摘要:
A polymer optical waveguide has a substrate, a buffer layer formed on the substrate, and a polymer waveguide main body formed on the buffer layer. The buffer layer is made of a polymer material that can absorb a difference in thermal expansion coefficient between the substrate and the polymer optical waveguide.
摘要:
A polymer optical waveguide has a substrate, a buffer layer formed on the substrate, and a polymer waveguide main body formed on the buffer layer. The buffer layer is made of a polymer material that can absorb a difference in thermal expansion coefficient between the substrate and the polymer optical waveguide.
摘要:
A photoelectric conversion module includes: a substrate having a light transmitting property and having a mounting surface; a photoelectric conversion element mounted on the mounting surface of the substrate; a cover member fixed to the substrate via a solder layer constituted by solder and forming, cooperatively with the substrate, an airtight chamber housing the photoelectric conversion element; and a solder adsorbing film provided near an area fixed to the substrate by the solder layer, in a surface, of the cover member, facing the mounting surface, the solder having an adhesive property to the solder adsorbing film.
摘要:
A photoelectric conversion module includes: a substrate having a light transmitting property and having a mounting surface; a photoelectric conversion element mounted on the mounting surface of the substrate; a cover member fixed to the substrate via a solder layer constituted by solder and forming, cooperatively with the substrate, an airtight chamber housing the photoelectric conversion element; and a solder adsorbing film provided near an area fixed to the substrate by the solder layer, in a surface, of the cover member, facing the mounting surface, the solder having an adhesive property to the solder adsorbing film.
摘要:
A photoelectric conversion module includes: a photoelectric conversion element and an IC chip mounted on a mounting surface of a substrate; and an electrode provided on a side surface of the substrate, electrically connected to the IC chip, and having a concave shape sunk deeper than other portions of the side surface of the substrate.
摘要:
An optical fiber mounting waveguide device and a method for fabricating the same, which provide a low optical connection loss and a high productivity. An under cladding layer (3u), a core (4), and an over cladding layer (3o) are sequentially formed on a substrate (8) to constitute an optical fiber mounting waveguide device (1). An optical fiber mounting groove (2) for mounting an optical fiber (6) is formed on the optical fiber mounting waveguide device (1). An end surface (3a) of the over cladding layer (3o) faces to the optical fiber mounting groove (2). The core (4) and the under cladding layer (3u) are projected toward the optical fiber mounting groove (2) with respect to the end surface (3a) of the over cladding layer (3o).
摘要:
An optical fiber mounting waveguide device and a method for fabricating the same, which provide a low optical connection loss and a high productivity. An under cladding layer (3u), a core (4), and an over cladding layer (3o) are sequentially formed on a substrate (8) to constitute an optical fiber mounting waveguide device (1). An optical fiber mounting groove (2) for mounting an optical fiber (6) is formed on the optical fiber mounting waveguide device (1). An end surface (3a) of the over cladding layer (3o) faces to the optical fiber mounting groove (2). The core (4) and the under cladding layer (3u) are projected toward the optical fiber mounting groove (2) with respect to the end surface (3a) of the over cladding layer (3o).
摘要:
A photoelectric conversion module includes a substrate, a photoelectric conversion element optically coupled to an optical fiber, and a conductor pattern that is provided on a surface of the substrate and includes an electrode pattern mounting the photoelectric conversion element and a restriction pattern for restricting a position of the optical fiber.
摘要:
A photoelectric conversion module includes: an IC chip and a photoelectric conversion element mounted on one surface of a circuit board having a light transmitting property and flexibility; an optical fiber having a tip portion disposed in a holding groove formed in a resin layer provided on another surface of the circuit board; a reinforcing member covering the holding groove; and an optical element optically coupling a tip of the optical fiber and the photoelectric conversion element via the circuit board. The holding groove has an open end at an end of the resin layer, the end of the resin layer being located on the IC chip side in terms of an arrangement direction of the IC chip and the photoelectric conversion element, and at least part of the tip portion of the optical fiber extends along the IC chip.
摘要:
A photoelectric conversion module includes a circuit board including a plurality of first board-side electrodes and a plurality of second board-side electrodes that are alternately arranged on a mounting surface of the circuit board in an array direction and each extend into strips in a direction orthogonal to the array direction, a photoelectric conversion array element mounted on the circuit board and including, on a surface facing the mounting surface, a plurality of light receiving/emitting portions, first element-side electrodes connected to the first board-side electrodes and second element-side electrodes connected to the second board-side electrodes, and an IC chip mounted on the circuit board. The circuit board further includes, on the mounting surface, a connecting portion for connecting the first board-side electrodes to each other and a first electrode land portion connected to the first board-side electrode or the connecting portion to contact with a first test electrode probe.