公开(公告)号：US20110089137A1

公开(公告)日：2011-04-21

申请号：US12902721

申请日：2010-10-12

申请人： Hiroshi TANAKA ,  Teruomi MINAMI ,  Yosuke KAWABUCHI ,  Norihiro ITO ,  Fumihiro KAMIMURA ,  Takashi YABUTA ,  Kazuki KOSAI ,  Takeshi UNO ,  Kenji SEKIGUCHI ,  Yasushi FUJII

发明人： Hiroshi TANAKA ,  Teruomi MINAMI ,  Yosuke KAWABUCHI ,  Norihiro ITO ,  Fumihiro KAMIMURA ,  Takashi YABUTA ,  Kazuki KOSAI ,  Takeshi UNO ,  Kenji SEKIGUCHI ,  Yasushi FUJII

IPC分类号： H05K3/00

CPC分类号： H01L21/02057 ,  H01L21/67051

摘要： Provided are a substrate liquid processing apparatus, a substrate liquid processing method, and a computer readable storage medium having a substrate liquid processing program stored therein that can prevent the occurrence of the electrostatic breakdown caused by the discharge of electric charges in a substrate. The substrate liquid processing apparatus processes a circuit-forming surface of the substrate with a chemical liquid. Furthermore, prior to processing the substrate with the chemical liquid, the substrate liquid processing apparatus performs an anti-static process for an surface opposite to the circuit-forming surface of the substrate by an anti-static liquid, thereby emitting the electric charges on the substrate.

摘要翻译： 提供一种基板液体处理装置，基板液体处理方法以及其中存储有基板液体处理程序的计算机可读存储介质，其可以防止由基板中的电荷放电引起的静电破坏的发生。 基板液体处理装置用化学液体处理基板的电路形成表面。 此外，在用化学液体处理基板之前，基板液体处理装置通过防静电液体对与基板的电路形成面相反的表面进行防静电处理，从而将电荷 基质。

公开(公告)号：US20120312332A1

公开(公告)日：2012-12-13

申请号：US13591877

申请日：2012-08-22

申请人： Teruomi MINAMI ,  Norihiro ITO ,  Yuji KAMIKAWA

发明人： Teruomi MINAMI ,  Norihiro ITO ,  Yuji KAMIKAWA

IPC分类号： B08B3/08 ,  B08B3/02

CPC分类号： H01L21/67051 ,  H01L21/67028 ,  H01L21/67034

摘要： A liquid processing apparatus 1 comprises a casing 5, a substrate holding mechanism 20 that holds a wafer (substrate to be processed) W, a process-liquid supplying mechanism 30 that supplies a process liquid, a draining cup 12 that receives a process liquid, and a draining pipe 13 that discharges a process liquid outside. The process-liquid supplying mechanism 30 includes a first chemical-liquid supply mechanism that supplies a hydrofluoric process liquid, and a drying-liquid supplying mechanism that supplies an organic solvent for drying a wafer W. A control part 50 causes the first chemical-liquid supplying mechanism to supply a hydrofluoric process liquid, and then causes the drying-liquid supplying mechanism to supply an organic solvent. In addition, before the control part 50 causes the drying-liquid supplying mechanism to supply an organic solvent, the control part causes a cleaning mechanism 10 to remove an alkaline component in a casing 5.

摘要翻译： 液体处理装置1包括壳体5，保持晶片（待处理基板）W的基板保持机构20，供给处理液的处理液供给机构30，接收处理液的排出杯12， 以及将处理液体排出到外部的排水管13。 处理液供给机构30包括供给氢氟化处理液的第一药液供给机构和供给干燥晶片W的有机溶剂的干燥液供给机构。控制部50使第一药液 供给机构供给氢氟化处理液，然后使干燥液供给机构供给有机溶剂。 此外，在控制部50使干燥液供给机构供给有机溶剂之前，控制部使清洁机构10除去壳体5内的碱性成分。

公开(公告)号：US20130014784A1

公开(公告)日：2013-01-17

申请号：US13546394

申请日：2012-07-11

申请人： Norihiro ITO ,  Kazuhiro AlURA ,  Naoki SHINDO ,  Yosuke HACHIYA ,  Takashi NAGAI

发明人： Norihiro ITO ,  Kazuhiro AlURA ,  Naoki SHINDO ,  Yosuke HACHIYA ,  Takashi NAGAI

IPC分类号： B08B7/04 ,  B08B3/10 ,  B08B3/08

CPC分类号： H01L21/67051 ,  G03F7/423

摘要： A top plate 32 is provided to be moved in a horizontal direction between an advanced position, in which the top plate 32 covers from above a substrate W held by a substrate holding unit 21, and a retracted position that is retracted from the advanced position. An air hood 70 configured to supply a purified gas downward is provided to be lifted between a lower position, in which the air hood covers from above the substrate W held by the substrate holding unit 21, and an upper position located above the lower position.

摘要翻译： 顶板32设置成在顶板32从由基板保持单元21保持的基板W上方覆盖的前进位置和从前进位置缩回的缩回位置之间沿水平方向移动。 被配置为向下供给净化气体的空气罩70被设置为在从由基板保持单元21保持的基板W的上方覆盖着空气罩的下部位置和位于下部位置上方的上部位置之间提升。

公开(公告)号：US20100031980A1

公开(公告)日：2010-02-11

申请号：US12533743

申请日：2009-07-31

申请人： Norihiro ITO ,  Hidemasa ARATAKE

发明人： Norihiro ITO ,  Hidemasa ARATAKE

IPC分类号： B08B3/04

CPC分类号： B08B3/04 ,  H01L21/67051 ,  Y10S134/902

摘要： Disclosed is a liquid treatment apparatus capable of effectively exhausting processing liquid atmosphere around a target object. The liquid treatment apparatus includes a container, a support part located within the container that supports the target object, a rotation driving mechanism to rotate the target object supported by the support part, a processing liquid supply mechanism to supply a processing liquid to the target object, and a rotation cup, which is located outside of the outer circumference of the target object and is rotatable together with the support part. A rotation exhaust cup is arranged above the rotation cup and is rotatable together with the rotation cup. A discharge mechanism discharges processing liquid atmosphere guided by the rotation cup and the rotation exhaust cup.

摘要翻译： 公开了能够有效地排出目标物体周围的处理液体气氛的液体处理装置。 液体处理装置包括容器，位于容器内的支撑目标物体的支撑部，旋转驱动机构，使由支撑部支撑的目标物体旋转;处理液供给机构，用于向目标物体供给处理液 以及旋转杯，其位于目标物体的外周的外侧，并与支撑部一起旋转。 旋转排气杯设置在旋转杯的上方，并与旋转杯一起旋转。 排出机构排出由旋转杯和旋转排气杯引导的处理液体气氛。

公开(公告)号：US20090056758A1

公开(公告)日：2009-03-05

申请号：US12204234

申请日：2008-09-04

申请人： Norihiro ITO ,  Osamu KURODA

发明人： Norihiro ITO ,  Osamu KURODA

IPC分类号： B08B7/04 ,  B08B3/04

CPC分类号： H01L21/67051 ,  H01L21/67265 ,  H01L21/68742

摘要： An apparatus and a method for accurately determining if a substrate is properly retained by a substrate-retaining mechanism, lowering the manufacturing cost, and instantly detecting any fracture of the substrate during treatment are disclosed. The apparatus includes a substrate-retaining mechanism to retain a wafer, a treatment liquid supply mechanism to supply a treatment liquid to the wafer, and a rotatable cup adapted to rotate as an integral unit with the substrate-retaining mechanism while covering the outer peripheral portion of the wafer. The substrate-retaining mechanism has a retaining member. A second end of the retaining member is in the upper position when a first end of the retaining member retains a wafer, or in the lower position when the first end is retaining no wafer. A touch sensor is arranged below the second end of the retaining member so that, when the second end is in the lower position, it can touch the second end.

摘要翻译： 公开了一种用于准确地确定基板是否被基板保持机构适当地保持的装置和方法，降低了制造成本，并且立即检测了处理期间基板的任何断裂。 该装置包括：保持晶片的基板保持机构，向晶片供给处理液的处理液供给机构，以及适于作为与基板保持机构一体化的单元旋转的可旋转杯，同时覆盖外周部 的晶片。 基板保持机构具有保持构件。 当保持构件的第一端保持晶片时，保持构件的第二端处于上部位置，或者当第一端不保留晶片时位于下部位置。 触摸传感器布置在保持构件的第二端的下方，使得当第二端处于下部位置时，触摸传感器可以接触第二端。

公开(公告)号：US20110023909A1

公开(公告)日：2011-02-03

申请号：US12837840

申请日：2010-07-16

申请人： Norihiro ITO

发明人： Norihiro ITO

IPC分类号： B08B3/04

CPC分类号： H01L21/6708 ,  H01L21/67051 ,  H01L21/67248 ,  Y10S134/902

摘要： The liquid processing apparatus includes: a liquid supply mechanism; a supply line connected to the liquid supply mechanism, the supply line having a discharge opening for discharging a temperature-regulated liquid; a processing unit supporting the discharge opening of the supply line; a return line configured to return the liquid supplied to the supply line to the liquid supply mechanism; and a liquid-supply switching valve configured to switch between supply of the liquid, which is used in a processing of an object to be processed in the processing unit, and stoppage of the liquid supply. The liquid-supply switching valve is disposed on the supply line on a route of the liquid returning from the supply line to the liquid supply mechanism through the return line.

摘要翻译： 液体处理装置包括：液体供给机构; 连接到液体供给机构的供给管线，供给管线具有用于排出温度调节液体的排出口; 支撑供给管线的排出口的处理单元; 返回管线，被配置为将供应到所述供应管线的液体返回到所述液体供应机构; 以及液体供给切换阀，其配置为在所述处理单元中的被处理物的处理中使用的液体的供给与所述液体供给的停止之间切换。 液体供给切换阀通过返回管路从供给管路返回到液体供给机构的液体的路线配置在供给管路上。