公开(公告)号：US08345425B2

公开(公告)日：2013-01-01

申请号：US12852556

申请日：2010-08-09

申请人： Hiroyuki Toyoda ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Shigeyuki Sasaki ,  Akio Idei ,  Shigemasa Satoh

发明人： Hiroyuki Toyoda ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Shigeyuki Sasaki ,  Akio Idei ,  Shigemasa Satoh

IPC分类号： H05K7/20

CPC分类号： F28D15/0266 ,  F28D1/05366 ,  F28D15/046 ,  F28F1/325 ,  F28F13/187 ,  F28F2215/12 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling system for cooling a CPU 200 mounted on a printed circuit board 100 within a housing thereof, has a heat-receiving jacket 310, being thermally connected with a surface of the CPU generating heat therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof. A condenser 320 receives refrigerant vapor from the heat-receiving jacket for condensing the refrigerant vapor into a liquid by transferring the heat into an outside of the apparatus. A thermo siphon is used for circulating the refrigerant due to phase change thereof, and the condenser has fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.

摘要翻译： 用于冷却安装在其外壳内的印刷电路板100上的CPU 200的冷却系统具有与在其中产生热量的CPU的表面热连接的热接收套310，并且用于蒸发存储在压力中的液体制冷剂 - 减少内部空间的发热。 冷凝器320从热接收套管接收制冷剂蒸汽，用于通过将热量传递到设备的外部将制冷剂蒸汽冷凝成液体。 热虹吸由于其相变而使制冷剂循环，并且冷凝器沿着制冷剂的流动方向在其内壁表面上具有细槽，并且在其横截面上也形成为平坦的，用于冷却 来自受热套的内壁面上的制冷剂蒸气有效。

公开(公告)号：US20100073863A1

公开(公告)日：2010-03-25

申请号：US12544153

申请日：2009-08-19

申请人： Hitoshi MATSUSHIMA ,  Tadakatsu Nakajima ,  Takayuki Atarashi ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Akio Idei ,  Shigeyasu Tsubaki ,  Takumi Sugiura ,  Yasuhiro Kashirajima

发明人： Hitoshi MATSUSHIMA ,  Tadakatsu Nakajima ,  Takayuki Atarashi ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Akio Idei ,  Shigeyasu Tsubaki ,  Takumi Sugiura ,  Yasuhiro Kashirajima

IPC分类号： H05K7/20

CPC分类号： H05K7/20809 ,  H05K7/20245

摘要： An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.

摘要翻译： 诸如刀片服务器等的电子设备具有冷却系统，用于有效地冷却安装在自由放置和取出的叶片上的诸如CPU的多个发热半导体器件。 冷却系统包括将来自具有较高发热量的装置（例如CPU等）的热量传递到设备外部的热虹吸管，将热发生相对低的装置的热传递到热虹吸管的热管， 其通过将叶片安装到壳体中而热耦合到热虹吸管并且收集和传递来自热虹吸管和热管的热量，以及冷凝器，其将由热力公路收集和传送的热量传送到壳体外部。

公开(公告)号：US20090154104A1

公开(公告)日：2009-06-18

申请号：US12328967

申请日：2008-12-05

申请人： Yoshihiro Kondo ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

发明人： Yoshihiro Kondo ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

IPC分类号： H05K7/20

CPC分类号： H05K7/20809 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20781

摘要： It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.

摘要翻译： 本发明的目的是提供一种用于最佳地冷却CPU刀片上的半导体器件的冷却装置，该刀片使用具有紧凑结构的冷却装置相对于电子设备可拆卸，以降低功耗。 一种用于冷却设置在电子设备的壳体中的电子电路基板上的半导体器件的冷却装置，包括：第一冷却单元，包括第一吸热部分和第一放热部分;第二冷却单元，包括第二吸热部分 部分和第二散热部分，其中第一吸热部分设置成与半导体器件接触，第二吸热部分可拆卸地设置成与第一散热部分接触，相变制冷剂包含在第一散热部分中 冷却单元，第二散热部设置在壳体的外部。

公开(公告)号：US07936560B2

公开(公告)日：2011-05-03

申请号：US12544166

申请日：2009-08-19

申请人： Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Tomoo Hayashi

发明人： Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Tomoo Hayashi

IPC分类号： H05K7/20

CPC分类号： F28D15/043 ,  F28D15/046 ,  H01L2924/0002 ,  H05K7/20809 ,  H01L2924/00

摘要： A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.

摘要翻译： 提供了包括具有高性能CPU的冷却结构的刀片服务器。 为了提高滞留在翅片之间的冷凝工作流体的排水性能，使用蒸气冷凝管，在上述管内表面上沿与管轴方向大致平行的方向形成有槽， 上述散热片的一排在上述槽的侧面露出，当上述槽位于上述的蒸汽冷凝管的管轴方向的中心线时，上述槽沿垂直方向配置在下侧 将上述凹槽安装在上述蒸汽冷凝管中，并且将具有小于上述翅片排的翅片空间的线空间的芯填充在上述凹槽内。

公开(公告)号：US08164902B2

公开(公告)日：2012-04-24

申请号：US12544153

申请日：2009-08-19

申请人： Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Takayuki Atarashi ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Akio Idei ,  Shigeyasu Tsubaki ,  Takumi Sugiura ,  Yasuhiro Kashirajima

发明人： Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Takayuki Atarashi ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Akio Idei ,  Shigeyasu Tsubaki ,  Takumi Sugiura ,  Yasuhiro Kashirajima

IPC分类号： H05K7/20

CPC分类号： H05K7/20809 ,  H05K7/20245

摘要： An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.

摘要翻译： 诸如刀片服务器等的电子设备具有冷却系统，用于有效地冷却安装在自由放置和取出的叶片上的诸如CPU的多个发热半导体器件。 冷却系统包括将来自具有较高发热量的装置（例如CPU等）的热量传递到设备外部的热虹吸管，将热发生相对低的装置的热传递到热虹吸管的热管， 其通过将叶片安装到壳体中而热耦合到热虹吸管并且收集和传递来自热虹吸管和热管的热量，以及冷凝器，其将由热力公路收集和传送的热量传送到壳体外部。

公开(公告)号：US08130497B2

公开(公告)日：2012-03-06

申请号：US12620742

申请日：2009-11-18

申请人： Yoshihiro Kondo ,  Tadakatsu Nakajima ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hiroyuki Toyoda ,  Tomoo Hayashi

发明人： Yoshihiro Kondo ,  Tadakatsu Nakajima ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hiroyuki Toyoda ,  Tomoo Hayashi

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  H05K7/20818

摘要： A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink. The second heat transmission member is disposed in the fan module unit, and a heat radiation member provided for the pipes forms an airflow passage together with the motherboard.

摘要翻译： 一种具有冷却能力的服务器系统，其可以应对可拆卸地安装在刀片服务器上的服务器模块的CPU产生的热量的增加。 服务器模块包括容纳其中安装有CPU，存储器等的母板的壳体和用于冷却由CPU产生的热的沸腾冷却装置的一部分。 容纳在风扇模块中的风扇适于通过服务器模块外壳的开口将空气吹入服务器模块。 沸腾冷却装置包括设置在服务器模块外壳中的第一传热构件，设置在服务器模块外壳外部的第二传热构件和连接它们的多个管道。 第一传热构件是具有用于气密地密封制冷剂的内部空间的盒体，其一个外部平面被热连接到CPU，而另一个外部平面设置有散热器。 第二传热构件设置在风扇模块单元中，并且用于管道的散热构件与主板一起形成气流通道。

公开(公告)号：US07826217B2

公开(公告)日：2010-11-02

申请号：US12328967

申请日：2008-12-05

申请人： Yoshihiro Kondo ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

发明人： Yoshihiro Kondo ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

IPC分类号： H05K7/20

CPC分类号： H05K7/20809 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20781

摘要： It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.

摘要翻译： 本发明的目的是提供一种用于最佳地冷却CPU刀片上的半导体器件的冷却装置，该刀片使用具有紧凑结构的冷却装置相对于电子设备可拆卸，以降低功耗。 一种用于冷却设置在电子设备的壳体中的电子电路基板上的半导体器件的冷却装置，包括：第一冷却单元，包括第一吸热部分和第一放热部分;第二冷却单元，包括第二吸热部分 部分和第二散热部分，其中第一吸热部分设置成与半导体器件接触，第二吸热部分可拆卸地设置成与第一散热部分接触，相变制冷剂包含在第一散热部分中 冷却单元，第二散热部设置在壳体的外部。

公开(公告)号：US20100073865A1

公开(公告)日：2010-03-25

申请号：US12544137

申请日：2009-08-19

申请人： Tomoo HAYASHI ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki

发明人： Tomoo HAYASHI ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki

IPC分类号： G06F1/20

CPC分类号： G06F1/185 ,  G06F1/20 ,  H05K7/20772

摘要： An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conducting medium to the clearance, and a detachable connecting part formed between the heat release part and the heat absorbing part.

摘要翻译： 电子设备包括：壳体; 叶片，其每一个都可从壳体拆卸，并且至少安装有CPU和存储器; 第一冷却装置，每个冷却装置取出在叶片外部的叶片中产生的热量，所述第一冷却装置中的每一个具有固定到叶片的细长柱形式的散热部分; 第二冷却装置固定到壳体以排出从壳体外部的第一冷却装置输送的热量，每个所述第二冷却装置具有能够容纳第一冷却装置的散热部分的吸热部分; 当散热部分插入到吸热部分中时，形成在散热部和吸热部之间的间隙流体连通的中间容器; 存储在每个介质储存器中的导热介质; 用于对导热介质加压以将导热介质供应到间隙的加压装置，以及形成在散热部分和吸热部分之间的可拆卸连接部分。

公开(公告)号：US07839640B2

公开(公告)日：2010-11-23

申请号：US12544137

申请日：2009-08-19

申请人： Tomoo Hayashi ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki

发明人： Tomoo Hayashi ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki

IPC分类号： H05K7/20

CPC分类号： G06F1/185 ,  G06F1/20 ,  H05K7/20772

摘要： An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conducting medium to the clearance, and a detachable connecting part formed between the heat release part and the heat absorbing part.

摘要翻译： 电子设备包括：壳体; 叶片，其每一个都可从壳体拆卸，并且至少安装有CPU和存储器; 第一冷却装置，每个冷却装置取出在叶片外部的叶片中产生的热量，所述第一冷却装置中的每一个具有固定到叶片的细长柱形式的散热部分; 第二冷却装置固定到壳体以排出从壳体外部的第一冷却装置输送的热量，每个所述第二冷却装置具有能够容纳第一冷却装置的散热部分的吸热部分; 当散热部分插入到吸热部分中时，形成在散热部和吸热部之间的间隙流体连通的中间容器; 存储在每个介质储存器中的导热介质; 用于对导热介质加压以将导热介质供应到间隙的加压装置，以及形成在散热部分和吸热部分之间的可拆卸连接部分。

公开(公告)号：US07420891B2

公开(公告)日：2008-09-02

申请号：US11108708

申请日：2005-04-19

申请人： Manabu Ochi ,  Hirofumi Taguchi ,  Hiroyuki Toyoda

发明人： Manabu Ochi ,  Hirofumi Taguchi ,  Hiroyuki Toyoda

IPC分类号： G11B21/16

CPC分类号： G11B7/0933

摘要： An optical pickup device comprises a semiconductor laser that causes outgoing of laser beam used for reproduction and recording of information on an optical disk, and an objective lens that conducts the laser beam outgoing from the semiconductor laser to the optical disk. The objective lens is driven by a yoke, a focusing coil, a tracking coil, etc. These elements are accommodated in a pickup housing. First and second bearing portions supporting the pickup housing to make the same movable are attached to the pickup housing and arranged on both sides with the objective lens therebetween. The yoke is thermally connected to the first bearing portion positioned on an opposite side of the yoke to the semiconductor laser.

摘要翻译： 一种光学拾取装置，包括使用于光盘再现和记录信息的激光束的出射的半导体激光器和将从半导体激光器射出的激光束传导到光盘的物镜。 物镜由轭，聚焦线圈，跟踪线圈等驱动。这些元件容纳在拾取器壳体中。 支撑拾取器壳体以使相同的可移动的第一和第二轴承部分附接到拾取器壳体并且在其两侧之间设置有物镜。 磁轭与位于与磁轭相反侧的第一轴承部分与半导体激光器热连接。