Curatives for epoxy resin, curing accelerator, and epoxy resin composition
    1.
    发明申请
    Curatives for epoxy resin, curing accelerator, and epoxy resin composition 有权
    环氧树脂固化剂,固化促进剂和环氧树脂组合物

    公开(公告)号:US20060287465A1

    公开(公告)日:2006-12-21

    申请号:US11510686

    申请日:2006-08-25

    IPC分类号: C08G59/62

    CPC分类号: C08G59/621 C08G59/683

    摘要: The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures. The curative is characterized by being a clathrate comprising a tetrakisphenol compound represented by a general formula (I), wherein X represents (CH2)n, wherein n is 0, 1, 2 or 3, and R1 to R8 each represents hydrogen, a lower alkyl, optionally-substituted phenyl, halogeno or a lower alkoxy, and the curing accelerator is characterized by being a clathrate comprising a tetrakisphenol compound represented by the general formula (I) shown above and a compound accelerating the curing of a compound which reacts with the epoxy group of an epoxy resin to cure the resin.

    摘要翻译: 本发明的目的是提供用于环氧树脂的固化剂和用于环氧树脂的固化促进剂,它们都具有改进的升华和分解性能,并且当与环氧树脂混合时,能够使混合物的热稳定性大大提高 对于固化反应的控制是重要的,并且具有延长的适用期(作为包含环氧树脂,固化剂等的单组分混合物的稳定性)和在低温下的改进的固化性。 固化剂的特征在于包含由通式(I)表示的四苯酚化合物的包合物,其中X表示(CH 2)2,其中n为0,1,2或3,R R 8和R 8各自表示氢,低级烷基,任选取代的苯基,卤代或低级烷氧基,固化促进剂的特征在于包含四苯酚的包合物 由上述通式(I)表示的化合物和加速与环氧树脂的环氧基反应的化合物固化以使树脂固化的化合物。

    Composition of epoxy resin and clathrate of tetrakisphenol and epoxy-reactive curing compound
    2.
    发明授权
    Composition of epoxy resin and clathrate of tetrakisphenol and epoxy-reactive curing compound 有权
    环氧树脂和四苯酚和环氧反应性固化化合物的包合物的组成

    公开(公告)号:US06727325B1

    公开(公告)日:2004-04-27

    申请号:US09331829

    申请日:1999-06-23

    IPC分类号: C08G5942

    摘要: The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures. The curative is characterized by being a clathrate comprising a tetrakisphenol compound represented by a general formula [I]; wherein X represents (CH2)n, wherein n is 0, 1, 2 or 3, and R1 to R8 each represents hydrogen, a lower alkyl, optionally-substituted phenyl, halogeno or a lower alkoxy, and the curing accelerator is characterized by being a clathrate comprising a tetrakisphenol compound represented by the general formula [I] shown above and a compound accelerating the curing of a compound which reacts with the epoxy group of an epoxy resin to cure the resin.

    摘要翻译: 本发明的目的是提供用于环氧树脂的固化剂和用于环氧树脂的固化促进剂,它们都具有改进的升华和分解性能,并且当与环氧树脂混合时,能够使混合物的热稳定性大大提高 对于控制固化反应和延长使用寿命(作为包含环氧树脂的单组分混合物的稳定性,固化剂等)是重要的,并且在低温下具有改进的固化性。该固化剂的特征在于包含一种 由通式[I]表示的四苯酚化合物;其中X表示(CH 2)n,其中n为0,1,2或3,R 1至R 8各自表示氢,低级烷基, 取代的苯基,卤代或低级烷氧基,并且固化促进剂的特征在于包含上述通式[I]表示的四苯酚化合物和加速共聚物固化的化合物的包合物 其与环氧树脂的环氧基反应以固化树脂。

    Molecular compounds containing polymers having hydrogen bond sites as the constituent compounds
    3.
    发明授权
    Molecular compounds containing polymers having hydrogen bond sites as the constituent compounds 有权
    含有氢键位点的聚合物的分子化合物作为构成化合物

    公开(公告)号:US07601784B2

    公开(公告)日:2009-10-13

    申请号:US11125283

    申请日:2005-05-09

    IPC分类号: C08G65/322

    CPC分类号: C08K5/13

    摘要: It is an object of the present invention to provide molecular compounds useful in the fields of state-of the-art materials, such as formulations, waste water treatments, energy transducers, conductors and bio-model reactions, in a way that interaction points and forces working inside polymer assemblies are fixed as well as controlled so that constituent polymers are aligned and modified. It is also an object of the present invention to provide methods for aligning and/or modifying polymers having hydrogen bond sites. A molecular compound is produced from a tetrakis aryl compound represented by Formula (I) (wherein, X is (CH2)n, or p-phenylene; n is 0, 1, 2 or 3; Y is hydroxyl, carboxyl or optionally substituted amino: and R1 and R2 are each hydrogen, lower alkyl, optionally substituted phenyl, halogen or lower alkoxy) and a polymer having hydrogen bond sites, such as polyethers, polyalcohols or polyamines.

    摘要翻译: 本发明的目的是提供分子化合物,其可用于现有技术材料领域,例如制剂,废水处理,能量换能器,导体和生物模型反应,其方式是相互作用点和 在聚合物组件内部工作的力是固定的并且受到控制,使得组分聚合物被对准和改性。 本发明的另一个目的是提供用于对齐和/或改性具有氢键位置的聚合物的方法。 分子化合物由式(I)表示的四芳基化合物(其中X为(CH 2)n或对亚苯基; n为0,1,2或3; Y为羟基,羧基或任选取代的氨基 :和R 1和R 2各自为氢,低级烷基,任选取代的苯基,卤素或低级烷氧基)和具有氢键位置的聚合物,例如聚醚,多元醇或多胺。

    Molecular compounds containing polymers having hydrogen bond sites as the constituent compounds
    4.
    发明申请
    Molecular compounds containing polymers having hydrogen bond sites as the constituent compounds 有权
    含有氢键位点的聚合物的分子化合物作为构成化合物

    公开(公告)号:US20050228167A1

    公开(公告)日:2005-10-13

    申请号:US11125283

    申请日:2005-05-09

    CPC分类号: C08K5/13

    摘要: It is an object of the present invention to provide molecular compounds useful in the fields of state-of the-art materials, such as formulations, waste water treatments, energy transducers, conductors and bio-model reactions, in a way that interaction points and forces working inside polymer assemblies are fixed as well as controlled so that constituent polymers are aligned and modified. It is also an object of the present invention to provide methods for aligning and/or modifying polymers having hydrogen bond sites. A molecular compound is produced from a tetrakis aryl compound represented by Formula (I) (wherein, X is (CH2)n, or p-phenylene; n is 0, 1, 2 or 3; Y is hydroxyl, carboxyl or optionally substituted amino: and R1 and R2 are each hydrogen, lower alkyl, optionally substituted phenyl, halogen or lower alkoxy) and a polymer having hydrogen bond sites, such as polyethers, polyalcohols or polyamines.

    摘要翻译: 本发明的目的是提供分子化合物,其可用于现有技术材料领域,例如制剂,废水处理,能量换能器,导体和生物模型反应,其方式是相互作用点和 在聚合物组件内部工作的力是固定的并且受到控制,使得组分聚合物被对准和改性。 本发明的另一个目的是提供用于对齐和/或改性具有氢键位置的聚合物的方法。 分子化合物由式(I)表示的四芳基化合物(其中X为(CH 2)n)或对亚苯基,n为0, 1,2或3; Y是羟基,羧基或任选取代的氨基; R 1和R 2各自为氢,低级烷基,任选取代的苯基,卤素或低级 烷氧基)和具有氢键位置的聚合物,例如聚醚,多元醇或多胺。

    Molecular compounds containing novel carboxylic acid derivatives as the constituent compound
    6.
    发明授权
    Molecular compounds containing novel carboxylic acid derivatives as the constituent compound 有权
    含有新型羧酸衍生物作为组分化合物的分子化合物

    公开(公告)号:US06566548B1

    公开(公告)日:2003-05-20

    申请号:US09806601

    申请日:2001-03-29

    IPC分类号: C07C6976

    摘要: Novel molecular compounds containing carboxylic acid derivatives represented by general formula (I) or (II) as the constituent compound and exhibiting excellent performances in various technical fields including selective separation of useful substances, chemical stabilization, nonvolatilization, prolongation of release and powderization, wherein X is (CH2)n or p-phenylene; n is 0, 1, 2 or 3; R1 to R8 and R13 to R20 are each hydrogen, C1-C6 alkyl, C2-C4 alkenyl, phenyl optionally substituted with C1-C6 alkyl, halogeno or C1-C6 alkoxy; and R9 to R12 and R21 to R24 are each hydrogen, C1-C6 alkyl, C2-C4 alkenyl, C11-C12 aralkyl or an alkali metal.

    摘要翻译: 含有通式(I)或(II)表示的羧酸衍生物作为构成化合物的新型分子化合物,在有用物质的选择性分离,化学稳定化,非挥发性,延长释放和粉化等各种技术领域表现出优异的性能,其中X 是(CH 2)n或对亚苯基; n为0,1,2或3; R 1至R 8和R 13至R 20各自为氢,C 1 -C 6烷基,C 2 -C 4烯基,任选被C 1 -C 6烷基,卤代或C 1 -C 6烷氧基取代的苯基; 和R 9至R 12和R 21至R 24各自为氢,C 1 -C 6烷基,C 2 -C 4烯基,C 11 -C 12芳烷基或碱金属。

    Composition for protective coating material
    8.
    发明授权
    Composition for protective coating material 失效
    保护涂层材料的组成

    公开(公告)号:US4645688A

    公开(公告)日:1987-02-24

    申请号:US679460

    申请日:1984-12-07

    摘要: There are disclosed a composition for protective coating material, preferably for a protective coating material of a semiconductor device which is constituted of principal elements of a semiconductor memory element, an encapsulating layer containing an inorganic material for encapsulating said element and a layer of a cured protective coating material arranged between said memory element and said encapsulating layer, which is composed of a polyamide acid obtained by the reaction of a diaminosiloxane, an organic diamine containing no silicon and an organic tetrabasic acid dianhydride, and a semiconductor device having a layer of a cured protective coating material composed of a polyimide-silicone copolymer obtained by dehydrating ring closure of the above-mentioned polyamide acid.

    摘要翻译: 公开了一种用于保护涂层材料的组合物,优选用于半导体器件的保护涂层材料,其由半导体存储元件的主要元件,包含用于封装所述元件的无机材料的封装层和固化保护层 布置在所述存储元件和所述封装层之间的涂料,其由通过二氨基硅氧烷,不含硅的有机二胺和有机四元酸二酐反应获得的聚酰胺酸和具有固化的层的半导体器件 由通过上述聚酰胺酸脱水闭环得到的聚酰亚胺 - 硅氧烷共聚物构成的保护涂料。