公开(公告)号：US08345425B2

公开(公告)日：2013-01-01

申请号：US12852556

申请日：2010-08-09

申请人： Hiroyuki Toyoda ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Shigeyuki Sasaki ,  Akio Idei ,  Shigemasa Satoh

发明人： Hiroyuki Toyoda ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Shigeyuki Sasaki ,  Akio Idei ,  Shigemasa Satoh

IPC分类号： H05K7/20

CPC分类号： F28D15/0266 ,  F28D1/05366 ,  F28D15/046 ,  F28F1/325 ,  F28F13/187 ,  F28F2215/12 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling system for cooling a CPU 200 mounted on a printed circuit board 100 within a housing thereof, has a heat-receiving jacket 310, being thermally connected with a surface of the CPU generating heat therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof. A condenser 320 receives refrigerant vapor from the heat-receiving jacket for condensing the refrigerant vapor into a liquid by transferring the heat into an outside of the apparatus. A thermo siphon is used for circulating the refrigerant due to phase change thereof, and the condenser has fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.

摘要翻译： 用于冷却安装在其外壳内的印刷电路板100上的CPU 200的冷却系统具有与在其中产生热量的CPU的表面热连接的热接收套310，并且用于蒸发存储在压力中的液体制冷剂 - 减少内部空间的发热。 冷凝器320从热接收套管接收制冷剂蒸汽，用于通过将热量传递到设备的外部将制冷剂蒸汽冷凝成液体。 热虹吸由于其相变而使制冷剂循环，并且冷凝器沿着制冷剂的流动方向在其内壁表面上具有细槽，并且在其横截面上也形成为平坦的，用于冷却 来自受热套的内壁面上的制冷剂蒸气有效。

公开(公告)号：US5959351A

公开(公告)日：1999-09-28

申请号：US103227

申请日：1993-08-09

申请人： Shigeyuki Sasaki ,  Tadakatsu Nakajima ,  Noriyuki Ashiwake ,  Yasuo Ohsone ,  Toshio Hatada ,  Toshiki Iino ,  Akio Idei ,  Kenichi Kasai

发明人： Shigeyuki Sasaki ,  Tadakatsu Nakajima ,  Noriyuki Ashiwake ,  Yasuo Ohsone ,  Toshio Hatada ,  Toshiki Iino ,  Akio Idei ,  Kenichi Kasai

IPC分类号： H01L23/44 ,  F15D1/08 ,  H01L23/427 ,  H01L23/473 ,  H01L23/34

CPC分类号： F15D1/08 ,  H01L23/473 ,  F28F13/02 ,  H01L2924/0002

摘要： There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling medium supply member which cools a respective one of the semiconductor devices by a jet of the cooling liquid. With this arrangement, the flow of the cooling liquid downstream of the wire-like member is disturbed to promote the boiling over the entire surface of the semiconductor device, and when the semiconductor device is to be cooled, a transient temperature rise is reduced at the time of starting the energization of the semiconductor device, thereby stabilizing the temperature of the semiconductor device.

摘要翻译： 公开了一种液冷电子装置。 半导体器件安装在浸没在冷却液中的半导体模块的衬底上。 在各冷却介质供给部件的冷却介质喷出口附近设置有线状部件，冷却介质供给部件通过冷却液喷射冷却各个半导体器件。 通过这种布置，线状构件下游的冷却液的流动受到干扰，促使半导体装置的整个表面沸腾，并且当半导体装置被冷却时，瞬态温度上升在 开始半导体器件通电的时间，从而稳定半导体器件的温度。

公开(公告)号：US5406807A

公开(公告)日：1995-04-18

申请号：US77109

申请日：1993-06-16

申请人： Noriyuki Ashiwake ,  Tadakatsu Nakajima ,  Shigeyuki Sasaki ,  Yasuo Ohsone ,  Toshio Hatada ,  Toshiki Iino ,  Kenichi Kasai ,  Akio Idei

发明人： Noriyuki Ashiwake ,  Tadakatsu Nakajima ,  Shigeyuki Sasaki ,  Yasuo Ohsone ,  Toshio Hatada ,  Toshiki Iino ,  Kenichi Kasai ,  Akio Idei

IPC分类号： H01L23/427 ,  F25D17/02

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  Y10S165/908

摘要： An apparatus for cooling semiconductor devices includes a module for cooling semiconductor devices; a refrigerant cooling device for receiving via an outlet pipe the refrigerant discharged through an outlet port of the module to cool the refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, the refrigerant cooled by the refrigerant cooling device and sending the refrigerant to the module via an inlet pipe; and a refrigerant-flow stabilizing mechanism for stabilizing a refrigerant circulation flow discharged from the refrigerant circulation pump to be returned to the refrigerant circulation pump via the module and the refrigerant cooling device. Since the refrigerant-flow stabilizing mechanism stabilize the refrigerant flow, the refrigerant flow can be stably circulated so that the semiconductor devices in the module are stably cooled.

摘要翻译： 一种用于冷却半导体器件的设备包括用于冷却半导体器件的模块; 制冷剂冷却装置，用于经由出口管接收通过模块的出口排出的制冷剂以冷却制冷剂; 制冷剂循环泵，其经由吸入管接收由所述制冷剂冷却装置冷却的制冷剂，并且经由入口管将所述制冷剂输送到所述组件; 以及制冷剂流量稳定机构，其使从制冷剂循环泵排出的制冷剂循环流量稳定化，经由模块和制冷剂冷却装置返回到制冷剂循环泵。 由于制冷剂流动稳定机构使制冷剂流动稳定，所以可以稳定地循环制冷剂流，使得模块中的半导体器件稳定地冷却。

公开(公告)号：US5270572A

公开(公告)日：1993-12-14

申请号：US903458

申请日：1992-06-24

申请人： Tadakatsu Nakajima ,  Shigeo Ohashi ,  Heikichi Kuwahara ,  Noriyuki Ashiwake ,  Motohiro Sato ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Toshio Hatada ,  Shigeyuki Sasaki ,  Hiroshi Inouye ,  Atsuo Nishihara ,  Kenichi Kasai

发明人： Tadakatsu Nakajima ,  Shigeo Ohashi ,  Heikichi Kuwahara ,  Noriyuki Ashiwake ,  Motohiro Sato ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Toshio Hatada ,  Shigeyuki Sasaki ,  Hiroshi Inouye ,  Atsuo Nishihara ,  Kenichi Kasai

IPC分类号： H01L23/44 ,  H01L23/473 ,  H05K7/20 ,  H01L23/02 ,  H01L25/04

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/12044

摘要： A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.

摘要翻译： 一种半导体冷却单元，用于将冷却介质直接喷射到用于高速计算机等的半导体器件的表面上，以有效地从半导体器件移除热量，其中用于将空间分隔成半导体器件放置的区域的分隔构件 。 每个分隔区域在其顶侧具有开口，并且通过所述开口供给或排出冷却介质的管设置成朝向每个半导体器件的背面的中心部分突出。 该管也用于将冷却介质供应集管或冷却介质返回集管分成一部分，从而可以平滑地去除从半导体器件表面产生的气泡，从而冷却介质可以顺利地流动到半导体器件上。

公开(公告)号：US5774334A

公开(公告)日：1998-06-30

申请号：US520338

申请日：1995-08-28

申请人： Keizo Kawamura ,  Noriyuki Ashiwake ,  Takahiro Daikoku ,  Akio Idei ,  Kenichi Kasai ,  Hideyuki Kimura ,  Atsuo Nishihara ,  Toshio Hatada ,  Shigeyuki Sasaki

发明人： Keizo Kawamura ,  Noriyuki Ashiwake ,  Takahiro Daikoku ,  Akio Idei ,  Kenichi Kasai ,  Hideyuki Kimura ,  Atsuo Nishihara ,  Toshio Hatada ,  Shigeyuki Sasaki

IPC分类号： H01L23/433 ,  H05K7/20

CPC分类号： H01L23/4338 ,  H01L2224/16 ,  H01L2224/73253

摘要： Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module. The mass production capability of the heat conducting members is improved by providing such highly rigid fins, and improved cooling function is provided by firmly introducing the cooling medium to the respective fins while permitting the module to be reduced in size.

摘要翻译： 半导体器件通过焊料固定在衬底上，并且具有封闭结构的半导体模块由衬底，凸缘和壳体形成。 两组导热构件分别与半导体装置收缩的翅片和壳体的内壁连接到半导体。 两组导热构件的每个翅片的翅片厚度相对较厚，翅片高度低，并且相应的相对的导热构件的各个翅片之间的间隙非常小。 作为导热介质的液体封装在半导体模块中。 半导体模块的液面被控制成使得其以垂直方式接触半导体模块中的最上面的半导体器件。 此外，在半导体模块中形成的空间的顶面和底面设置有用于引入和移除冷却流体的阀机构。 通过提供这种高度刚性的翅片来提高导热构件的批量生产能力，并且通过将冷却介质牢固地引入各个翅片来提供改进的冷却功能，同时允许模块减小尺寸。

公开(公告)号：US09534827B2

公开(公告)日：2017-01-03

申请号：US14405408

申请日：2012-06-07

申请人： Wataru Sato ,  Shigeyuki Sasaki

发明人： Wataru Sato ,  Shigeyuki Sasaki

IPC分类号： F25D21/14 ,  F28F17/00 ,  F28D1/053 ,  F28F1/12 ,  F28F1/32 ,  F28D21/00

CPC分类号： F25D21/14 ,  F25B39/02 ,  F28D1/05383 ,  F28D2021/0071 ,  F28F1/128 ,  F28F1/325 ,  F28F17/005

摘要： Provided is an air heat exchanger capable of preventing an increase in ventilation resistance and a decrease in heat exchange efficiency due to condensation water generated on surfaces of heat transfer fins, without increasing thermal resistance of flat tubes and the heat transfer fins, and preventing scattering of water droplets downwind from the heat transfer fins. In the air heat exchanger including a plurality of flat tubes 2 and heat transfer fins 5 provided between the flat tubes 2 and on which air is blown, the flat tubes 2 include water draining grooves 4 on side surfaces on which the heat transfer fins 5 are provided and the heat transfer fins 5 include water guiding grooves 6 communicating with the water draining grooves 4. At least a groove wall 40 on the upwind side of an air blowing direction 10 among groove walls forming the water guiding grooves 6 is provided from a position of the upwind side from the water draining grooves 4 to the water draining grooves 4. The water guiding grooves 6 extend toward the water draining grooves 4 along the groove wall 40 on the upwind side and an area of a cross section perpendicular to an extension direction decreases toward the water draining grooves 4.

摘要翻译： 提供一种空气热交换器，其能够防止由于传热翅片表面产生的冷凝水导致的通风阻力增加和热交换效率降低，而不增加扁平管和传热翅片的热阻，并且防止散热 水滴从传热翅片向下风向。 在包括设置在扁平管2之间的多个扁平管2和传热翅片5的空气热交换器中，扁平管2包括在其上具有传热翅片5的侧表面上的排水槽4 传热翅片5包括与排水槽4连通的导水槽6.至少在形成导水槽6的槽壁中的吹风方向10的上风侧的槽壁40从位置 从排水沟4向排水槽4的上风侧。导水槽6沿着上下风向侧的槽壁40向排水槽4延伸，与延伸方向垂直的截面的区域 朝向排水槽4减少。

公开(公告)号：US20090186228A1

公开(公告)日：2009-07-23

申请号：US12318293

申请日：2008-12-24

申请人： Takuhiro Kakii ,  Hideki Ichimura ,  Shigeyuki Sasaki ,  Kazuhi Koga ,  Takaomi Matsuda

发明人： Takuhiro Kakii ,  Hideki Ichimura ,  Shigeyuki Sasaki ,  Kazuhi Koga ,  Takaomi Matsuda

IPC分类号： B32B27/40 ,  B05D7/04

CPC分类号： C09D175/04 ,  B05D7/572 ,  B05D2202/10 ,  B05D2451/00 ,  C08G18/10 ,  C08G18/12 ,  C08G18/4211 ,  C08G18/6229 ,  C08G18/6254 ,  Y10T428/31576 ,  C08L2666/04 ,  C08L2666/16 ,  B05D2401/10 ,  B05D2401/20 ,  B05D2401/40

摘要： An object of the present invention relates to provide a method for forming a multi-layered coating film including a step of baking and curing an uncured intermediate coating film, an uncured base coating film and an uncured clear coating film at the same time which can give a multi-layered coating film excellent in gloss and in appearance, and to provide a multi-layered coating film obtained thereof.The present invention provides to a method for forming a multi-layered coating film in three-coat and one-bake coating method, using a solvent-borne intermediate coating composition containing an urethane-modified polyester resin (a) having a water tolerance value of 4 to 10 ml, a melamine resin (b) having a hexane tolerance value of 8 to 40 ml, a blocked isocyanate compound (c) and a nonaqueous dispersion resin (d), and a water-borne base coating composition containing an emulsion resin and a pigment.

摘要翻译： 本发明的目的在于提供一种形成多层涂膜的方法，该方法包括同时焙烧和固化未固化的中间涂膜，未固化的基底涂膜和未固化的透明涂膜的步骤， 具有优异的光泽和外观的多层涂膜，并提供其获得的多层涂膜。 本发明提供一种三层和一层烘烤法形成多层涂膜的方法，该方法使用含有氨基甲酸酯改性聚酯树脂（a）的溶剂型中间涂料组合物，该组合物的耐水值为 4至10ml，己烷耐受值为8至40ml的三聚氰胺树脂（b），封端异氰酸酯化合物（c）和非水分散体树脂（d），以及含有乳液树脂的水性基础涂料组合物 和颜料。

公开(公告)号：US20050176880A1

公开(公告)日：2005-08-11

申请号：US11053428

申请日：2005-02-09

申请人： Hiroaki Fujii ,  Norikuni Tabii ,  Shigeyuki Sasaki

发明人： Hiroaki Fujii ,  Norikuni Tabii ,  Shigeyuki Sasaki

IPC分类号： C08G18/40 ,  C08L51/08 ,  C08L75/02 ,  C09D5/36 ,  C09D7/45 ,  C09D133/14 ,  C09D175/02 ,  C09D175/12 ,  C08K3/00

CPC分类号： C09D5/38 ,  C08G18/4063 ,  C08L51/08 ,  C08L75/02 ,  C09D5/36 ,  C09D7/45 ,  C09D133/14 ,  C09D175/12 ,  C08L2666/24 ,  C08L2666/16

摘要： Disclosed is a solvent-borne metallic base coating composition which comprises (A) an urea-contained acrylic resin, (B) a urethane-modified polyester resin, (C) a curing agent and (D) a luster pigment, wherein a solid weight ratio of the urea-contained acrylic resin (A)/the urethane-modified polyester resin (B) is within the range of from 60/40 to 95/5. The resin coating composition can form metallic coatings having high color phase difference between looking at high light position and looking at shade position, in particular those having high FF property, excellent appearance (surface texture) and transparency. (92 words)

摘要翻译： 公开了一种溶剂型金属基涂料组合物，其包含（A）含脲的丙烯酸树脂，（B）氨基甲酸酯改性的聚酯树脂，（C）固化剂和（D）光泽颜料，其中固体重量 含脲丙烯酸类树脂（A）/氨基甲酸酯改性聚酯树脂（B）的比例在60/40〜95/5的范围内。 树脂涂料组合物可以形成在高亮度位置和阴影位置之间具有高色相差的金属涂层，特别是具有高FF性能，优异外观（表面纹理）和透明度的那些。 （92字）

公开(公告)号：US5932658A

公开(公告)日：1999-08-03

申请号：US667934

申请日：1996-06-24

申请人： Yasuo Tanaka ,  Takeshi Takagi ,  Shigeyuki Sasaki ,  Makoto Shimizu ,  Yoshitaka Okude

发明人： Yasuo Tanaka ,  Takeshi Takagi ,  Shigeyuki Sasaki ,  Makoto Shimizu ,  Yoshitaka Okude

IPC分类号： B05D7/00 ,  C08L33/02 ,  C08L33/06 ,  C08L35/00 ,  C09D133/06 ,  C08L33/14

CPC分类号： B05D7/532 ,  C09D133/064 ,  C09D133/068 ,  C08L2205/18 ,  C08L33/02 ,  C08L33/068 ,  C08L35/00

摘要： The present invention provides a curable resin composition having good curability and storage stability, which provides a cured film having excellent weather resistance, acid resistance and mar resistance. The curable resin composition comprises:(a) 20 to 80% by weight of a polycarboxylic acid having an acid value of 25 to 300 mg KOH/g based on solid and a number average molecular weight of 500 to 20000; and(b) 20 to 80% by weight of a polyepoxide having an epoxy equivalent of 100 to 800 and a number average molecular weight of 500 to 20000, prepared by copolymerizing: (1) 10 to 60% by weight of a long-chain epoxy monomer; and (2) 40 to 90% by weight of an ethylenically unsaturated monomer having no epoxy group. The present invention also provides a process for forming a cured film using the resin composition.

摘要翻译： 本发明提供了具有良好的固化性和保存稳定性的固化性树脂组合物，其提供了耐候性，耐酸性和耐擦伤性优异的固化膜。 可固化树脂组合物包含：（a）20至80重量％的基于固体的酸值为25至300mg KOH / g并且数均分子量为500至20000的多元羧酸; 和（b）20〜80重量％的环氧当量为100〜800，数均分子量为500〜20000的聚环氧化物，通过以下方法制备：（1）10〜60重量％的长链 环氧单体; 和（2）40〜90重量％的不具有环氧基的烯属不饱和单体。 本发明还提供了使用该树脂组合物形成固化膜的方法。

公开(公告)号：US20110171358A1

公开(公告)日：2011-07-14

申请号：US13064389

申请日：2011-03-22

申请人： Miharu Ogura ,  Yoshihiro Yaguchi ,  Makoto Emura ,  Toshihiro Takeda ,  Yoshifumi Yuasa ,  Shigeyuki Sasaki

发明人： Miharu Ogura ,  Yoshihiro Yaguchi ,  Makoto Emura ,  Toshihiro Takeda ,  Yoshifumi Yuasa ,  Shigeyuki Sasaki

IPC分类号： A23L1/22 ,  A23L2/56

CPC分类号： C11D3/50 ,  A23L27/2022 ,  A61K8/46 ,  A61Q11/00 ,  A61Q13/00 ,  A61Q19/00 ,  C11B9/0011

摘要： The present invention relates to a flavor composition or fragrance composition which can satisfy diversified requirements for flavored products, as well as to a flavor-improving agent which can improve the quality and release of aroma of a beverage or food. More particularly, the present invention relates to a flavor composition or fragrance composition which comprises an optically active S-alkyl 2-methylbutanethioate as an active ingredient, a flavor- or fragrance-added product, a flavor-improving agent which comprises an optically active S-alkyl 2-methylbutanethioate as an active ingredient, and a beverage or food having an improved flavor. The optically active S-alkyl 2-methylbutanethioate includes S-alkyl(R)-2-methylbutanethioate and S-alkyl(S)-2-methylbutanethioate.

摘要翻译： 本发明涉及可以满足调味产品多样化要求的风味组合物或香料组合物，以及能够改善饮料或食品香气质量和释放的风味改善剂。 更具体地说，本发明涉及一种风味组合物或香料组合物，其包含作为活性成分的光学活性的2-甲基丁硫醇S-烷基酯，加入香料或香料的产品，风味改善剂，其包含光学活性的S - 烷基2-甲基丁硫醇盐作为活性成分，以及具有改善风味的饮料或食品。 光学活性的2-甲基丁硫醇S-烷基酯包括（R）-2-甲基丁硫烷酸S-烷基酯和（S）-2-甲基丁硫醇S-烷基酯。