公开(公告)号：US08591712B2

公开(公告)日：2013-11-26

申请号：US13406188

申请日：2012-02-27

申请人： Hiroyuki Hayashi ,  Masaki Mizutani ,  Takayuki Kitou

发明人： Hiroyuki Hayashi ,  Masaki Mizutani ,  Takayuki Kitou

IPC分类号： G01N27/407

CPC分类号： G01N27/4071

摘要： There is provided a gas sensor element, including a solid electrolyte layer, a pair of sensor electrodes arranged on a front side of the solid electrolyte layer, a pair of sensor leads arranged on a rear side of the solid electrolyte layer and connected to the respective sensor electrodes; and insulating layers, one of which is arranged between one of the sensor leads and the solid electrolyte layer and the other of which is arranged between the other sensor lead and the solid electrolyte layer. The sensor electrodes have rear end portions located on the insulating layers and overlapping front end portions of the sensor leads, respectively. The sensor leads are denser than the sensor electrodes and have front ends located in the same positions as or positions rear of front ends of the insulating layers, respectively. There is also provided a gas sensor with such a gas sensor element.

摘要翻译： 提供了一种气体传感器元件，包括固体电解质层，布置在固体电解质层前侧的一对传感器电极，一对传感器引线，布置在固体电解质层的后侧并连接到固体电解质层 传感器电极; 绝缘层，其中之一布置在传感器引线和固体电解质层中的一个之间，另一个布置在另一个传感器引线和固体电解质层之间。 传感器电极具有分别位于绝缘层上的后端部分和传感器引线的重叠前端部分。 传感器引线比传感器电极更致密，并且分别具有位于绝缘层的前端的相同位置或位于后端的前端。 还提供了具有这种气体传感器元件的气体传感器。

公开(公告)号：US08492453B2

公开(公告)日：2013-07-23

申请号：US12766352

申请日：2010-04-23

申请人： Masaki Mizutani ,  Toshikazu Baba

发明人： Masaki Mizutani ,  Toshikazu Baba

IPC分类号： C07D303/40

CPC分类号： G03F7/033 ,  G03F7/032 ,  H05K1/0393 ,  H05K3/287

摘要： A photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after the IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; and (D) a photopolymerization initiator. The photosensitive resin composition has a tensile breaking elongation percentage of not less than 10% and a 2% weight loss temperature of not lower than 260° C. after being cured.

摘要翻译： 提供了具有阻焊剂所必需的性质（绝缘性，焊料耐热性，碱显影性等）的感光性树脂组合物，并且即使在IR回流工艺之后也能够形成耐折叠性优异的膜。 还提供了采用光敏树脂组合物的柔性电路板和电路板的制造方法。 感光性树脂组合物包含：（A）包含含羧基的烯属不饱和化合物的烯属不饱和化合物的线性聚合物; （B）环氧树脂; （C）含有烯属不饱和基团的聚合性化合物; 和（D）光聚合引发剂。 感光性树脂组合物在固化后的拉伸断裂伸长率为10％以上，2％重量减少温度为260℃以上。

公开(公告)号：US08455577B2

公开(公告)日：2013-06-04

申请号：US12849896

申请日：2010-08-04

申请人： Masaki Mizutani ,  Toshikazu Baba ,  Yoshihiro Kawamura

发明人： Masaki Mizutani ,  Toshikazu Baba ,  Yoshihiro Kawamura

IPC分类号： C08K5/5399

CPC分类号： G03F7/032 ,  G03F7/033 ,  H05K1/0393 ,  H05K3/287

摘要： A halogen-free and flame-resistant photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after an IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; (D) a photopolymerization initiator; and a cyclic phosphazene (E) represented by the following general formula (1):

摘要翻译： 提供了一种无卤阻燃感光性树脂组合物，其具有阻焊剂所需的性质（绝缘性，焊料耐热性，碱显影性等），并且能够形成耐折性优异的膜 经过IR回流处理。 还提供了采用光敏树脂组合物的柔性电路板和电路板的制造方法。 感光性树脂组合物包含：（A）包含含羧基的烯属不饱和化合物的烯属不饱和化合物的线性聚合物; （B）环氧树脂; （C）含有烯属不饱和基团的聚合性化合物; （D）光聚合引发剂; 和由以下通式（1）表示的环状磷腈（E）：

公开(公告)号：US20110147952A1

公开(公告)日：2011-06-23

申请号：US12983821

申请日：2011-01-03

申请人： Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

发明人： Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

IPC分类号： H01L23/52 ,  H01L21/50

CPC分类号： H01L21/6836 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/3512

摘要： The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer (2) on a substrate material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein the adhesion of the pressure-sensitive adhesive layer (2) to the die-bonding adhesive layer (3), as determined under the conditions of a peel angle of 15° and a peel point moving rate of 2.5 mm/sec. at 23° C., is different between a region (2a) corresponding to a work attachment region (3a) and a region (2b) corresponding to a part or the whole of the other region (3b), in the die-bonding adhesive layer (3), and satisfies the following relationship: adhesion of the pressure-sensitive adhesive layer (2a)

摘要翻译： 本发明涉及一种在基材（1）上具有压敏粘合剂层（2）和压敏粘合剂层（2）上的芯片粘合层（3）的切割芯片接合膜，其中 在剥离角度为15°，剥离移动速度为2.5mm / sec的条件下测定粘合剂层（2）与芯片粘接层（3）的粘合性。 在相对于工件附着区域（3a）的区域（2a）和与其他区域（3b）的一部分或全部对应的区域（2b）在23℃下不同，在芯片接合粘合剂 层（3），并且满足以下关系：粘合剂层（2a）的粘合性<粘合剂层（2b）的粘合性和粘合剂层（2a）对粘合剂层 芯片粘合层（3）不高于2.3N / 25mm。

公开(公告)号：US20110030998A1

公开(公告)日：2011-02-10

申请号：US12849896

申请日：2010-08-04

申请人： Masaki Mizutani ,  Toshikazu Baba ,  Yoshihiro Kawamura

发明人： Masaki Mizutani ,  Toshikazu Baba ,  Yoshihiro Kawamura

IPC分类号： H05K1/00 ,  G03F7/004 ,  G03F7/20

CPC分类号： G03F7/032 ,  G03F7/033 ,  H05K1/0393 ,  H05K3/287

摘要： A halogen-free and flame-resistant photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after an IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; (D) a photopolymerization initiator; and a cyclic phosphazene (E) represented by the following general formula (1):

摘要翻译： 提供了一种无卤阻燃感光性树脂组合物，其具有阻焊剂所需的性质（绝缘性，焊料耐热性，碱显影性等），并且能够形成耐折性优异的膜 经过IR回流处理。 还提供了采用光敏树脂组合物的柔性电路板和电路板的制造方法。 感光性树脂组合物包含：（A）包含含羧基的烯属不饱和化合物的烯属不饱和化合物的线性聚合物; （B）环氧树脂; （C）含有烯属不饱和基团的聚合性化合物; （D）光聚合引发剂; 和由以下通式（1）表示的环状磷腈（E）：

公开(公告)号：US20060219554A1

公开(公告)日：2006-10-05

申请号：US11392574

申请日：2006-03-30

申请人： Shigeki Mori ,  Masaki Mizutani ,  Akinori Kojima ,  Shigeo Kondo

发明人： Shigeki Mori ,  Masaki Mizutani ,  Akinori Kojima ,  Shigeo Kondo

IPC分类号： G01N27/28

CPC分类号： G01N27/4071 ,  Y10T156/107

摘要： A method for manufacturing a gas sensor element (300), which includes a plate-like second solid electrolyte member (109), a fourth electrode (110) formed on the second solid electrolyte member (109), and a protection layer (111) including a reinforcement member (112) having an insertion hole (112a), and a porous electrode protection member (113a) provided in the insertion hole (112) and adapted to protect the fourth electrode (110) from becoming poisoned. The method includes a pressing step of, after disposing a green electrode protection member (113a) in the insertion hole (112a) of a green reinforcement member (112), pressing at least one of the green reinforcement member (112) and the green electrode protection member (113a) so as to form a green protection layer (111); a laminate-forming step of arranging the green protection layer (111) and a green solid electrolyte member (113a) in layers so as to form a laminate which will become the gas sensor element (300) after being fired; and a firing step of firing the laminate.

摘要翻译： 一种制造气体传感器元件（300）的方法，其包括板状第二固体电解质部件（109），形成在第二固体电解质部件（109）上的第四电极（110）和保护层（111） 包括具有插入孔（112a）的加强构件（112）和设置在所述插入孔（112）中并适于保护所述第四电极（110）不被中毒的多孔电极保护构件（113a）。 该方法包括按压步骤，在绿色加强部件（112）的插入孔（112a）中设置绿色电极保护部件（113a）之后，按压至少一个绿色加强部件（112）和 绿色电极保护构件（113a），以形成绿色保护层（111）; 层叠形成工序，将绿色保护层（111）和绿色固体电解质构件（113a）分层配置，形成在烧成后成为气体传感元件（300）的层压体; 以及焙烧步骤。

公开(公告)号：US20060194417A1

公开(公告)日：2006-08-31

申请号：US10530189

申请日：2003-10-10

申请人： Shunichi Ishihara ,  Katsumi Nakagawa ,  Hiroshi Sato ,  Takehito Yoshino ,  Shoji Nishida ,  Noritaka Ukiyo ,  Masaaki Iwane ,  Yukiko Iwasaki ,  Masaki Mizutani

发明人： Shunichi Ishihara ,  Katsumi Nakagawa ,  Hiroshi Sato ,  Takehito Yoshino ,  Shoji Nishida ,  Noritaka Ukiyo ,  Masaaki Iwane ,  Yukiko Iwasaki ,  Masaki Mizutani

IPC分类号： H01L31/0376 ,  H01L21/20

CPC分类号： C30B29/06 ,  C30B11/00 ,  H01L31/182 ,  Y02E10/546 ,  Y02P70/521

摘要： A polycrystalline silicon substrate for a solar cell formed by growing a high purity polycrystalline silicon layer on a surface of a base obtained by slicing a polycrystalline silicon ingot obtained by melting metallurgical grade silicon and performing one-direction solidification, wherein one-direction solidification is performed on a melt prepared by adding B to molten metallurgical grade silicon at an amount of 2×1018 cm−3 to 5×1019 cm−3 based on the concentration in the melt to produce the polycrystalline silicon ingot. With this structure, it is possible to easily obtain a polycrystalline silicon substrate having resistivity and the type of conductivity suitable for manufacture of a solar cell.

摘要翻译： 一种用于太阳能电池的多晶硅衬底，其通过在通过熔化冶金级硅获得的多晶硅锭切片并进行单向凝固而获得的基底表面上生长高纯度多晶硅层而形成，其中执行单向凝固 在通过以2×10 18 cm -3至5×10 19 cm -3的量向熔融冶金级硅中加入B制备的熔体上， 3，根据熔体中的浓度制造多晶硅锭。 利用这种结构，可以容易地获得具有电阻率的多晶硅基板和适合制造太阳能电池的导电类型。

公开(公告)号：US07022181B2

公开(公告)日：2006-04-04

申请号：US10014418

申请日：2001-12-14

申请人： Katsumi Nakagawa ,  Tetsuro Saito ,  Tatsumi Shoji ,  Takehito Yoshino ,  Shoji Nishida ,  Noritaka Ukiyo ,  Masaaki Iwane ,  Masaki Mizutani

发明人： Katsumi Nakagawa ,  Tetsuro Saito ,  Tatsumi Shoji ,  Takehito Yoshino ,  Shoji Nishida ,  Noritaka Ukiyo ,  Masaaki Iwane ,  Masaki Mizutani

IPC分类号： C30B19/00

CPC分类号： C30B19/062 ,  C30B19/00 ,  C30B29/06 ,  Y10S117/911

摘要： In a liquid phase growth process comprising immersing a substrate in a melt held in a crucible, a crystal material having been dissolved in the melt, and growing a crystal on the substrate, at least a group of substrates to be immersed in the melt held in the crucible are fitted to the supporting rack at a position set aside from the center of rotation of the crucible or supporting rack, and the crystal is grown on the surface of the substrate thus disposed. This can provide a liquid phase growth process which can attain a high growth rate, can enjoy uniform distribution of growth rate in each substrate and between the substrates even when substrates are set in a large number in one batch, and can readily keep the melt from reaction and contamination even when the system has a large size, and provide a liquid phase growth system suited for carrying out the process.

公开(公告)号：US20050046042A1

公开(公告)日：2005-03-03

申请号：US10678855

申请日：2003-10-03

申请人： Takeshi Matsumura ,  Masaki Mizutani

发明人： Takeshi Matsumura ,  Masaki Mizutani

IPC分类号： H01L21/78 ,  C09J5/00 ,  H01L21/301 ,  H01L21/58 ,  H01L21/68 ,  H01L21/46 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L24/29 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/3025 ,  Y10T428/218 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/3512

摘要： A dicing/die-bonding film including a pressure-sensitive adhesive layer (2) on a supporting base material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein a releasability in an interface between the pressure-sensitive adhesive layer (2) and the die-bonding adhesive layer (3) is different between an interface (A) corresponding to a work-attaching region (3a) in the die-bonding adhesive layer (3) and an interface (B) corresponding to a part or a whole of the other region (3b), and the releasability of the interface (A) is higher than the releasability of the interface (B). The dicing/die-bonding film is excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.

摘要翻译： 一种在支撑基材（1）上具有压敏粘合剂层（2）和压敏粘合剂层（2）上的芯片粘合层（3）的切割/芯片接合膜，其中， 粘合剂层（2）与芯片粘合层（3）之间的界面在与芯片粘合层（3）中的工件附着区域（3a）相对应的界面（A）之间是不同的， 以及对应于另一区域（3b）的一部分或全部的界面（B），并且界面（A）的释放性高于界面（B）的剥离性。 切割/芯片接合膜在切割工件的保持性和脱模性之间的平衡优异，并且与芯片粘合层一起释放切割的切片工作。

公开(公告)号：US06824609B2

公开(公告)日：2004-11-30

申请号：US10229123

申请日：2002-08-28

申请人： Tetsuro Saito ,  Katsumi Nakagawa ,  Tatsumi Shoji ,  Takehito Yoshino ,  Shoji Nishida ,  Masaki Mizutani

发明人： Tetsuro Saito ,  Katsumi Nakagawa ,  Tatsumi Shoji ,  Takehito Yoshino ,  Shoji Nishida ,  Masaki Mizutani

IPC分类号： C30B1900

CPC分类号： C30B19/064 ,  C30B19/02 ,  C30B19/06 ,  C30B29/06 ,  Y10S117/90 ,  Y10T117/1016 ,  Y10T117/1024

摘要： A liquid phase growth method is provided which comprises dipping a seed substrate in a solution in a vessel having a crystal raw material melted therein and growing a crystal on the substrate, wherein a fin is provided on a bottom of the vessel, for regulating a flow of the solution from a central portion outside in a radial direction in the vessel; a flow-regulating plate is provided in the vicinity of an inner sidewall of the vessel, for regulating a flow of the solution from the bottom upwardly; and the vessel is rotated while regulating a flow of the solution by an action of the fin and the flow-regulating plate to bring the solution into contact with the seed substrate. Thus, there is provided a liquid phase growth method and apparatus capable of providing a high growth rate and showing little difference in the growth rate among the substrates or within the same substrate even when a number of substrates are charged in one batch.

摘要翻译： 提供一种液相生长方法，其包括将种子基底浸入溶液中，其中晶体原料熔化在其中并在基底上生长晶体，其中在容器的底部设置有用于调节流动的翅片 从容器中沿径向外侧的中心部分的溶液; 流量调节板设置在容器的内侧壁附近，用于调节溶液从底部向上的流动; 并且通过翅片和流动调节板的作用调节溶液的流动以使溶液与种子基底接触来旋转容器。 因此，提供了一种液相生长方法和装置，其能够提供高生长速率，并且即使在一批中填充多个基板时，基板之间或同一基板内的生长速度几乎没有差异。