摘要:
The reliability of a semiconductor integrated circuit device is remarkably improved by minimizing the fluctuations of the detection level of the supply voltage due to the manufacturing process and/or other factors. In the semiconductor integrated circuit device according to the invention, a differential amplifier circuit SA amplifies the differential voltage representing the difference between the reference voltage VREF generated by a reference voltage generating section 16 and the detection voltage obtained by dividing a supply voltage VCC by means of resistors 27 and 28 and outputs it as a detection signal K. The reference voltage generating section 16 generates reference voltage VREF from the base-emitter voltage of a bipolar transistor that is minimally affected by temperature and the manufacturing process so that the fluctuations of the detection level of the supply voltage VCC can be minimized.
摘要:
A first reception unit receives “ambient temperature” which is a temperature of surroundings where the computer is installed. A second reception unit receives “first device temperature” which is a temperature of a first device provided in the computer. A third reception unit receives “second device temperature” which is a temperature of a second device provided in the computer. A fan rotation speed indicating unit determines the rotation speed of the fan based on a comparison between the ambient temperature, first device temperature, and second device temperature which are received by the first to third reception units and a fan rotation speed description table describing a relationship between the respective temperature and fan rotation speed and instructs the fan to rotate at the determined rotation speed.
摘要:
A prepreg lamination head which laminates a prepreg sheet (8) toward a fiber direction (T2) in a direction intersecting a length direction (T1) of a prepreg laminated body is disposed at each of both outsides oldie subject laminated body (W) in the width direction. The prepreg lamination head includes: a pair of guide rollers which guides a prepreg sheet (8) so as to be superimposed on the subject laminated body (W); and a lamination shoe (31) which is disposed between the pair of guide rollers so as to freely advance and retract in the fiber direction (T2) and stick the prepreg sheet (8) guided between the pair of guide rollers on the subject laminated body (W) by pressing the prepreg sheet from one surface thereof. Then, the lamination shoe (31) is divided in the width direction of the prepreg sheet (8).
摘要:
A prepreg lamination head and a prepreg automatic lamination apparatus with the same is provided. By using them, the curling-up of the cut terminal portion of the prepreg sheet can be prevented. The prepreg lamination head includes: a first roller, a second roller, and a forward-placed paper liner peeling device. The forward-placed paper liner peeling device includes a third roller, which is provided between and above the first and second rollers. The paper liner attached on the first side of the prepreg sheet is peeled off right after passing the first roller. The peeled paper liner is hanged over the third roller between the first and second rollers. The third roller guides the peeled paper liner to the second roller. The prepreg sheet is pressed on the laminated body with the second roller through the paper liner.
摘要:
A prepreg lamination head and a prepreg automatic lamination apparatus with the same is provided. By using them, the curling-up of the cut terminal portion of the prepreg sheet can be prevented. The prepreg lamination head includes: a first roller, a second roller, and a forward-placed paper liner peeling device. The forward-placed paper liner peeling device includes a third roller, which is provided between and above the first and second rollers. The paper liner attached on the first side of the prepreg sheet is peeled off right after passing the first roller. The peeled paper liner is hanged over the third roller between the first and second rollers. The third roller guides the peeled paper liner to the second roller. The prepreg sheet is pressed on the laminated body with the second roller through the paper liner.
摘要:
A multilayer printed wiring board having a compact test coupon formed on each of the signal wiring layers is provided, and accurate and efficient method of characteristic impedance measurement for each signal wiring layer is realized. The test coupon is constituted by a plurality of linear parts extending parallel to each other and folded-back parts mutually connecting the linear parts. A through hole is provided for serially connecting the respective test coupons of the signal wiring layers adjoining each other. Two measuring pads, one is connected to one end of the serially connected test coupons and another is connected to the ground layer, are also provided. The measurement is performed by applying a step pulse between two measuring pads and measuring voltages of reflection waves from the serially connected test coupons.