公开(公告)号：US20100139904A1

公开(公告)日：2010-06-10

申请号：US12063495

申请日：2005-08-11

申请人： Hiroshi Chiba ,  Tetsuro Ogushi ,  Hideo Nakajima

发明人： Hiroshi Chiba ,  Tetsuro Ogushi ,  Hideo Nakajima

IPC分类号： H01L23/367 ,  F28F7/00 ,  H01L23/46 ,  F28D15/00

CPC分类号： H01L23/367 ,  H01L21/4878 ,  H01L23/3733 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink (2) has a base (4) having a first surface (4a) thermally connected to a heat producing body and also has fins (6a-6d) each having through-holes (8), the fins being supported by a second surface (4b) of the base (4) and arranged in a predetermined direction. The base (4) and the fins (6a-6d) are integrally formed of a porous material (lotus-type porous material). The heat sink (2) is placed in a duct (80). It is preferable that the width (W) of the heat sink (2) is substantially equal to or less than 10 mm.

摘要翻译： 散热器（2）具有基部（4），其具有与发热体热连接的第一表面（4a），并且还具有各自具有通孔（8）的翅片（6a-6d），翅片由 （4）的第二表面（4b）并且沿预定方向布置。 底座（4）和翅片（6a-6d）由多孔材料（莲花型多孔材料）整体形成。 散热片（2）放置在导管（80）中。 优选的是，散热器（2）的宽度（W）基本上等于或小于10mm。

公开(公告)号：US08371367B2

公开(公告)日：2013-02-12

申请号：US12063495

申请日：2005-08-11

申请人： Hiroshi Chiba ,  Tetsuro Ogushi ,  Hideo Nakajima

发明人： Hiroshi Chiba ,  Tetsuro Ogushi ,  Hideo Nakajima

IPC分类号： H05K7/20

CPC分类号： H01L23/367 ,  H01L21/4878 ,  H01L23/3733 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink includes a base having a first surface thermally connected to a heat producing component and a plurality of fins supported by a second surface of the base and arranged in a predetermined direction, each fin having a plurality of through-holes. The base and the plurality of fins are integrally formed from a porous material, for example a lotus-shaped porous material. The heat sink is placed within a duct. The heat sink may have a width of about 10 mm or less.

摘要翻译： 散热器包括具有热连接到发热部件的第一表面的底座和由基座的第二表面支撑并沿预定方向布置的多个翅片，每个翅片具有多个通孔。 底座和多个翼片由多孔材料，例如莲花状多孔材料一体地形成。 散热器放置在管道内。 散热器可以具有约10mm或更小的宽度。

公开(公告)号：US20050072559A1

公开(公告)日：2005-04-07

申请号：US10618657

申请日：2003-07-15

申请人： Shigetoshi Ippoushi ,  Tetsuro Ogushi ,  Kazushige Nakao ,  Hiroaki Ishikawa ,  Toshiyuki Umemoto ,  Hiroshi Chiba ,  Mihoko Shimoji

发明人： Shigetoshi Ippoushi ,  Tetsuro Ogushi ,  Kazushige Nakao ,  Hiroaki Ishikawa ,  Toshiyuki Umemoto ,  Hiroshi Chiba ,  Mihoko Shimoji

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D1/0383 ,  F28D15/0233 ,  F28D15/0266 ,  F28F3/12 ,  H01L2924/0002 ,  H05K7/20272 ,  H01L2924/00

摘要： A heat transport device includes a container having a hollow structure including a fluid channel, at least one thermal-receiver heat exchanger and one thermal-radiator heat exchanger arranged side-by-side on an outer wall of the container along the fluid channel, and driving heat exchangers at respective terminal portions of the container. In this heat transport device, both ends of the fluid channel are closed to prevent intrusion of external air, and a liquid and a gas are sealed in the fluid channel. The driving heat exchangers cause the liquid to oscillate in the container along the internal fluid channel. The heat transport device provides low acoustic noise performance, improved temperature controllability, high heat transportation and heat radiating capacities, and improved heat transfer and fluid flow characteristics.

摘要翻译： 热传输装置包括具有包括流体通道的中空结构的容器，沿着流体通道并排设置在容器的外壁上的至少一个热接收器热交换器和一个散热器热交换器，以及 在容器的各个端部驱动热交换器。 在该传热装置中，流体通道的两端被封闭以防止外部空气的侵入，液体和气体被密封在流体通道中。 驱动热交换器使液体沿着内部流体通道在容器中振荡。 热传输装置提供低声噪声性能，改善的温度可控性，高热传输和散热能力，以及改善的传热和流体流动特性。

公开(公告)号：US20050195574A1

公开(公告)日：2005-09-08

申请号：US10866790

申请日：2004-06-15

申请人： Hiroshi Chiba ,  Tetsuro Ogushi ,  Akira Yamada ,  Hiroshi Yamabuchi

发明人： Hiroshi Chiba ,  Tetsuro Ogushi ,  Akira Yamada ,  Hiroshi Yamabuchi

IPC分类号： H01L23/473 ,  H01L25/07 ,  H01L25/18 ,  H05K7/20

CPC分类号： H01L23/473 ,  H01L2224/49111 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00

摘要： A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module (5) through the medium of cooling water includes a base member (1), a heat sink body (2) superposed on the base member (1) to form in cooperation with the base member (1) a passage through which the coolant flows, and a bellows-like flow straightening plate (6) disposed between the power semiconductor module (5) and the base member (1) in physical contact with the power semiconductor module (5) on one hand and with the base member (1) on the other hand. The flow straightening plate (6) partitions the passage into a plurality of flow straightening channels (14A, 14B).

摘要翻译： 设计成通过冷却水介质安装在功率半导体模块（5）上的易于组装的低成本散热器包括：基座部件（1），重叠在基体部件上的散热体（2） 1）与基部构件（1）协作形成冷却剂流过的通道，以及物理上设置在功率半导体模块（5）和基座构件（1）之间的波纹管状流动矫直板（6） 一方面与功率半导体模块（5）接触，另一方面与基座部件（1）接触。 流动矫直板（6）将通道分隔成多个流动矫直通道（14A，14B）。

公开(公告)号：US07254030B2

公开(公告)日：2007-08-07

申请号：US10866790

申请日：2004-06-15

申请人： Hiroshi Chiba ,  Tetsuro Ogushi ,  Akira Yamada ,  Hiroshi Yamabuchi

发明人： Hiroshi Chiba ,  Tetsuro Ogushi ,  Akira Yamada ,  Hiroshi Yamabuchi

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  H01L2224/49111 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00

摘要： A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module (5) through the medium of cooling water includes a base member (1), a heat sink body (2) superposed on the base member (1) to form in cooperation with the base member (1) a passage through which the coolant flows, and a bellows-like flow straightening plate (6) disposed between the power semiconductor module (5) and the base member (1) in physical contact with the power semiconductor module (5) on one hand and with the base member (1) on the other hand. The flow straightening plate (6) partitions the passage into a plurality of flow straightening channels (14A, 14B).

摘要翻译： 设计成通过冷却水介质安装在功率半导体模块（5）上的易于组装的低成本散热器包括：基座部件（1），重叠在基体部件上的散热体（2） 1）与基部构件（1）协作形成冷却剂流过的通道，以及物理上设置在功率半导体模块（5）和基座构件（1）之间的波纹管状流动矫直板（6） 一方面与功率半导体模块（5）接触，另一方面与基座部件（1）接触。 流动矫直板（6）将通道分隔成多个流动矫直通道（14A，14B）。

公开(公告)号：US07522422B2

公开(公告)日：2009-04-21

申请号：US11747482

申请日：2007-05-11

申请人： Hiroshi Chiba ,  Tetsuro Ogushi ,  Akira Yamada ,  Hiroshi Yamabuchi

发明人： Hiroshi Chiba ,  Tetsuro Ogushi ,  Akira Yamada ,  Hiroshi Yamabuchi

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  H01L2224/49111 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00

摘要： A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module (5) through the medium of cooling water includes a base member (1), a heat sink body (2) superposed on the base member (1) to form in cooperation with the base member (1) a passage through which the coolant flows, and a bellows-like flow straightening plate (6) disposed between the power semiconductor module (5) and the base member (1) in physical contact with the power semiconductor module (5) on one hand and with the base member (1) on the other hand. The flow straightening plate (6) partitions the passage into a plurality of flow straightening channels (14A, 14B).

摘要翻译： 设计成通过冷却水介质安装在功率半导体模块（5）上的易于组装的低成本散热器包括：基座部件（1），重叠在基体部件上的散热体（2） 1）与基部构件（1）协作形成冷却剂流过的通道，以及物理上设置在功率半导体模块（5）和基座构件（1）之间的波纹管状流动矫直板（6） 一方面与功率半导体模块（5）接触，另一方面与基座部件（1）接触。 流动矫正板（6）将通道分隔成多个流动矫直通道（14A，14B）。

公开(公告)号：US20070211434A1

公开(公告)日：2007-09-13

申请号：US11747482

申请日：2007-05-11

申请人： Hiroshi Chiba ,  Tetsuro Ogushi ,  Akira Yamada ,  Hiroshi Yamabuchi

发明人： Hiroshi Chiba ,  Tetsuro Ogushi ,  Akira Yamada ,  Hiroshi Yamabuchi

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  H01L2224/49111 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00

摘要： A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module (5) through the medium of cooling water includes a base member (1), a heat sink body (2) superposed on the base member (1) to form in cooperation with the base member (1) a passage through which the coolant flows, and a bellows-like flow straightening plate (6) disposed between the power semiconductor module (5) and the base member (1) in physical contact with the power semiconductor module (5) on one hand and with the base member (1) on the other hand. The flow straightening plate (6) partitions the passage into a plurality of flow straightening channels (14A, 14B).

摘要翻译： 设计成通过冷却水介质安装在功率半导体模块（5）上的易于组装的低成本散热器包括：基座部件（1），重叠在基体部件上的散热体（2） 1）与基部构件（1）协作形成冷却剂流过的通道，以及物理上设置在功率半导体模块（5）和基座构件（1）之间的波纹管状流动矫直板（6） 一方面与功率半导体模块（5）接触，另一方面与基座部件（1）接触。 流动矫直板（6）将通道分隔成多个流动矫直通道（14A，14B）。

公开(公告)号：US06983790B2

公开(公告)日：2006-01-10

申请号：US10618657

申请日：2003-07-15

申请人： Shigetoshi Ippoushi ,  Tetsuro Ogushi ,  Kazushige Nakao ,  Hiroaki Ishikawa ,  Toshiyuki Umemoto ,  Hiroshi Chiba ,  Mihoko Shimoji

发明人： Shigetoshi Ippoushi ,  Tetsuro Ogushi ,  Kazushige Nakao ,  Hiroaki Ishikawa ,  Toshiyuki Umemoto ,  Hiroshi Chiba ,  Mihoko Shimoji

IPC分类号： F28D15/00

CPC分类号： H01L23/427 ,  F28D1/0383 ,  F28D15/0233 ,  F28D15/0266 ,  F28F3/12 ,  H01L2924/0002 ,  H05K7/20272 ,  H01L2924/00

摘要： A heat transport device includes a container having a hollow structure including a fluid channel, at least one thermal-receiver heat exchanger and one thermal-radiator heat exchanger arranged side-by-side on an outer wall of the container along the fluid channel, and driving heat exchangers at respective terminal portions of the container. In this heat transport device, both ends of the fluid channel are closed to prevent intrusion of external air, and a liquid and a gas are sealed in the fluid channel. The driving heat exchangers cause the liquid to oscillate in the container along the internal fluid channel. The heat transport device provides low acoustic noise performance, improved temperature controllability, high heat transportation and heat radiating capacities, and improved heat transfer and fluid flow characteristics.

摘要翻译： 热传输装置包括具有包括流体通道的中空结构的容器，沿着流体通道并排设置在容器的外壁上的至少一个热接收器热交换器和一个散热器热交换器，以及 在容器的各个端部驱动热交换器。 在该传热装置中，流体通道的两端被封闭以防止外部空气的侵入，液体和气体被密封在流体通道中。 驱动热交换器使液体沿着内部流体通道在容器中振荡。 热传输装置提供低声噪声性能，改善的温度可控性，高热传输和散热能力，以及改善的传热和流体流动特性。

公开(公告)号：US09920428B2

公开(公告)日：2018-03-20

申请号：US14965367

申请日：2015-12-10

申请人： Norikazu Nakamura ,  Shoichi Miyahara ,  Hiroshi Chiba

发明人： Norikazu Nakamura ,  Shoichi Miyahara ,  Hiroshi Chiba

IPC分类号： C23C14/00 ,  C23C14/32 ,  C23C16/50 ,  C23C14/06 ,  C23C14/56 ,  H01J37/32 ,  H05H1/50

CPC分类号： C23C16/50 ,  C23C14/0605 ,  C23C14/325 ,  C23C14/564 ,  H01J37/32055 ,  H01J37/32357 ,  H05H1/50

摘要： A film deposition apparatus includes: a plasma generating section configured to generate plasma between a cathode target and an anode; a film deposition chamber in which a base material is placed; and a magnetic-field filter section configured to remove a particle from the plasma by a magnetic field and to transfer the plasma to the film deposition chamber. The magnetic-field filter section includes: a first housing area to which a first voltage is applied; and a second housing area, provided downstream of the first housing area in the moving direction of the plasma, to which a second voltage is applied.

公开(公告)号：US08599244B2

公开(公告)日：2013-12-03

申请号：US12331501

申请日：2008-12-10

申请人： Shinichiro Hirooka ,  Hiroshi Chiba

发明人： Shinichiro Hirooka ,  Hiroshi Chiba

IPC分类号： H04N13/02

CPC分类号： H04N5/2628 ,  G03B13/32 ,  H04N5/23212 ,  H04N5/23293 ,  H04N5/23296 ,  H04N5/272 ,  H04N13/10 ,  H04N13/239 ,  H04N13/296

摘要： An imaging apparatus comprises an image pickup unit, a cutout image generation unit for cutting out a specified area in a pickup image taken by the image pickup unit to generate a cutout image enlarged at a specified magnification, an image display unit for displaying one or both of the pickup image taken by the image pickup unit and the cutout image generated by the cutout image generation unit, a display image control unit for controlling a method of displaying an image the image display unit displays, a manual focus operation unit for the user to control through manual operation the focus position of the image pickup unit, and a manual zoom operation unit for the user to control the zoom magnification of the image pickup unit.

摘要翻译： 一种成像装置，包括图像拾取单元，切割图像生成单元，用于切割由图像拾取单元拍摄的拾取图像中的指定区域，以产生以指定倍率放大的切割图像;图像显示单元，用于显示一个或两个 由图像拾取单元拍摄的拾取图像和由切割图像生成单元生成的切割图像的显示图像控制单元，用于控制图像显示单元显示的图像的显示方法的显示图像控制单元，用户的手动对焦操作单元 通过手动操作图像拾取单元的对焦位置进行控制，以及用于使用者控制图像拾取单元的变焦倍率的手动变焦操作单元。