公开(公告)号：US07029555B2

公开(公告)日：2006-04-18

申请号：US10704709

申请日：2003-11-12

申请人： Hiroshi Yamanaka ,  Tatsuya Fujimura

发明人： Hiroshi Yamanaka ,  Tatsuya Fujimura

IPC分类号： D21F1/16 ,  D21F1/46 ,  D21F1/60 ,  D03D3/02

CPC分类号： D21F1/46 ,  D21F1/60 ,  D21F3/105 ,  Y10S162/903 ,  Y10S162/904 ,  Y10T428/19 ,  Y10T428/192

摘要： A diagonally joined cylindrical fabric in the form of a cylindrical endless fabric is obtained by shifting ends of facing wefts of a non-endless fabric leftward or rightward and joining together the ends of the wefts to thereby form a joining portion inclined relative to an axis of a cylinder. The cylindrical fabric comprises a weave pattern in which warp passes over continuous two or more wefts, then passes under a less number of wefts, the joining portion at ends of the fabric formed into an endless cylindrical shape is inclined relative to the axis at 25° to 5°. The surface of the cylindrical fabric is formed with crimps that are longer in a face length direction than in a circumferential direction.

摘要翻译： 圆柱形环形织物形式的对角接合的圆柱形织物通过向左或向右移动非环形织物的纬纱的端部而获得，并将纬纱的端部接合在一起，从而形成一个相对于 一个圆筒。 圆筒形织物包括织造图案，其中经过连续的两个或多个纬纱经过，然后在较少数量的纬纱下通过，形成环形圆柱形的织物端部处的接合部分相对于25°的轴线倾斜 至5°。 圆筒形织物的表面形成有在面长度方向上比圆周方向长的卷曲。

公开(公告)号：US20050019521A1

公开(公告)日：2005-01-27

申请号：US10704709

申请日：2003-11-12

申请人： Hiroshi Yamanaka ,  Tatsuya Fujimura

发明人： Hiroshi Yamanaka ,  Tatsuya Fujimura

IPC分类号： D06H5/00 ,  D03D1/00 ,  D03D15/02 ,  D21F1/12 ,  D21F1/46 ,  D21F1/60 ,  D21F3/10 ,  D21F7/10 ,  D21F3/00 ,  B32B3/00

CPC分类号： D21F1/46 ,  D21F1/60 ,  D21F3/105 ,  Y10S162/903 ,  Y10S162/904 ,  Y10T428/19 ,  Y10T428/192

摘要： A diagonally joined cylindrical fabric in the form of a cylindrical endless fabric is obtained by shifting ends of facing wefts of a non-endless fabric leftward or rightward and joining together the ends of the wefts to thereby form a joining portion inclined relative to an axis of a cylinder. The cylindrical fabric comprises a weave pattern in which warp passes over continuous two or more wefts, then passes under a less number of wefts, the joining portion at ends of the fabric formed into an endless cylindrical shape is inclined relative to the axis at 25° to 5°. The surface of the cylindrical fabric is formed with crimps that are longer in a face length direction than in a circumferential direction.

摘要翻译： 圆柱形环形织物形式的对角接合的圆柱形织物通过向左或向右移动非环形织物的纬纱的端部而获得，并将纬纱的端部接合在一起，从而形成一个相对于 一个圆筒。 圆筒形织物包括织造图案，其中经过连续的两个或多个纬纱经过，然后在较少数量的纬纱下通过，形成环形圆柱形的织物端部处的接合部分相对于25°的轴线倾斜 至5°。 圆筒形织物的表面形成有在面长度方向上比圆周方向长的卷曲。

公开(公告)号：US09478682B2

公开(公告)日：2016-10-25

申请号：US13806111

申请日：2011-06-23

申请人： Masao Kirihara ,  Hiroshi Yamanaka ,  Yoshiharu Sanagawa ,  Takanori Aketa ,  Yushi Nakamura ,  Mitsuhiko Ueda

发明人： Masao Kirihara ,  Hiroshi Yamanaka ,  Yoshiharu Sanagawa ,  Takanori Aketa ,  Yushi Nakamura ,  Mitsuhiko Ueda

IPC分类号： H01L31/0232 ,  H01L31/024 ,  G01J5/04 ,  G01J5/06 ,  G01J5/08 ,  G01J5/12

CPC分类号： H01L31/024 ,  G01J5/04 ,  G01J5/045 ,  G01J5/06 ,  G01J5/08 ,  G01J5/0806 ,  G01J5/0831 ,  G01J5/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.

摘要翻译： 红外线传感器包括：红外线传感器芯片，其中在半导体衬底的一个表面侧上排列有包括由热电堆形成的温度敏感部分的多个像素部分; 以及处理红外线传感器芯片的输出信号的IC芯片。 一种包装体，包括并排设置红外线传感器芯片和IC芯片的封装主体，以及具有透射红外线的透镜并与封装主体气密结合的封装盖。 该封装件设置有盖构件，该盖构件包括窗孔，红外线通过该孔穿过红外线传感器芯片，并使像素部之间的热接点和冷接点的温度变化量相等，由IC加热引起的温度变化 芯片。

公开(公告)号：US08609647B2

公开(公告)日：2013-12-17

申请号：US12847025

申请日：2010-07-30

申请人： Satoru Noji ,  Makoto Shiozaki ,  Tomoya Miura ,  Yoshinori Hara ,  Hiroshi Yamanaka ,  Katsuya Maeda ,  Akimi Hori ,  Masafumi Inoue ,  Yasunori Hase

发明人： Satoru Noji ,  Makoto Shiozaki ,  Tomoya Miura ,  Yoshinori Hara ,  Hiroshi Yamanaka ,  Katsuya Maeda ,  Akimi Hori ,  Masafumi Inoue ,  Yasunori Hase

IPC分类号： C07D487/04 ,  A61K31/519 ,  A61P19/02 ,  A61P37/00 ,  A61P17/06 ,  A61P27/04 ,  A61P29/00

CPC分类号： C07D487/10 ,  A61K31/437 ,  A61K31/438 ,  A61K31/519 ,  A61K31/55 ,  C07D471/10 ,  C07D519/00

摘要： A compound of the following general formula [I]: wherein each symbol has the same meaning as defined herein, or a pharmaceutically acceptable salt thereof, or a solvate thereof, and a pharmaceutical use of the same in treating organ transplant rejection, graft versus host reaction after transplantation, autoimmune disease, allergic disease and chronic myeloproliferative disease.

摘要翻译： 下列通式[I]的化合物：其中每个符号具有如本文所定义的相同含义，或其药学上可接受的盐或其溶剂合物，以及其用于治疗器官移植排斥，移植物抗宿主 移植后反应，自身免疫性疾病，过敏性疾病和慢性骨髓增生性疾病。

公开(公告)号：US06340923B1

公开(公告)日：2002-01-22

申请号：US09739774

申请日：2000-12-20

申请人： Hiroshi Yamanaka ,  Toshiyuki Suzuki ,  Kazunobu Nakata

发明人： Hiroshi Yamanaka ,  Toshiyuki Suzuki ,  Kazunobu Nakata

IPC分类号： H01H5300

CPC分类号： H01H50/10 ,  H01H50/14 ,  H01H50/54 ,  H01H51/2272

摘要： A high frequency relay comprises a contact base block having pairs of fixed contacts, contact members with movable contacts, and an electromagnet for moving the contact members to open and close the fixed contacts by the movable contacts. The contact base block comprises an injection-molded base having projections on its front surface, first metal films formed as the fixed contacts on top surfaces of the projections, second metal films formed as connection terminals for outside devices on a rear surface of the base, each of which corresponds to one of the first metal films, through holes each having a conductive material on its inner surface to make an electrical connection between one of the first metal films and the corresponding second metal film in the shortest distance, and a third metal film formed on the base to provide electrical isolation from the first and second metal films, which works as electromagnetic shield as well as a ground.

摘要翻译： 高频继电器包括具有成对的固定触点的触点基座，具有可动触点的触点构件，以及用于使触点构件移动以通过可动触点打开和闭合固定触点的电磁体。 接触基块包括在其表面上具有突起的注射成型基底，在突起的顶表面上形成为固定触点的第一金属膜，形成在基底的后表面上的用于外部装置的连接端子的第二金属膜， 每一个对应于第一金属膜中的一个，在其内表面上各自具有导电材料的通孔，以在最短距离内形成第一金属膜之一和相应的第二金属膜之间的电连接;以及第三金属 形成在基底上的膜，以提供与第一和第二金属膜的电隔离，其作为电磁屏蔽以及地面。

公开(公告)号：US4650310A

公开(公告)日：1987-03-17

申请号：US726999

申请日：1985-04-25

申请人： Masatoshi Hayashida ,  Takayuki Suga ,  Hiroshi Yamanaka

发明人： Masatoshi Hayashida ,  Takayuki Suga ,  Hiroshi Yamanaka

IPC分类号： G03G15/08 ,  G03G15/09

CPC分类号： G03G15/0853

摘要： A toner density detecting device is provided with a coil buried in a housing and a cover member provided on one end of the coil to prevent the developing agent from touching the coil. The cover member has a front end portion provided near the surface of the housing and extending along the developing agent flowing direction and an apex portion at the back of the front end portion with respect to the direction. The apex portion projects deeper into the developing agent than the front end portion. An edge connecting the front end portion and the apex portion extends in the direction to cross the central axis of the coil. A pair of faces extending in the direction on either side of the edge are gradually declined from the edge toward the surface of the housing.

摘要翻译： 调色剂浓度检测装置设置有埋在壳体中的线圈和设置在线圈的一端上的盖构件，以防止显影剂接触线圈。 盖构件具有设置在壳体的表面附近并沿着显影剂流动方向延伸的前端部和相对于该方向在前端部的后部的顶部。 顶端部分比前端部分更深地突出到显影剂中。 连接前端部分和顶端部分的边缘在与线圈的中心轴线交叉的方向上延伸。 沿着边缘两侧的方向延伸的一对面从边缘朝向壳体的表面逐渐下降。

公开(公告)号：US09853520B2

公开(公告)日：2017-12-26

申请号：US14772123

申请日：2013-03-28

申请人： Koji Yabe ,  Naohiro Oketani ,  Hiroshi Yamanaka ,  Hironori Yabuuchi

发明人： Koji Yabe ,  Naohiro Oketani ,  Hiroshi Yamanaka ,  Hironori Yabuuchi

IPC分类号： H02K5/08 ,  H02K5/16 ,  H02K5/15 ,  H02K5/24 ,  F16C35/04

CPC分类号： H02K5/161 ,  F16C35/042 ,  F16C2380/26 ,  H02K5/08 ,  H02K5/15 ,  H02K5/163 ,  H02K5/24

摘要： A molded motor 100 includes a molded stator formed by providing a molding resin to a stator, a rotor inside the molded stator, a pair of bearings supporting a rotor shaft of the rotor, and an insulating bracket fitted in an inner circumferential part of an opening formed at an axial end of the molded stator to surround and support an outer ring of the bearing with a concave part formed at a center, and formed of an insulating resin.

公开(公告)号：US20120322837A1

公开(公告)日：2012-12-20

申请号：US13457844

申请日：2012-04-27

申请人： Takaki Maeba ,  Katsuya Maeda ,  Masayuki Kotoku ,  Kazuyuki Hirata ,  Noriyoshi Seki ,  Hiroshi Yamanaka ,  Takayuki Sakai ,  Shintaro Hirashima ,  Shingo Obika ,  Makoto Shiozaki ,  Masahiro Yokota

发明人： Takaki Maeba ,  Katsuya Maeda ,  Masayuki Kotoku ,  Kazuyuki Hirata ,  Noriyoshi Seki ,  Hiroshi Yamanaka ,  Takayuki Sakai ,  Shintaro Hirashima ,  Shingo Obika ,  Makoto Shiozaki ,  Masahiro Yokota

IPC分类号： C07D261/08 ,  C07D249/04 ,  A61K31/4192 ,  A61P37/06 ,  A61P3/10 ,  A61P3/00 ,  A61P19/02 ,  A61P17/06 ,  A61P1/00 ,  A61K31/42 ,  A61P37/08

CPC分类号： A61K31/4192 ,  A61K31/42 ,  C07D249/04 ,  C07D261/08 ,  C07D417/06

摘要： A compound of formula [I-W]: wherein each symbol is as defined in the description, or a pharmaceutically acceptable salt thereof.

摘要翻译： 式[I-​​W]化合物或其药学上可接受的盐，其中每个符号如说明书中所定义。

公开(公告)号：US08254209B2

公开(公告)日：2012-08-28

申请号：US11572588

申请日：2005-07-27

申请人： Hiroshi Yamanaka ,  Yoshifumi Watabe ,  Yoshiaki Honda ,  Kousaku Kitada ,  Hiroshi Kawada ,  Tomoo Ohtsuka ,  Kazuo Sawada ,  Hiromichi Goto

发明人： Hiroshi Yamanaka ,  Yoshifumi Watabe ,  Yoshiaki Honda ,  Kousaku Kitada ,  Hiroshi Kawada ,  Tomoo Ohtsuka ,  Kazuo Sawada ,  Hiromichi Goto

IPC分类号： G01S15/06

CPC分类号： G01H11/06 ,  B06B1/02 ,  G01L9/0025 ,  G01S3/808 ,  G01S7/524 ,  G01S7/526

摘要： In an acoustic wave sensor for detecting a distance to an object and an orientation where the object is located with using acoustic waves, an acoustic wave generating device generating an acoustic wave by applying thermal impact to the air with no mechanical vibration is used as a wave transmitting device, and an electric capacitance microphone converting variation of pressure due to acoustic wave to variation of an electric signal is used as each wave receiving device. Therefore, dead zone caused by reverberation component included in the acoustic wave transmitted from the wave transmitting device and dead zone caused by reverberation component included in wave receiving signals outputted from the wave receiving devices can be shortened and angular sensitivity of the acoustic wave sensor can be increased, in comparison with a conventional acoustic wave sensor using piezoelectric devices as the wave transmitting device and the wave receiving devices.

摘要翻译： 在声波传感器中，通过使用声波来检测物体的距离和物体的位置的声波传感器，使用通过对机械振动对空气进行热冲击来产生声波的声波发生装置作为波 作为每个波接收装置，使用将由声波引起的压力变化的电容麦克风变换为电信号的变化。 因此，可以缩短由包含在从波形接收装置输出的波形接收信号中的由波发送装置发送的声波和由混响成分引起的死区所引起的混响分量造成的死区，并且能够使声波传感器的角度灵敏度 与使用压电装置作为波发送装置和波接收装置的常规声波传感器相比增加。

公开(公告)号：US20100230595A1

公开(公告)日：2010-09-16

申请号：US12302024

申请日：2007-05-23

申请人： Yuichi Uchida ,  Hiroshi Yamanaka ,  Koji Tsuji ,  Masao Kirihara ,  Takaaki Yoshihara ,  Youichi Nishijima

发明人： Yuichi Uchida ,  Hiroshi Yamanaka ,  Koji Tsuji ,  Masao Kirihara ,  Takaaki Yoshihara ,  Youichi Nishijima

IPC分类号： H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/0224 ,  H01L31/09

CPC分类号： G01J5/10 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14665 ,  H01L2924/0002 ,  H01L2924/00

摘要： To improve thermal insulation, a thermal infrared sensing element is carried on a sensor mount of a porous material and is spaced upwardly from a substrate by means of anchor studs projecting on the substrate. The sensor mount is formed with a pair of coplanar beams carry thereon leads extending from the sensing element. The leads and the beams are secured to the upper ends of the anchor studs to hold the sensing element at a predetermined height above the substrate. The beams and the leads are combined with each other by intermolecular adhesion such that the sensing element as well as the sensor mount can be altogether supported to the anchor studs.

摘要翻译： 为了改善绝热性，热红外传感元件被承载在多孔材料的传感器座上，并且通过突出在基底上的锚固螺柱与衬底间隔开。 传感器支架形成有一对共面梁，其上承载有从感测元件延伸的引线。 引线和梁被固定到锚栓的上端以将感测元件保持在基板上方的预定高度处。 梁和引线通过分子间粘附而彼此组合，使得感测元件以及传感器座可以一起被支撑到锚栓上。