摘要:
A semiconductor device comprises a p-type semiconductor substrate, an n-type semiconductor well formed on the substrate and connected to a positive power supply, a p-type semiconductor source formed within the n-type semiconductor well, a p-type semiconductor layer formed within the n-type semiconductor well and having a lower impurity concentration than the p-type semiconductor source, a first gate electrode formed over a region between the p-type semiconductor source and the p-type semiconductor layer through an insulating film, an n-type semiconductor emitter formed over the p-type semiconductor layer within the n-type semiconductor well, a first conductive layer formed over the n-type semiconductor well to connect with said p-type semiconductor source.
摘要:
A semiconductor device of this invention includes a bipolar transistor and MOS transistors which are formed on the same semiconductor substrate. The bipolar transistor is hetero-bipolar transistor having a hetero junction. The hetero-bipolar transistor is a bipolar transistor of double-hetero structure in which a material used for forming the base region thereof has a band gap narrower than a material used for forming the emitter and collector regions thereof.
摘要:
A contact hole for guiding an emitter electrode of bipolar transistors continuously arrayed and a contact hole for guiding a base electrode are positioned not to be arranged in the continuous array direction of the bipolar transistors. Also, the emitter electrode and the base electrode are respectively drawn from these contact holes in two directions different from the continuous array direction of the bipolar transistors. At least one of the base electrode and the emitter electrode is formed on a conductive layer of a polycide structure contacting an active region in a substrate to be connected.
摘要:
A method of manufacturing a semiconductor device. A semiconductor substrate is prepared and a gate oxide film is formed on a surface of the semiconductor substrate. The gate oxide film is selectively removed to expose portions of the semiconductor substrate and a first polysilicon layer is formed on a resultant semiconductor structure. Impurities are implanted in the polysilicon layer and a resultant semiconductor structure is annealed to activate the impurities. The first polysilicon layer is patterned to form a base electrode of the bipolar transistor and a gate and/or drain electrode of the MOS transistor. An insulating layer is then formed on a resultant semiconductor structure. Portions of the semiconductor substrate are then selectively exposed and a second polysilicon layer is formed on a resultant semiconductor structure. The second polysilicon layer is then patterned to form an emitter electrode of the bipolar transistor.
摘要:
Disclosed here in is a semiconductor integrated circuit comprising a substrate, a memory cell array having a plurality of memory cells arranged in rows and columns, a plurality of word lines, and a plurality of bit lines, and a plurality of word-line drive circuits located near the memory cell array. Each of the word-line drive circuits is a Bi-NMOS circuit which comprises a bipolar transistor for pulling up the potential of the word line and an N-channel MOS transistor for pulling down the potential of the word line. The collector layers of the bipolar transistors are formed of one and the same layer.
摘要:
A method of manufacturing a semiconductor device. A semiconductor substrate is prepared and a gate oxide film is formed on a surface of the semiconductor substrate. The gate oxide film is selectively removed to expose portions of the semiconductor substrate and a first polysilicon layer is formed on a resultant semiconductor structure. Impurities are implanted in the polysilicon layer and a resultant semiconductor structure is annealed to activate the impurities. The first polysilicon layer is patterned to form a base electrode of the bipolar transistor and a gate and/or drain electrode of the MOS transistor. An insulating layer is then formed on a resultant semiconductor structure. Portions of the semiconductor substrate are then selectively exposed and a second polysilicon layer is formed on a resultant semiconductor structure. The second polysilicon layer is then patterned to form an emitter electrode of the bipolar transistor.
摘要:
A method of manufacturing a semiconductor device. A semiconductor substrate is prepared and a gate oxide film is formed on a surface of the semiconductor substrate. The gate oxide film is selectively removed to expose portions of the semiconductor substrate and a first polysilicon layer is formed on a resultant semiconductor structure. Impurities are implanted in the polysilicon layer and a resultant semiconductor structure is annealed to activate the impurities. The first polysilicon layer is patterned to form a base electrode of the bipolar transistor and a source drain electrode of the MOS transistor. An insulating layer is then formed on a resultant semiconductor structure. Portions of the semiconductor substrate are then selectively exposed and a second polysilicon layer is formed on a resultant semiconductor structure. The second polysilicon layer is then patterned to form an emitter electrode of the bipolar transistor.
摘要:
A semiconductor device includes a semiconductor substrate, a bipolar transistor and a MOS transistor. The bipolar transistor is formed on the semiconductor substrate and has electrodes. A base electrode of the bipolar transistor and the electrodes of the MOS transistor contain the same kind of impurity so as to form a single layer.
摘要:
An npn bipolar transistor and a p-channel MOS transistor are formed on a p-type silicon substrate. The outer base electrode of the npn bipolar transistor and the gate electrode of the p-channel MOS transistor contain a p-type impurity and are composed of films consisting of the same material. The inner and outer bases are formed in a surface region of the p-type silicon substrate. The outer base is connected to the outer base electrode. The emitter electrode of the npn bipolar transistor is formed on the inner base. A laminated film constituted by a silicon oxide film and a silicon nitride film is formed on a p-type silicon substrate at a position between the outer base electrode and the emitter electrode.
摘要:
A semiconductor device of the present invention includes a bipolar transistor and MOS transistors which are formed on the same semiconductor substrate. The bipolar transistor is heterojunction transistor having a hetero junction. The hetero-bipolar transistor is a bipolar transistor of double-hetero structure in which a material used for forming the base region thereof has a band gap narrower than a material used for forming the emitter and collector regions thereof.