and a second adhesive layer, the second adhesive layer being an adhesive layer which is dissolvable in a solvent quicker than the first adhesive layer or an adhesive layer which is dissolvable in a solvent different from a solvent to which the first adhesive layer is dissolvable, and the second adhesive layer being between the support plate and the first adhesive layer; and removing the support plate from the substrate by dissolving the second adhesive layer. Further, the removal method of the present invention includes, after the step of removing, dissolving the first adhesive layer. This removes the support plate from the wafer in a quick and easy way.
摘要:
An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.
摘要:
A processed substrate of the present invention includes a translucent substrate having a plurality of through-holes, in each of which there is a gap from 0 to 5 μm between (a) a straight line which passes through a central point of an opening plane of the each of the plurality of through-holes and which is perpendicular to the opening plane and (b) a straight line which passes through a central point of the other opening plane of the each of the plurality of through-holes and which is perpendicular to the other opening plane, thereby making it possible to provide (i) a processed substrate having through-holes in each of which central axes are aligned, which can be easily produced with high productivity, and (ii) a production method thereof. Further, a production method of the present invention of a processed glass substrate includes: (a) forming photosensitive resin layers on surfaces of a glass substrate; (b) forming a through-hole in the glass substrate; and (c) immersing the glass substrate in acid, with the photosensitive resin layers remaining on the both surfaces. Accordingly, it is unnecessary to perform smoothing the surfaces of the glass substrate after the step (c), thereby successfully producing a processed glass substrate having a through-hole with high productivity.