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    Optical transceiver module
    1.
    发明授权
    Optical transceiver module 失效
    光收发模块

    公开(公告)号：US08380075B2

    公开(公告)日：2013-02-19

    申请号：US12624470

    申请日：2009-11-24

    申请人： Yukio Sakigawa ,  Toshiaki Takai ,  Shohei Hata

    发明人： Yukio Sakigawa ,  Toshiaki Takai ,  Shohei Hata

    IPC分类号： H04B10/00

    CPC分类号： G02B6/4215 ,  G02B6/4201 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/424 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4253 ,  G02B6/4257 ,  G02B6/4259 ,  H04B10/40

    摘要： There are provided a downsized and low-cost optical module used as a terminal for wavelength multiplexing optical transmission and one-core bidirectional optical transmission which transmits lights of plural wavelengths through one optical fiber, and a method of manufacturing the optical module. A base on which plural optical elements are mounted, and an optical multiplexer and demultiplexer having wavelength selection filters and mirrors formed on both surfaces of a substrate are prepared. Those two parts are packed into a package so that an optical element mounted surface and a filter surface are substantially parallel to each other, and the optical elements are arranged to emit or receive lights obliquely to the base. With this configuration, because the optical multiplexer and demultiplexer can be mounted in parallel to an X-Y plane, a package can be easily machined by using a lathe, thereby enabling a reduction in the costs.

    摘要翻译： 提供了一种小型化和低成本的光模块，其用作通过一根光纤传输多种波长的光的波分复用光传输和单核双向光传输的终端，以及制造光模块的方法。 准备了安装有多个光学元件的基底，以及在基板的两个表面上形成有波长选择滤光器和反射镜的光复用器和解复用器。 这两个部件被包装成包装，使得光学元件安装表面和滤光器表面基本上彼此平行，并且光学元件布置成发射或接收与基部倾斜的光。 利用这种配置，由于光学复用器和解复用器可以平行于X-Y平面安装，所以可以通过使用车床来容易地加工封装，从而能够降低成本。

    Optical module mounted with WDM filter
    2.
    发明授权
    Optical module mounted with WDM filter 有权
    光模块安装WDM滤波器

    公开(公告)号：US07991251B2

    公开(公告)日：2011-08-02

    申请号：US12494890

    申请日：2009-06-30

    申请人： Shohei Hata ,  Naoki Matsushima ,  Toshiaki Takai ,  Yukio Sakigawa ,  Satoshi Arai

    发明人： Shohei Hata ,  Naoki Matsushima ,  Toshiaki Takai ,  Yukio Sakigawa ,  Satoshi Arai

    IPC分类号： G02B6/28 ,  G02B6/30

    CPC分类号： G02B6/29365 ,  G02B6/29367 ,  G02B6/4204 ,  G02B6/4246 ,  Y10T156/1052 ,  Y10T156/1089

    摘要： A filter element includes a first glass substrate having a pair of parallel surfaces and a band pass filter arranged on one of the parallel surfaces, a pair of single-crystal substrates (Si wafers) each including a primary surface formed with a depression having an inclined surface with respect to the primary surface occupying at least one half of the opening of the depression, and a second glass substrate having an optical element. The primary surfaces of the single-crystal substrate pair are bonded to a pair of the surfaces of the glass substrate. The depressions are faced through the glass substrate and surround the band pass filter. By this configuration, the filter element can be mass produced with a high accuracy and a low cost by the wafer-level process.

    摘要翻译： 过滤元件包括具有一对平行表面的第一玻璃基板和布置在一个平行表面上的带通滤波器，一对单晶基板（Si晶片），每个单晶基板包括形成有具有倾斜的凹陷的主表面 相对于占据凹部的开口的至少一半的主表面的表面，以及具有光学元件的第二玻璃基板。 单晶衬底对的主表面被接合到玻璃衬底的一对表面上。 凹陷面向玻璃基板并围绕带通滤光片。 通过这种构造，可以通过晶片级处理以高精度和低成本大量生产过滤元件。

    OPTICAL MODULE
    3.
    发明申请
    OPTICAL MODULE 审中-公开
    光学模块

    公开(公告)号：US20110080657A1

    公开(公告)日：2011-04-07

    申请号：US12871877

    申请日：2010-08-30

    申请人： Toshiaki Takai ,  Eiji Sakamoto ,  Shohei Hata

    发明人： Toshiaki Takai ,  Eiji Sakamoto ,  Shohei Hata

    IPC分类号： G02B3/08

    CPC分类号： G02B6/4206 ,  G02B6/4214 ,  G02B6/43 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01327 ,  H01L2924/00

    摘要： There is provided means of achieving the improvement of optical coupling efficiency between a surface receiving/emitting element and an optical transmission path with a simple structure and low cost. An optical element and a substrate having an optical waveguide layer and electric wiring are connected with each other through a lens having a Fresnel lens shape. A through via is provided in the lens, and the optical element and the electric wiring in the substrate are electrically connected with each other through the through via. Instead of the lens, a unit in which a lens is mounted inside an optical-element mounting substrate may be used.

    摘要翻译： 提供了以简单的结构和低成本实现表面接收/发射元件和光传输路径之间的光耦合效率的提高的方法。 具有光波导层和电布线的光学元件和基板通过具有菲涅尔透镜形状的透镜彼此连接。 在透镜中设置通孔，并且基板中的光学元件和电布线通过贯通孔彼此电连接。 代替透镜，可以使用其中透镜安装在光学元件安装基板内的单元。

    OPTICAL MODULE MOUNTED WITH WDM FILTER
    4.
    发明申请
    OPTICAL MODULE MOUNTED WITH WDM FILTER 有权
    光学模块安装WDM过滤器

    公开(公告)号：US20100002987A1

    公开(公告)日：2010-01-07

    申请号：US12494890

    申请日：2009-06-30

    申请人： Shohei HATA ,  Naoki MATSUSHIMA ,  Toshiaki TAKAI ,  Yukio SAKIGAWA ,  Satoshi ARAI

    发明人： Shohei HATA ,  Naoki MATSUSHIMA ,  Toshiaki TAKAI ,  Yukio SAKIGAWA ,  Satoshi ARAI

    IPC分类号： G02B6/12 ,  B32B37/00 ,  B23K1/00 ,  G02B6/10

    CPC分类号： G02B6/29365 ,  G02B6/29367 ,  G02B6/4204 ,  G02B6/4246 ,  Y10T156/1052 ,  Y10T156/1089

    摘要： A filter element includes a first glass substrate having a pair of parallel surfaces and a band pass filter arranged on one of the parallel surfaces, a pair of single-crystal substrates (Si wafers) each including a primary surface formed with a depression having an inclined surface with respect to the primary surface occupying at least one half of the opening of the depression, and a second glass substrate having an optical element. The primary surfaces of the single-crystal substrate pair are bonded to a pair of the surfaces of the glass substrate. The depressions are faced through the glass substrate and surround the band pass filter. By this configuration, the filter element can be mass produced with a high accuracy and a low cost by the wafer-level process.

    摘要翻译： 过滤元件包括具有一对平行表面的第一玻璃基板和布置在一个平行表面上的带通滤波器，一对单晶基板（Si晶片），每个单晶基板包括形成有具有倾斜的凹陷的主表面 相对于占据凹部的开口的至少一半的主表面的表面，以及具有光学元件的第二玻璃基板。 单晶衬底对的主表面被接合到玻璃衬底的一对表面上。 凹陷面向玻璃基板并围绕带通滤光片。 通过这种构造，可以通过晶片级处理以高精度和低成本大量生产过滤元件。

    Functional Device
    7.
    发明申请
    Functional Device 有权
    功能设备

    公开(公告)号：US20080233349A1

    公开(公告)日：2008-09-25

    申请号：US11924924

    申请日：2007-10-26

    申请人： Shohei Hata ,  Eiji Sakamoto ,  Naoki Matsushima

    发明人： Shohei Hata ,  Eiji Sakamoto ,  Naoki Matsushima

    IPC分类号： B32B3/24

    CPC分类号： G01P15/0802 ,  B81B2201/0271 ,  B81C1/00269 ,  G01P1/023 ,  G01P15/0897 ,  H03H9/105 ,  H03H9/1057 ,  H03H9/173 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/2462 ,  Y10T428/24826 ,  Y10T428/265

    摘要： The present invention provides a low-cost MEMS functional device by improving air tightness of a jointed section by anode junction in wafer level packaging for MEMS based functional devices. The MEMS functional device comprises a function element section formed by processing a substrate mainly made of Si, a metallized film for sealing formed around the functional element, and a glass substrate jointed to the metallized film for sealing by anode junction. Formed on a surface of the metallized film for sealing is a metallized film containing at least one of Sn and Ti as a main component.

    摘要翻译： 本发明通过在基于MEMS的功能器件的晶片级封装中改善阳极结的接合部分的气密性来提供低成本MEMS功能器件。 MEMS功能器件包括通过处理主要由Si制成的衬底，形成在功能元件周围形成的用于密封的金属化膜形成的功能元件部分，以及连接到金属化膜的用于通过阳极接合进行密封的玻璃衬底。 形成在用于密封的金属化膜的表面上是以Sn和Ti中的至少一种为主要成分的金属化膜。

    Functional Device Package
    8.
    发明申请
    Functional Device Package 有权
    功能器件封装

    公开(公告)号：US20080217752A1

    公开(公告)日：2008-09-11

    申请号：US12028108

    申请日：2008-02-08

    申请人： Shohei Hata ,  Naoki Matsushima ,  Eiji Sakamoto ,  Ryoji Okada ,  Takanori Aono ,  Atsushi Kazama ,  Toshiki Kida

    发明人： Shohei Hata ,  Naoki Matsushima ,  Eiji Sakamoto ,  Ryoji Okada ,  Takanori Aono ,  Atsushi Kazama ,  Toshiki Kida

    IPC分类号： H01L23/02

    CPC分类号： B81C1/00269 ,  B81C2203/019 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A packaging structure for hermitically sealing a functional device by solder connection at a wafer level in which a first Si substrate having a concave portion metallized on its internal surface and a second Si substrate metallized at a position opposed to said concave portion are used, the metallization applied to the internal surface of the concave portion of the first Si substrate and the metallization applied to the second Si substrate at the position opposed to the concave portion are connected by molten solder to hermetically seal the functional device between the first Si substrate and the second Si substrate, whereby the wettability of the solder for the two Si substrates is improved, the bondability between the Si substrates is enhanced, and the yield at which the package is manufactured is improved.

    摘要翻译： 一种用于通过在晶片级焊接连接来密封功能器件的封装结构，其中使用在其内表面上具有金属化的凹部的第一Si衬底和在与所述凹部相对的位置上金属化的第二Si衬底，所述金属化 施加到第一Si衬底的凹部的内表面，并且在与凹部相对的位置处施加到第二Si衬底的金属化通过熔融焊料连接，以将功能器件密封在第一Si衬底和第二Si衬底之间 Si衬底，由此提高了用于两个Si衬底的焊料的润湿性，提高了Si衬底之间的粘合性，并提高了制造封装的成品率。

    Anodic bonding method and electronic device having anodic bonding structure
    9.
    发明授权
    Anodic bonding method and electronic device having anodic bonding structure 有权
    阳极接合方法和具有阳极结合结构的电子器件

    公开(公告)号：US07153758B2

    公开(公告)日：2006-12-26

    申请号：US10786106

    申请日：2004-02-26

    申请人： Shohei Hata ,  Hideo Sotokawa ,  Hiroaki Furuichi

    发明人： Shohei Hata ,  Hideo Sotokawa ,  Hiroaki Furuichi

    IPC分类号： H01L21/326 ,  B32B37/00

    CPC分类号： H01L21/2007 ,  C03C27/00 ,  C03C27/02

    摘要： In anodic bonding between a conductor or semiconductor and glass, in order to attain good adhesion at a lower bonding temperature than usual and improve the toughness at its boundary to obtain higher reliability for a bonded portion even in a case where bonded members are warped or dust is present at the bonding boundary, a soft metal film is formed on the surface of a conductor or semiconductor on which an active metal film having high reactivity with oxygen is formed, whereby a warp or dust, if any, can be absorbed by the deformation of the soft metal film, thereby to improve the adhesion at the boundary. Adhesion at the bonding boundary is improved even at a low bonding temperature of, e.g., about 200° C. Further, the toughness at the bonding boundary can be improved to increase reliability by roughening the bonded surface on the side of the glass.

    摘要翻译： 在导体或半导体与玻璃之间的阳极接合中，为了在比通常更低的接合温度下获得良好的粘附性，并且即使在接合部件翘曲或灰尘的情况下也能够提高其边界处的韧性以获得更高的接合部的可靠性 存在于接合边界处，在形成有与氧反应性高的活性金属膜的导体或半导体的表面上形成软金属膜，由此可以通过变形来吸收翘曲或灰尘（如果有的话） 的软金属膜，从而提高边界的粘附性。 即使在例如约200℃的低接合温度下，接合边界处的粘附性也得到改善。此外，通过使玻璃侧的接合面粗糙化，可以提高接合边界的韧性，提高可靠性。

    Optical module
    10.
    发明授权
    Optical module 失效
    光模块

    公开(公告)号：US08449204B2

    公开(公告)日：2013-05-28

    申请号：US13126898

    申请日：2009-06-11

    申请人： Toshiaki Takai ,  Yukio Sakigawa ,  Shohei Hata

    发明人： Toshiaki Takai ,  Yukio Sakigawa ,  Shohei Hata

    IPC分类号： G02B6/36 ,  G02B6/42

    CPC分类号： G02B6/4246 ,  G02B6/29367 ,  H01S5/005 ,  H01S5/02212 ,  H01S5/02228 ,  H01S5/02284 ,  H01S5/02296 ,  H01S2301/176

    摘要： An optical module in a simple configuration is provided which can suppress optical crosstalk due to leakage light without causing characteristics deterioration and reliability decrease of light-emitting elements to thereby obtain appropriate light receiving sensitivity. In an optical module in which a plurality of light-emitting elements 11 and light-receiving elements 12 are mounted on an optical-element mounting substrate 1, a light-absorbing resin 6 to absorb light with a light-emission wavelength of the light-emitting elements 11 is arranged to cover side surfaces of the light-emitting elements 11 and a non-adhesive layer 7 including a material not adhesive to the light-absorbing resin 6 is arranged between the light-absorbing resin 6 and the optical-element mounting substrate 1.

    摘要翻译： 提供一种简单结构的光模块，其可以抑制由于漏光引起的光串扰，而不会导致发光元件的特性劣化和可靠性降低，从而获得适当的光接收灵敏度。 在其中多个发光元件11和光接收元件12安装在光学元件安装基板1上的光学模块中，用于吸收发光波长的光的光吸收树脂6， 发光元件11布置成覆盖发光元件11的侧表面，并且在光吸收树脂6和光学元件安装之间布置有包括不与光吸收树脂6粘合的材料的非粘合层7 基板1。