Liquid processing apparatus and liquid processing method
    1.
    发明申请
    Liquid processing apparatus and liquid processing method 有权
    液体处理装置和液体处理方法

    公开(公告)号:US20070231483A1

    公开(公告)日:2007-10-04

    申请号:US11727656

    申请日:2007-03-27

    IPC分类号: B05D3/12 B05C11/02 B05B3/00

    摘要: A liquid processing apparatus is arranged to planarize a film on a substrate by supplying onto the film a process liquid for dissolving the film while rotating the substrate. The apparatus includes a substrate holding member configured to rotatably hold the substrate in a horizontal state, a rotation mechanism configured to rotate the substrate holding member, and a liquid supply mechanism configured to supply the process liquid onto a surface of the substrate. The liquid supply mechanism includes first and second liquid delivery nozzles configured to deliver the same process liquid. The first liquid delivery nozzle has a smaller diameter and provides a smaller delivery flow rate, as compared to the second liquid delivery nozzle. The first liquid delivery nozzle is inclined to deliver the process liquid in a rotational direction of the substrate, and is movable between a center of the substrate and a peripheral edge thereof.

    摘要翻译: 液体处理装置被布置成通过在旋转基板的同时向膜上提供用于溶解膜的处理液体来平坦化基板上的膜。 该装置包括:基板保持部件,被配置为将基板可旋转地保持在水平状态;旋转机构,其构造成旋转基板保持部件;以及液体供给机构,其构造成将处理液体供给到基板的表面。 液体供给机构包括配置成输送相同的处理液体的第一和第二液体输送喷嘴。 与第二液体输送喷嘴相比,第一液体输送喷嘴具有较小的直径并且提供较小的输送流量。 第一液体输送喷嘴倾斜以沿基板的旋转方向输送处理液体,并且可在基板的中心与其周边边缘之间移动。

    Liquid processing apparatus and liquid processing method
    2.
    发明授权
    Liquid processing apparatus and liquid processing method 有权
    液体处理装置和液体处理方法

    公开(公告)号:US08043467B2

    公开(公告)日:2011-10-25

    申请号:US11727656

    申请日:2007-03-27

    IPC分类号: H01L21/027 G03F7/30

    摘要: A liquid processing apparatus is arranged to planarize a film on a substrate by supplying onto the film a process liquid for dissolving the film while rotating the substrate. The apparatus includes a substrate holding member configured to rotatably hold the substrate in a horizontal state, a rotation mechanism configured to rotate the substrate holding member, and a liquid supply mechanism configured to supply the process liquid onto a surface of the substrate. The liquid supply mechanism includes first and second liquid delivery nozzles configured to deliver the same process liquid. The first liquid delivery nozzle has a smaller diameter and provides a smaller delivery flow rate, as compared to the second liquid delivery nozzle. The first liquid delivery nozzle is inclined to deliver the process liquid in a rotational direction of the substrate, and is movable between a center of the substrate and a peripheral edge thereof.

    摘要翻译: 液体处理装置被布置成通过在旋转基板的同时向膜上提供用于溶解膜的处理液体来平坦化基板上的膜。 该装置包括:基板保持部件,被配置为将基板可旋转地保持在水平状态;旋转机构,其构造成旋转基板保持部件;以及液体供给机构,其构造成将处理液体供给到基板的表面。 液体供给机构包括配置成输送相同的处理液体的第一和第二液体输送喷嘴。 与第二液体输送喷嘴相比,第一液体输送喷嘴具有较小的直径并且提供较小的输送流量。 第一液体输送喷嘴倾斜以沿基板的旋转方向输送处理液体,并且可在基板的中心与其周边边缘之间移动。

    Two-fluid nozzle for cleaning substrate and substrate cleaning apparatus
    3.
    发明授权
    Two-fluid nozzle for cleaning substrate and substrate cleaning apparatus 有权
    用于清洁基板和基板清洁装置的双流体喷嘴

    公开(公告)号:US08037891B2

    公开(公告)日:2011-10-18

    申请号:US10591474

    申请日:2005-03-09

    IPC分类号: B08B3/04

    摘要: An object of the present is to uniform particle diameters and speeds of liquid droplets in a two-fluid nozzle for cleaning substrates which mixes gas and liquid internally and injects liquid droplets with gas so as to clean a substrate. The two-fluid nozzle for cleaning substrates has a gas supply passage for supplying gas, a liquid supply passage for supplying liquid, and a lead-out passage for leading out internally-formed liquid droplets, wherein an injection port for injecting liquid droplets to the outside is formed at the front end of the lead-out passage, and wherein a cross-sectional area Sb of the injection port is formed smaller than a cross-sectional area Sa of the lead-out passage, and a cross sectional area Sc of an exit of the gas supply passage is formed smaller than the cross-sectional area Sa of the lead-out passage.

    摘要翻译: 本发明的目的是在二流体喷嘴中用于清洁衬底的液滴的均匀的粒子直径和速度,这些衬底在内部混合气体和液体,并且用气体注入液滴以便清洁衬底。 用于清洁基板的双流体喷嘴具有用于供应气体的气体供应通道,用于供应液体的液体供应通道和用于引出内部形成的液滴的引出通道,其中用于将液滴注入到喷嘴 外部形成在引出通道的前端,并且其中注入口的横截面面积Sb形成为小于引出通道的横截面积Sa,横截面面积Sc 气体供给通道的出口形成为小于引出通道的横截面面积Sa。

    Two-fluid nozzle for cleaning substrate and substrate cleaning apparatus
    4.
    发明申请
    Two-fluid nozzle for cleaning substrate and substrate cleaning apparatus 有权
    用于清洁基板和基板清洁装置的双流体喷嘴

    公开(公告)号:US20070141849A1

    公开(公告)日:2007-06-21

    申请号:US10591474

    申请日:2005-03-09

    IPC分类号: B08B3/00 B41J2/05 H01L21/302

    摘要: An object of the present is to uniform particle diameters and speeds of liquid droplets in a two-fluid nozzle for cleaning substrates which mixes gas and liquid internally and injects liquid droplets with gas so as to clean a substrate. The two-fluid nozzle for cleaning substrates has a gas supply passage for supplying gas, a liquid supply passage for supplying liquid, and a lead-out passage for leading out internally-formed liquid droplets, wherein an injection port for injecting liquid droplets to the outside is formed at the front end of the lead-out passage, and wherein a cross-sectional area Sb of the injection port is formed smaller than a cross-sectional area Sa of the lead-out passage, and a cross sectional area Sc of an exit of the gas supply passage is formed smaller than the cross-sectional area Sa of the lead-out passage.

    摘要翻译: 本发明的目的是在二流体喷嘴中用于清洁衬底的液滴的均匀的粒子直径和速度,这些衬底在内部混合气体和液体,并且用气体注入液滴以便清洁衬底。 用于清洁基板的双流体喷嘴具有用于供应气体的气体供应通道,用于供应液体的液体供应通道和用于引出内部形成的液滴的引出通道,其中用于将液滴注入到喷嘴 外部形成在引出通道的前端,并且其中注入口的横截面面积Sb形成为小于引出通道的横截面积Sa,横截面面积Sc 气体供给通道的出口形成为小于引出通道的横截面面积Sa。

    Substrate processing method, storage medium and substrate processing apparatus
    5.
    发明授权
    Substrate processing method, storage medium and substrate processing apparatus 有权
    基板处理方法,存储介质和基板处理装置

    公开(公告)号:US08133327B2

    公开(公告)日:2012-03-13

    申请号:US11886662

    申请日:2007-03-29

    IPC分类号: B08B3/04

    摘要: Provided is a substrate processing method that prevents generation of watermarks on a substrate and can be performed at a low cost. The method controls the ambient humidity around the substrate depending on the kind of the chemical liquid, when the substrate is processed with the chemical liquid. The control of the humidity is performed at least in a drying step that dries the substrate W. In one embodiment, the ambient humidity around the substrate is controlled when a fluid containing IPA as a drying fluid is supplied to the substrate W after processing the substrate W with the chemical liquid.

    摘要翻译: 提供了一种防止在基板上产生水印并且可以以低成本执行的基板处理方法。 当用化学液体处理衬底时,该方法根据化学液体的种类控制衬底周围的环境湿度。 至少在干燥基板W的干燥步骤中进行湿度的控制。在一个实施例中,当在处理基板之后将含有作为干燥流体的IPA的流体供应到基板W时,控制基板周围的环境湿度 W与化学液体。

    Substrate Processing Method, Storage Medium and Substrate Processing Apparatus
    6.
    发明申请
    Substrate Processing Method, Storage Medium and Substrate Processing Apparatus 有权
    基板加工方法,存储介质和基板处理装置

    公开(公告)号:US20090014033A1

    公开(公告)日:2009-01-15

    申请号:US11886662

    申请日:2007-03-29

    IPC分类号: B08B3/04

    摘要: Provided is a substrate processing method that prevents generation of watermarks on a substrate and can be performed at a low cost. The method controls the ambient humidity around the substrate depending on the kind of the chemical liquid, when the substrate is processed with the chemical liquid. The control of the humidity is performed at least in a drying step that dries the substrate W. In one embodiment, the ambient humidity around the substrate is controlled when a fluid containing IPA as a drying fluid is supplied to the substrate W after processing the substrate W with the chemical liquid.

    摘要翻译: 提供了一种防止在基板上产生水印并且可以以低成本执行的基板处理方法。 当用化学液体处理衬底时,该方法根据化学液体的种类控制衬底周围的环境湿度。 至少在干燥基板W的干燥步骤中进行湿度的控制。在一个实施例中,当在处理基板之后将含有作为干燥流体的IPA的流体供应到基板W时,控制基板周围的环境湿度 W与化学液体。

    Substrate cleaning method and substrate cleaning apparatus
    7.
    发明申请
    Substrate cleaning method and substrate cleaning apparatus 审中-公开
    基板清洗方法和基板清洗装置

    公开(公告)号:US20090050177A1

    公开(公告)日:2009-02-26

    申请号:US11887001

    申请日:2006-02-28

    IPC分类号: B08B1/00 B08B13/00

    摘要: The present invention provides a substrate cleaning method which is intended to securely remove matters attached to the periphery of a substrate to be processed and enhance the yield of products as well as intended to lengthen the life of the apparatus. This substrate cleaning method comprises the steps of: cleaning the periphery of a substrate by contacting a periphery cleaning member 10 with the periphery of the substrate W; and removing matters from the periphery cleaning member, the matters once attached to the substrate and then transferred therefrom and attached to the periphery cleaning member. The step of cleaning the periphery using the periphery cleaning member and the step of removing the attached matters from the periphery cleaning member are performed at the same time.

    摘要翻译: 本发明提供了一种基材清洗方法,该方法旨在可靠地除去附着在待加工基材周边的物质,并提高产品的产率以及延长设备的使用寿命。 该基板清洗方法包括以下步骤:通过使周边清洁部件10与基板W的周边接触来清洁基板的周边; 从周边清洁部件除去物质,一旦附着到基板上,随后从其移出并附着到周边清洁部件上。 使用周边清洁部件清洁周边的步骤和从周边清洁部件移除附着物体的步骤同时进行。