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    Manufacturing method of CMOS transistor
    3.
    发明授权
    Manufacturing method of CMOS transistor 失效
    CMOS晶体管的制造方法

    公开(公告)号：US5756382A

    公开(公告)日：1998-05-26

    申请号：US784354

    申请日：1997-01-23

    申请人： Mizuki Segawa ,  Yoshiaki Kato ,  Hiroaki Nakaoka ,  Takashi Nakabayashi ,  Atsushi Hori ,  Hiroshi Masuda ,  Ichiro Matsuo ,  Akihira Shinohara ,  Takashi Uehara ,  Mitsuo Yasuhira

    发明人： Mizuki Segawa ,  Yoshiaki Kato ,  Hiroaki Nakaoka ,  Takashi Nakabayashi ,  Atsushi Hori ,  Hiroshi Masuda ,  Ichiro Matsuo ,  Akihira Shinohara ,  Takashi Uehara ,  Mitsuo Yasuhira

    IPC分类号： H01L21/8238 ,  H01L21/265

    CPC分类号： H01L21/823814 ,  Y10S148/147

    摘要： Gate electrodes of an N-channel transistor and a P-channel transistor are formed on a semiconductor substrate with a gate insulator therebetween. After conducting a first thermal treatment to the gate electrodes, N-type heavily doped diffusion layers to be a source or a drain of the N-channel transistor are formed using the gate electrode of the N-channel transistor as a mask. After conducting a second thermal treatment to the N-type heavily doped diffusion layers at a lower temperature than that of the first thermal treatment, P-type heavily doped diffusion layers to be a source or a drain of the P-channel transistor are formed using the gate electrode of the P-channel transistor as a mask. Then, a third thermal treatment is conducted to the P-type heavily doped diffusion layers at a lower temperature than that of the second thermal treatment.

    摘要翻译： N沟道晶体管和P沟道晶体管的栅电极形成在半导体衬底上，栅极绝缘体在其间。 在对栅电极进行第一热处理之后，使用N沟道晶体管的栅电极作为掩模来形成作为N沟道晶体管的源极或漏极的N型重掺杂扩散层。 在比第一热处理的温度低的情况下对N型重掺杂扩散层进行第二次热处理之后，使用P型重掺杂扩散层作为P沟道晶体管的源极或漏极，形成为使用 P沟道晶体管的栅电极作为掩模。 然后，在比第二热处理的温度低的温度下对P型重掺杂扩散层进行第三次热处理。

    Manufacturing method of CMOS transistor
    4.
    发明授权
    Manufacturing method of CMOS transistor 失效
    CMOS晶体管的制造方法

    公开(公告)号：US5726071A

    公开(公告)日：1998-03-10

    申请号：US789315

    申请日：1997-01-23

    申请人： Mizuki Segawa ,  Yoshiaki Kato ,  Hiroaki Nakaoka ,  Takashi Nakabayashi ,  Atsushi Hori ,  Hiroshi Masuda ,  Ichiro Matsuo ,  Akihira Shinohara ,  Takashi Uehara ,  Mitsuo Yasuhira

    发明人： Mizuki Segawa ,  Yoshiaki Kato ,  Hiroaki Nakaoka ,  Takashi Nakabayashi ,  Atsushi Hori ,  Hiroshi Masuda ,  Ichiro Matsuo ,  Akihira Shinohara ,  Takashi Uehara ,  Mitsuo Yasuhira

    IPC分类号： H01L21/8238 ,  H01L21/70

    CPC分类号： H01L21/823814 ,  Y10S148/147

    摘要： Gate electrodes of an N-channel transistor and a P-channel transistor are formed on a semiconductor substrate with a gate insulator therebetween. After conducting a first thermal treatment to the gate electrodes, N-type heavily doped diffusion layers to be a source or a drain of the N-channel transistor are formed using the gate electrode of the N-channel transistor as a mask. After conducting a second thermal treatment to the N-type heavily doped diffusion layers at a lower temperature than that of the first thermal treatment. P-type heavily doped diffusion layers to be a source or a drain of the P-channel transistor are formed using the gate electrode of the P-channel transistor as a mask. Then, a third thermal treatment is conducted to the P-type heavily doped diffusion layers at a lower temperature than that of the second thermal treatment.

    摘要翻译： N沟道晶体管和P沟道晶体管的栅电极形成在半导体衬底上，栅极绝缘体在其间。 在对栅电极进行第一热处理之后，使用N沟道晶体管的栅电极作为掩模来形成作为N沟道晶体管的源极或漏极的N型重掺杂扩散层。 在比第一热处理的温度低的温度下对N型重掺杂扩散层进行第二次热处理。 使用P沟道晶体管的栅电极作为掩模来形成作为P沟道晶体管的源极或漏极的P型重掺杂扩散层。 然后，在比第二热处理的温度低的温度下对P型重掺杂扩散层进行第三次热处理。

    Manufacturing method of CMOS transistor
    5.
    发明授权
    Manufacturing method of CMOS transistor 失效
    CMOS晶体管的制造方法

    公开(公告)号：US5686340A

    公开(公告)日：1997-11-11

    申请号：US723710

    申请日：1996-09-30

    申请人： Mizuki Segawa ,  Yoshiaki Kato ,  Hiroaki Nakaoka ,  Takashi Nakabayashi ,  Atsushi Hori ,  Hiroshi Masuda ,  Ichiro Matsuo ,  Akihira Shinohara ,  Takashi Uehara ,  Mitsuo Yasuhira

    发明人： Mizuki Segawa ,  Yoshiaki Kato ,  Hiroaki Nakaoka ,  Takashi Nakabayashi ,  Atsushi Hori ,  Hiroshi Masuda ,  Ichiro Matsuo ,  Akihira Shinohara ,  Takashi Uehara ,  Mitsuo Yasuhira

    IPC分类号： H01L21/8238 ,  H01L21/265

    CPC分类号： H01L21/823814 ,  Y10S148/147

    摘要： Gate electrodes of an N-channel transistor and a P-channel transistor are formed on a semiconductor substrate with a gate insulator therebetween. After conducting a first thermal treatment to the gate electrodes, N-type heavily doped diffusion layers to be a source or a drain of the N-channel transistor are formed using the gate electrode of the N-channel transistor as a mask. After conducting a second thermal treatment to the N-type heavily doped diffusion layers at a lower temperature than that of the first thermal treatment. P-type heavily doped diffusion layers to be a source or a drain of the P-channel transistor are formed using the gate electrode of the P-channel transistor as a mask. Then, a third thermal treatment is conducted to the P-type heavily doped diffusion layers at a lower temperature than that of the second thermal treatment.

    摘要翻译： N沟道晶体管和P沟道晶体管的栅电极形成在半导体衬底上，栅极绝缘体在其间。 在对栅电极进行第一热处理之后，使用N沟道晶体管的栅电极作为掩模来形成作为N沟道晶体管的源极或漏极的N型重掺杂扩散层。 在比第一热处理的温度低的温度下对N型重掺杂扩散层进行第二次热处理。 使用P沟道晶体管的栅电极作为掩模来形成作为P沟道晶体管的源极或漏极的P型重掺杂扩散层。 然后，在比第二热处理的温度低的温度下对P型重掺杂扩散层进行第三次热处理。

    Method of manufacturing a semiconductor device using a trench isolation technique
    8.
    发明授权
    Method of manufacturing a semiconductor device using a trench isolation technique 失效
    使用沟槽隔离技术制造半导体器件的方法

    公开(公告)号：US6143626A

    公开(公告)日：2000-11-07

    申请号：US330068

    申请日：1999-06-11

    申请人： Toshiki Yabu ,  Takashi Uehara ,  Mizuki Segawa ,  Takashi Nakabayashi

    发明人： Toshiki Yabu ,  Takashi Uehara ,  Mizuki Segawa ,  Takashi Nakabayashi

    IPC分类号： H01L21/762 ,  H01L21/76

    CPC分类号： H01L21/76229

    摘要： On a semiconductor substrate are successively deposited a silicon dioxide film and a silicon nitride film. The silicon nitride film, the silicon dioxide film, and the semiconductor substrate are sequentially etched using a photoresist film with an opening corresponding to an isolation region, thereby forming a trench. After depositing a diffusion preventing film, there is deposited an insulating film for isolation having reflowability. Although a void is formed in the insulating film for isolation in the isolation region, the insulating film for isolation is caused to reflow, thereby eliminating the void. After that, the whole substrate is planarized by CMP so as to remove the silicon nitride film and the silicon dioxide film, followed by the formation of gate insulating films, gate electrodes, sidewalls, and source/drain regions in respective element formation regions. Thus, in a highly integrated semiconductor device having a trench isolation, degradation of reliability resulting from the opening of the void in the surface of isolation is prevented.

    摘要翻译： 在半导体衬底上依次沉积二氧化硅膜和氮化硅膜。 使用具有对应于隔离区域的开口的光致抗蚀剂膜，依次蚀刻氮化硅膜，二氧化硅膜和半导体衬底，从而形成沟槽。 在沉积防扩散膜之后，沉积具有可回流性的用于隔离的绝缘膜。 虽然在隔离区域中用于隔离的绝缘膜中形成空隙，但是使用于隔离的绝缘膜回流，从而消除空隙。 之后，通过CMP对整个基板进行平坦化，以除去氮化硅膜和二氧化硅膜，然后在各个元件形成区域中形成栅极绝缘膜，栅极电极，侧壁和源极/漏极区域。 因此，在具有沟槽隔离的高度集成的半导体器件中，防止了由于隔离表面中的空隙的打开引起的可靠性降低。

    Semiconductor device and method of manufacturing the same
    9.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号：US07126174B2

    公开(公告)日：2006-10-24

    申请号：US10995283

    申请日：2004-11-24

    申请人： Mizuki Segawa ,  Isao Miyanaga ,  Toshiki Yabu ,  Takashi Nakabayashi ,  Takashi Uehara ,  Kyoji Yamashita ,  Takaaki Ukeda ,  Masatoshi Arai ,  Takayuki Yamada ,  Michikazu Matsumoto

    发明人： Mizuki Segawa ,  Isao Miyanaga ,  Toshiki Yabu ,  Takashi Nakabayashi ,  Takashi Uehara ,  Kyoji Yamashita ,  Takaaki Ukeda ,  Masatoshi Arai ,  Takayuki Yamada ,  Michikazu Matsumoto

    IPC分类号： H01L29/76

    CPC分类号： H01L29/6659 ,  H01L21/76224 ,  H01L29/665 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An isolation which is higher in a stepwise manner than an active area of a silicon substrate is formed. On the active area, an FET including a gate oxide film, a gate electrode, a gate protection film, sidewalls and the like is formed. An insulating film is deposited on the entire top surface of the substrate, and a resist film for exposing an area stretching over the active area, a part of the isolation and the gate protection film is formed on the insulating film. There is no need to provide an alignment margin for avoiding interference with the isolation and the like to a region where a connection hole is formed. Since the isolation is higher in a stepwise manner than the active area, the isolation is prevented from being removed by over-etch in the formation of a connection hole to come in contact with a portion where an impurity concentration is low in the active area. In this manner, the integration of a semiconductor device can be improved and an area occupied by the semiconductor device can be decreased without causing degradation of junction voltage resistance and increase of a junction leakage current in the semiconductor device.

    摘要翻译： 形成了比硅衬底的有源区域更高级的隔离。 在有源区域上，形成包括栅极氧化膜，栅电极，栅极保护膜，侧壁等的FET。 绝缘膜沉积在基板的整个顶表面上，并且在绝缘膜上形成用于暴露在有源区上延伸的区域，一部分隔离栅极保护膜的抗蚀剂膜。 不需要提供用于避免与形成连接孔的区域的隔离等的干涉的取向余量。 由于隔离比有源区域以逐步方式更高，所以通过在形成连接孔中的过度蚀刻来防止隔离物与有源区域中杂质浓度低的部分接触。 以这种方式，可以改善半导体器件的集成，并且可以降低半导体器件占据的面积，而不会导致半导体器件中的结电阻的劣化和结漏电流的增加。