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    Easy opening film package and a method of preparing the same
    2.
    发明授权
    Easy opening film package and a method of preparing the same 失效
    易开封膜包装及其制备方法

    公开(公告)号：US5316209A

    公开(公告)日：1994-05-31

    申请号：US983406

    申请日：1992-11-30

    申请人： Maya Tomisawa ,  Shuji Higashi ,  Koji Sasagawa ,  Tatsuo Fujii

    发明人： Maya Tomisawa ,  Shuji Higashi ,  Koji Sasagawa ,  Tatsuo Fujii

    IPC分类号： B65B11/54 ,  B65D75/58 ,  B65D75/60 ,  B65D75/62 ,  B65D27/00 ,  B65D27/34

    CPC分类号： B65D75/5855 ,  Y10S229/923

    摘要： An easy opening film package for wrapping cubic or rectangular shaped articles is prepared from a film having a printed portion containing ink and a compatible thermoplastic resin on one surface of the film. The film is wrapped around the article and heat sealed in the area of overlap of the film ends. The printed portion extends to the ends of the film and across the film over a width substantially coextensive with the width of the face of the article on which the seal is to be located.

    摘要翻译： 用于包装立方体或矩形制品的容易开封薄膜包装由具有印刷部分的薄膜制成，所述印刷部分包含墨水和相容的热塑性树脂。 将薄膜缠绕在物品上并热封在膜端部重叠的区域。 印刷部分延伸到膜的端部并且跨过膜，其宽度基本上与要在其上定位密封件的物品的面的宽度共同延伸。

    Method for manufacturing plastic case
    3.
    发明授权
    Method for manufacturing plastic case 失效
    塑料外壳制造方法

    公开(公告)号：US5552101A

    公开(公告)日：1996-09-03

    申请号：US453308

    申请日：1995-05-30

    申请人： Tatsuo Fujii ,  Kimio Tanaka

    发明人： Tatsuo Fujii ,  Kimio Tanaka

    IPC分类号： B29C33/42 ,  B29C43/22 ,  B29C69/00 ,  B31B50/16 ,  B29C43/24 ,  B29C43/46 ,  B65D85/575

    CPC分类号： B29C69/001 ,  B29C33/42 ,  B29C43/222 ,  B29C47/0021 ,  B31B1/00 ,  B29C2793/00 ,  B29C47/0038 ,  B29C47/0059 ,  B29C47/0066 ,  B29C47/0069 ,  B31B2201/145 ,  B31B2201/88

    摘要： A method for making plastic case blanks is disclosed. A molten plastic material is passed through a nip of a first, preforming pair of molding cylinders to form a semi-solidified sheet having a first thickness, The semi-solidified sheet is then molded to form a final sheet having a second, uniform thickness less than the first thickness and the final sheet is scored to form folding scores and cut to form a plurality of the blanks. The molding, scoring and cutting are simultaneously performed by passing the semi-solidified sheet through a nip of a second pair of cylinders. One of the second pair of cylinders has scoring means for forming the folding scores in the final sheet and cutting means for cutting the final sheet to form the plurality of the blanks and the other of the second pair of cylinders has recess means complementary to the cutting means for receiving the cutting means and effectuating the cutting.

    摘要翻译： 公开了制造塑料外壳坯料的方法。 熔融的塑料材料通过第一预成型的一对成型圆筒的辊隙，以形成具有第一厚度的半固化片材。然后将半固化片材模制成具有较小的第二均匀厚度的最终片材 比第一厚度和最终片材刻痕以形成折叠分数并切割以形成多个坯料。 通过将半固化片材通过第二对气缸的辊隙同时进行成型，刻痕和切割。 第二对圆柱体中的一个具有用于在最终片材中形成折叠分数的划痕装置和用于切割最终片材以形成多个坯料的切割装置，并且第二对圆柱体中的另一个具有与切割相互补充的凹部装置 用于接收切割装置并实现切割的装置。

    Casing for receiving a magnetic tape cassette
    4.
    发明授权
    Casing for receiving a magnetic tape cassette 失效
    用于接收磁带盒

    公开(公告)号：US5168998A

    公开(公告)日：1992-12-08

    申请号：US796379

    申请日：1991-11-22

    申请人： Takateru Satoh ,  Tatsuo Fujii ,  Haruo Shiba ,  Kimio Tanaka ,  Noboru Uemura

    发明人： Takateru Satoh ,  Tatsuo Fujii ,  Haruo Shiba ,  Kimio Tanaka ,  Noboru Uemura

    IPC分类号： G11B23/023

    CPC分类号： G11B23/0233

    摘要： A casing for receiving a magnetic tape cassette comprises a transparent or semi-transparent casing main body 1 adapted to receive therein a magnetic tape cassette and a cover 3 pivotally supported by the casing main body by way of hinges 2, wherein a rib 10 for restricting the movement of the magnetic tape cassette in the direction of thickness of the casing main body 1 and a rib 9 for restricting the movement of the cassette in the longer side direction of the casing main body 1 are formed in the inner wall at a corner portion of the cover member.

    摘要翻译： 用于接收磁带盒的壳体包括透明或半透明壳体主体1，其适于容纳其中的磁带盒和由壳体主体通过铰链2可枢转地支撑的盖3，其中，用于限制 磁带盒在壳体主体1的厚度方向上的移动和用于限制磁带盒在壳体主体1的长边方向上的移动的肋9形成在内壁上的角部 的盖构件。

    Capacitor
    5.
    发明授权
    Capacitor 失效
    电容器

    公开(公告)号：US07443655B2

    公开(公告)日：2008-10-28

    申请号：US11597812

    申请日：2005-07-07

    申请人： Katsumasa Miki ,  Tatsuo Fujii ,  Yuji Midou ,  Suzushi Kimura

    发明人： Katsumasa Miki ,  Tatsuo Fujii ,  Yuji Midou ,  Suzushi Kimura

    IPC分类号： H01G5/38 ,  H01G4/228

    CPC分类号： H01G9/042 ,  H01G9/012 ,  H01G9/048

    摘要： A capacitor includes a first capacitor element and a second capacitor element laminated on this first capacitor element. The first capacitor element is a solid electrolytic capacitor including a through-hole electrode penetrating a valve metal sheet and having one surface on which cathode and anode terminal portions are taken out. The second capacitor element has first and second electrodes which are provided via a dielectric layer, and second through-hole electrodes penetrating the dielectric layer. The second through-hole electrodes are coupled to the first electrode and insulated from the second electrode. Lead-out portions of the second electrodes are exposed from the dielectric layer. The second through-hole electrodes and the lead-out portions are disposed alternately. The first electrode is electrically coupled to the first through-hole electrode and the second electrode is electrically coupled to the valve metal sheet.

    摘要翻译： 电容器包括层叠在该第一电容器元件上的第一电容器元件和第二电容器元件。 第一电容器元件是固体电解电容器，其包括穿透阀金属片的通孔电极，并且具有其上取出阴极和阳极端子部分的一个表面。 第二电容器元件具有通过电介质层提供的第一和第二电极，以及穿过电介质层的第二通孔电极。 第二通孔电极耦合到第一电极并与第二电极绝缘。 第二电极的引出部分从电介质层露出。 第二通孔电极和引出部分交替设置。 第一电极电耦合到第一通孔电极，第二电极电耦合到阀金属片。

    Chip solid electrolytic capacitor
    6.
    发明授权
    Chip solid electrolytic capacitor 失效
    芯片固体电解电容器

    公开(公告)号：US07057882B2

    公开(公告)日：2006-06-06

    申请号：US11222964

    申请日：2005-09-12

    申请人： Tatsuo Fujii ,  Junichi Kurita ,  Yuji Midou ,  Tsuyoshi Yoshino

    发明人： Tatsuo Fujii ,  Junichi Kurita ,  Yuji Midou ,  Tsuyoshi Yoshino

    IPC分类号： H01G9/00 ,  H01G4/228 ,  H01G9/10

    CPC分类号： H01G9/012 ,  H01G9/042 ,  H01G9/08 ,  H01G9/14

    摘要： A chip solid electrolytic capacitor includes a capacitor element with an anode portion and a cathode portion, an anode lead frame, a cathode lead frame and packaging resin. The anode lead frame includes a first plane, an anode junction and an anode terminal. The anode junction is formed on one end of the first plane and connected to the anode portion. The anode terminal is formed on the other side of the first plane. The cathode lead frame has a second plane and a cathode terminal. The second plane has the cathode portion mounted thereon, is connected to the cathode portion, and is stacked on the first plane. The cathode terminal is formed on the same side of the second plane as the anode terminal. The packaging resin has a surface to be mounted and covers the capacitor element, with the anode terminal and the cathode terminal exposed on the surface to be mounted.

    摘要翻译： 芯片固体电解电容器包括具有阳极部分和阴极部分的电容器元件，阳极引线框架，阴极引线框架和封装树脂。 阳极引线框架包括第一平面，阳极结和阳极端子。 阳极结形成在第一平面的一端并连接到阳极部分。 阳极端子形成在第一平面的另一侧上。 阴极引线框架具有第二平面和阴极端子。 第二平面具有安装在其上的阴极部分，连接到阴极部分，并且堆叠在第一平面上。 阴极端子形成在与阳极端子相同的第二平面的一侧。 包装树脂具有要安装的表面并且覆盖电容器元件，阳极端子和阴极端子暴露在要安装的表面上。

    Chip solid electrolytic capacitor
    7.
    发明申请
    Chip solid electrolytic capacitor 失效
    芯片固体电解电容器

    公开(公告)号：US20060056136A1

    公开(公告)日：2006-03-16

    申请号：US11222964

    申请日：2005-09-12

    申请人： Tatsuo Fujii ,  Junichi Kurita ,  Yuji Midou ,  Tsuyoshi Yoshino

    发明人： Tatsuo Fujii ,  Junichi Kurita ,  Yuji Midou ,  Tsuyoshi Yoshino

    IPC分类号： H01G9/00

    CPC分类号： H01G9/012 ,  H01G9/042 ,  H01G9/08 ,  H01G9/14

    摘要： The chip solid electrolytic capacitor includes a capacitor element with an anode portion and a cathode portion, an anode lead frame, a cathode lead frame and packaging resin. The anode lead frame includes a first plane, an anode junction and an anode terminal. The anode junction is formed on one end of the first plane and connected to the anode portion. The anode terminal is formed on the other side of the first plane. The cathode lead frame has a second plane and a cathode terminal. The second plane mounts the cathode portion thereon and connected to the cathode portion, and is stacked on the first plane. The cathode terminal is formed on the same side of the second plane as the anode terminal. The packaging resin has a surface to be mounted and covers the capacitor element, with the anode terminal and the cathode terminal exposed on the surface to be mounted.

    摘要翻译： 芯片固体电解电容器包括具有阳极部分和阴极部分的电容器元件，阳极引线框架，阴极引线框架和封装树脂。 阳极引线框架包括第一平面，阳极结和阳极端子。 阳极结形成在第一平面的一端并连接到阳极部分。 阳极端子形成在第一平面的另一侧上。 阴极引线框架具有第二平面和阴极端子。 第二平面将阴极部分安装在其上并连接到阴极部分，并且堆叠在第一平面上。 阴极端子形成在与阳极端子相同的第二平面的一侧。 包装树脂具有要安装的表面并且覆盖电容器元件，阳极端子和阴极端子暴露在要安装的表面上。