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    Silicone rubber compositions for the sealing and encapsulation of electric and electronic parts
    2.
    发明授权
    Silicone rubber compositions for the sealing and encapsulation of electric and electronic parts 失效
    用于密封和封装电气和电子部件的硅橡胶组合物

    公开(公告)号：US07704607B2

    公开(公告)日：2010-04-27

    申请号：US12244402

    申请日：2008-10-02

    申请人： Hiroyasu Hara ,  Hideki Sugahara ,  Yoshifumi Inoue

    发明人： Hiroyasu Hara ,  Hideki Sugahara ,  Yoshifumi Inoue

    IPC分类号： B32B9/04 ,  C08L83/04

    CPC分类号： H01B3/46 ,  C08K3/08 ,  Y10T428/31663 ,  C08L83/04

    摘要： A silicone rubber composition containing 0.5-90% by weight of a metal powder and curable into a non-conductive silicone rubber having a volume resistivity of at least 1×109 Ω·cm is useful for the sealing and encapsulation of electric and electronic parts because the metal powder is sulfided with a sulfur gas into a metal sulfide powder which prevents or retards the sulfur gas from reaching the electric and electronic parts.

    摘要翻译： 含有0.5〜90重量％的金属粉末并且可固化成体积电阻率为至少1×10 9Ω·cm·cm的非导电硅橡胶的硅橡胶组合物可用于电气和电子部件的密封和封装 因为金属粉末被硫气硫化成金属硫化物粉末，其阻止或延迟硫气到达电气和电子部件。

    SILICONE RUBBER COMPOSITIONS FOR THE SEALING AND ENCAPSULATION OF ELECTRIC AND ELECTRONIC PARTS
    4.
    发明申请
    SILICONE RUBBER COMPOSITIONS FOR THE SEALING AND ENCAPSULATION OF ELECTRIC AND ELECTRONIC PARTS 失效
    用于电子和电子部件密封和封装的硅橡胶组合物

    公开(公告)号：US20090043029A1

    公开(公告)日：2009-02-12

    申请号：US12244402

    申请日：2008-10-02

    申请人： Hiroyasu Hara ,  Hideki Sugahara ,  Yoshifumi Inoue

    发明人： Hiroyasu Hara ,  Hideki Sugahara ,  Yoshifumi Inoue

    IPC分类号： C08K3/08

    CPC分类号： H01B3/46 ,  C08K3/08 ,  Y10T428/31663 ,  C08L83/04

    摘要： A silicone rubber composition containing 0.5-90% by weight of a metal powder and curable into a non-conductive silicone rubber having a volume resistivity of at least 1×109 Ω·cm is useful for the sealing and encapsulation of electric and electronic parts because the metal powder is sulfided with a sulfur gas into a metal sulfide powder which prevents or retards the sulfur gas from reaching the electric and electronic parts.

    摘要翻译： 包含0.5-90重量％的金属粉末并且可固化成体积电阻率至少为1×10 9Ω·cm的非导电硅橡胶的硅橡胶组合物可用于密封和封装电气和电子部件，因为金属 粉末用硫气硫化成金属硫化物粉末，其防止或延迟硫气到达电气和电子部件。

    Hydrophilic organopolysiloxane composition for use as dental impression material
    5.
    发明授权
    Hydrophilic organopolysiloxane composition for use as dental impression material 有权
    用作牙科印模材料的亲水性有机聚硅氧烷组合物

    公开(公告)号：US07875695B2

    公开(公告)日：2011-01-25

    申请号：US12251252

    申请日：2008-10-14

    申请人： Hiroshi Kamohara ,  Toshiyuki Ozai ,  Hideki Sugahara

    发明人： Hiroshi Kamohara ,  Toshiyuki Ozai ,  Hideki Sugahara

    IPC分类号： C08G77/20

    CPC分类号： A61K6/10 ,  C08L83/04

    摘要： A hydrophilic organopolysiloxane composition of the hydrosilylation reaction cure type for use as dental impression material is characterized by comprising as essential components (A) a diorganopolysiloxane having at least 0.1 silicon-bonded alkenyl group in a molecule, (B) a liquid or solid organopolysiloxane having average compositional formula (1), comprising SiO2 units and R3SiO1/2 units (R is a monovalent hydrocarbon, alkoxy or hydroxyl group) and having a viscosity of at least 10 mPa-s at 23° C., (C) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (D) a hydrosilylation catalyst, and (E) a polyether having average compositional formula (2).

    摘要翻译： 用作牙印模材料的氢化硅烷化反应固化型的亲水性有机聚硅氧烷组合物的特征在于包含作为必需组分（A）在分子中具有至少0.1个硅键合的烯基的二有机聚硅氧烷，（B）具有 平均组成式（1），其包含SiO 2单元和R 3 SiO 1/2单元（R是单价烃，烷氧基或羟基），并且在23℃具有至少10mPa·s的粘度，（C）有机氢聚硅氧烷， 分子中至少两个硅键合的氢原子，（D）氢化硅烷化催化剂和（E）具有平均组成式（2）的聚醚。

    Organic silicon compounds
    8.
    发明授权
    Organic silicon compounds 失效
    有机硅化合物

    公开(公告)号：US5342983A

    公开(公告)日：1994-08-30

    申请号：US26792

    申请日：1993-03-05

    申请人： Toshio Yamazaki ,  Hideki Sugahara ,  Shoji Ichinohe ,  Toshinobu Ishihara ,  Tohru Kubota

    发明人： Toshio Yamazaki ,  Hideki Sugahara ,  Shoji Ichinohe ,  Toshinobu Ishihara ,  Tohru Kubota

    IPC分类号： C07F7/08 ,  C07F7/12 ,  C07F7/10 ,  C07F7/18

    CPC分类号： C07F7/0847

    摘要： Organic silicon compounds which are expressed by the general chemical formulae (I) or (II): ##STR1## wherein R.sup.1 is a monovalent organic group with 1 to 8 carbon atoms; R.sup.2, R.sup.3 and R.sup.4 in each equation are independent and either a monovalent organic group with 1 to 8 carbon atoms or a siloxyl group expressed by ##STR2## wherein R.sup.5, R.sup.6 and R.sup.7 are independent in each equation and they are a monovalent organic group with 1 to 8 carbon atoms; and a is either 0, 1 or 2. The novel organic silicon compounds possess both a polymerizable double bond and organopolysiloxane within the same molecule. These compounds are superior in their polymerizability and copolymerizability and are useful as polymer reforming agents.

    摘要翻译： （I）或（II）表示的有机硅化合物：其中R 1是具有1至8个碳原子的一价有机基团; 每个方程中的R 2，R 3和R 4是独立的，并且具有1至8个碳原子的单价有机基团或由下式表示的硅氧烷基：其中R 5，R 6和R 7在每个方程中是独立的，并且它们是具有 1至8个碳原子; 并且a是0,1或2.新型有机硅化合物在同一分子内具有可聚合双键和有机聚硅氧烷。 这些化合物的聚合性和共聚性优异，可用作聚合物改性剂。

    HYDROPHILIC ORGANOPOLYSILOXANE COMPOSITION FOR USE AS DENTAL IMPRESSION MATERIAL
    9.
    发明申请
    HYDROPHILIC ORGANOPOLYSILOXANE COMPOSITION FOR USE AS DENTAL IMPRESSION MATERIAL 有权
    用作牙科印花材料的水解有机硅氧烷组合物

    公开(公告)号：US20100069525A1

    公开(公告)日：2010-03-18

    申请号：US12251252

    申请日：2008-10-14

    申请人： Hiroshi Kamohara ,  Toshiyuki Ozai ,  Hideki Sugahara

    发明人： Hiroshi Kamohara ,  Toshiyuki Ozai ,  Hideki Sugahara

    IPC分类号： A61K6/10

    CPC分类号： A61K6/10 ,  C08L83/04

    摘要： A hydrophilic organopolysiloxane composition of the hydrosilylation reaction cure type for use as dental impression material is characterized by comprising as essential components (A) a diorganopolysiloxane having at least 0.1 silicon-bonded alkenyl group in a molecule, (B) a liquid or solid organopolysiloxane having average compositional formula (1), comprising SiO2 units and R3SiO1/2 units (R is a monovalent hydrocarbon, alkoxy or hydroxyl group) and having a viscosity of at least 10 mPa·s at 23° C., (C) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (D) a hydrosilylation catalyst, and (E) a polyether having average compositional formula (2).

    摘要翻译： 用作牙印模材料的氢化硅烷化反应固化型的亲水性有机聚硅氧烷组合物的特征在于包含作为必需组分（A）在分子中具有至少0.1个硅键合的烯基的二有机聚硅氧烷，（B）具有 平均组成式（1），其包含SiO 2单元和R 3 SiO 1/2单元（R是单价烃，烷氧基或羟基），并且在23℃具有至少10mPa·s的粘度，（C）有机氢聚硅氧烷， 分子中至少两个硅键合的氢原子，（D）氢化硅烷化催化剂和（E）具有平均组成式（2）的聚醚。

    Room temperature curable organopolysiloxane composition
    10.
    发明授权
    Room temperature curable organopolysiloxane composition 失效
    室温可固化的有机聚硅氧烷组合物

    公开(公告)号：US5945466A

    公开(公告)日：1999-08-31

    申请号：US861219

    申请日：1997-05-21

    申请人： Masayuki Ikeno ,  Hideki Sugahara

    发明人： Masayuki Ikeno ,  Hideki Sugahara

    IPC分类号： A61K6/10 ,  C08K3/34 ,  C08K5/01 ,  C08K5/5419 ,  C08L83/04 ,  C08L83/06

    CPC分类号： A61K6/10 ,  C08K3/34 ,  C08K5/01

    摘要： A room temperature curable organopolysiloxane composition including: (A) 100 parts by weight of a diorganopolysiloxane represented by the general formula (1):HO�Si(R.sup.1).sub.2 O!.sub.n H (1)wherein R.sup.1 represents a substituted or unsubstituted monovalent hydrocarbon group, and n is an integer of 15 or more;(B) from 0.1 part by weight to 20 parts by weight of an organosilane, or a partially hydrolyzed product thereof, represented by the general formula (2):(R.sup.2).sub.m S(OR.sup.2).sub.4-m (2)wherein R.sup.2 's each independently represent a substituted or unsubstituted monovalent hydrocarbon group, and m is 0, 1 or 2;(C) from 0.01 part by weight to 10 parts by weight of a curing catalyst;(D) from 20 parts by weight to 600 parts by weight of a magnesium silicate; and(E) from 5 parts by weight to 80 parts by weight of a paraffin type aliphatic hydrocarbon which is liquid or semi-solid at room temperature. This composition can be rapidly cured, even after a long-term storage.

    摘要翻译： 一种室温可固化的有机聚硅氧烷组合物，其包含：（A）100重量份由通式（1）表示的二有机聚硅氧烷：HO [Si（R 1）2 O] n H（1）其中R 1表示取代或未取代的单价烃基， n为15以上的整数。 （B）0.1重量份至20重量份的由通式（2）表示的有机硅烷或其部分水解产物：（R2）mS（OR2）4-m（2）其中R2各自独立地 表示取代或未取代的一价烃基，m为0,1或2; （C）0.01重量份〜10重量份固化催化剂; （D）20重量份至600重量份的硅酸镁; 和（E）5重量份至80重量份在室温下为液体或半固体的链烷烃类脂族烃。 即使经过长时间储存​​，也可以快速固化该组合物。