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    Polishing apparatus
    3.
    发明授权
    Polishing apparatus 失效
    抛光设备

    公开(公告)号：US06913513B2

    公开(公告)日：2005-07-05

    申请号：US09784171

    申请日：2001-02-16

    申请人： Norio Kimura ,  Katsuya Okumura ,  Hiroyuki Yano

    发明人： Norio Kimura ,  Katsuya Okumura ,  Hiroyuki Yano

    IPC分类号： B24B37/013 ,  B24B37/10 ,  B24B49/04 ,  B24B49/12 ,  H01L21/304

    CPC分类号： B24B37/26 ,  B24B37/013 ,  B24B37/205 ,  B24B49/04 ,  B24B49/12

    摘要： A polishing apparatus comprises a polishing table having a polishing surface, a top ring for holding a substrate and pressing a surface of the substrate against the polishing surface to polish the surface of the substrate, and at least one optical measuring device disposed adjacent to the outer peripheral portion of the polishing table and below the polishing surface of the polishing table for measuring the thickness of a layer formed on the surface of the substrate. The polishing apparatus further comprises at least one notch formed in the peripheral portion of the polishing table. The notch allows light emitted from the optical measuring device to pass therethrough and be incident on the surface of the substrate and allows light reflected from the surface of the substrate to pass therethrough and be incident on the optical measuring device.

    摘要翻译： 抛光装置包括具有抛光表面的抛光台，用于保持基板的顶环，并将基板的表面压靠在抛光表面上以抛光基板的表面;以及至少一个光学测量装置，其邻近外部设置 抛光台的周边部分和抛光台的抛光表面下方，用于测量在基板表面上形成的层的厚度。 抛光装置还包括形成在抛光台的周边部分中的至少一个凹口。 该凹口允许从光学测量装置发射的光通过，并且入射到基板的表面上，并允许从基板的表面反射的光通过，并入射到光学测量装置上。

    Method for polishing a substrate
    4.
    发明授权
    Method for polishing a substrate 有权
    抛光基材的方法

    公开(公告)号：US06609950B2

    公开(公告)日：2003-08-26

    申请号：US09897918

    申请日：2001-07-05

    申请人： Norio Kimura ,  Yu Ishii ,  Hirokuni Hiyama ,  Katsuya Okumura ,  Hiroyuki Yano

    发明人： Norio Kimura ,  Yu Ishii ,  Hirokuni Hiyama ,  Katsuya Okumura ,  Hiroyuki Yano

    IPC分类号： B24B4900

    CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B49/04 ,  H01L21/02074 ,  H01L21/3212 ,  H01L21/76807

    摘要： A method of polishing substrates enables the size of a polishing table to be reduced. A surface of a substrate to be polished is brought into contact with a polishing surface of a polishing table in such a manner that a portion of the surface of the substrate extends outwardly from an outer periphery of the polishing surface. The substrate is rotated about its center axis while keeping its surface in contact with the polishing surface of the polishing table. The attitude of the substrate carrier is controlled so that the surface of the substrate is kept parallel with the polishing surface of the polishing table during a polishing operation.

    摘要翻译： 研磨基板的方法能够减小抛光台的尺寸。 将要抛光的基底的表面以与研磨台的抛光表面接触的方式使得基底表面的一部分从抛光表面的外周向外延伸。 衬底围绕其中心轴线旋转，同时保持其表面与抛光台的抛光表面接触。 控制基板载体的姿态，使得在抛光操作期间基板的表面与抛光台的抛光表面保持平行。

    Method and apparatus for polishing a workpiece
    5.
    发明授权
    Method and apparatus for polishing a workpiece 失效
    抛光工件的方法和设备

    公开(公告)号：US5398459A

    公开(公告)日：1995-03-21

    申请号：US156641

    申请日：1993-11-24

    申请人： Katsuya Okumura ,  Tohru Watanabe ,  Riichirou Aoki ,  Hiroyuki Yano ,  Masako Kodera ,  Atsushi Shigeta ,  You Ishii ,  Norio Kimura ,  Masayoshi Hirose ,  Yukio Ikeda

    发明人： Katsuya Okumura ,  Tohru Watanabe ,  Riichirou Aoki ,  Hiroyuki Yano ,  Masako Kodera ,  Atsushi Shigeta ,  You Ishii ,  Norio Kimura ,  Masayoshi Hirose ,  Yukio Ikeda

    IPC分类号： B24B37/10 ,  B24B37/30 ,  B24B1/00

    CPC分类号： B24B37/102 ,  B24B37/30

    摘要： A workpiece such as a semiconductor wafer is positioned between a turntable and a top ring and polished by an abrasive cloth on the turntable while the top ring is being pressed against the turntable. The top ring has a retaining ring for preventing the workpiece from deviating from the lower surface of the top ring, and the retaining ring has an inside diameter larger than an outside diameter of the workpiece. The rotation of the turntable imparts a pressing force in a direction parallel to the upper surface of the turntable to the workpiece so that an outer periphery of the workpiece contacts an inner periphery of the retaining ring, and the rotation of the retaining ring imparts a rotational force to the workpiece so that the workpiece performs a planetary motion relative to the top ring in the retaining ring.

    摘要翻译： 诸如半导体晶片的工件位于转盘和顶环之间，并且当顶环被压靠在转盘上时，其通过研磨布在转盘上抛光。 顶环具有用于防止工件偏离顶环的下表面的保持环，并且保持环的内径大于工件的外径。 转台的转动使平台于转台上表面的方向向工件施加压力，使得工件的外周与保持环的内周接触，并且保持环的旋转赋予转动 使工件相对于保持环中的顶环执行行星运动。

    Polishing apparatus and method
    6.
    发明授权
    Polishing apparatus and method 有权
    抛光设备和方法

    公开(公告)号：US06722964B2

    公开(公告)日：2004-04-20

    申请号：US09824644

    申请日：2001-04-04

    申请人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

    发明人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

    IPC分类号： B24B100

    CPC分类号： B24B37/345 ,  B24B9/065 ,  B24B37/12 ,  H01L21/67046

    摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

    摘要翻译： 抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属 电影。 抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光 用于抛光衬底的外周部分的机构。

    Apparatus for polishing a wafer
    7.
    发明授权
    Apparatus for polishing a wafer 失效
    用于抛光晶片的设备

    公开(公告)号：US5876273A

    公开(公告)日：1999-03-02

    申请号：US625291

    申请日：1996-04-01

    申请人： Hiroyuki Yano ,  Katsuya Okumura ,  Norio Kimura ,  Tomoyuki Yahiro ,  Hozumi Yasuda

    发明人： Hiroyuki Yano ,  Katsuya Okumura ,  Norio Kimura ,  Tomoyuki Yahiro ,  Hozumi Yasuda

    IPC分类号： B24B37/30 ,  B24B29/02

    CPC分类号： B24B37/30

    摘要： A polishing apparatus is provided which improves uniformity across the surface of a polished wafer. The apparatus includes a wafer carrier, a guide ring coupled to a lower portion of the wafer carrier, a circular plate coupled to a first inner circumference portion of the guide ring distant from the wafer carrier, and a cavity, formed within an area bounded by the lower portion of the wafer carrier, an inner circumference of the circular plate, and a second inner circumference portion of the guide ring between the circular plate and the lower portion of the wafer carrier, the circular plate holding the wafer to be polished in the cavity.

    摘要翻译： 提供了一种改善抛光晶片表面均匀性的抛光装置。 该装置包括晶片载体，联接到晶片载体的下部的引导环，耦合到远离晶片载体的引导环的第一内周部分的圆形板，以及形成在由 晶片载体的下部，圆形板的内圆周和导向环的第二内周部分在圆形板和晶片载体的下部之间，圆形板将待抛光的晶片保持在 腔。

    Apparatus for polishing a substrate
    8.
    发明授权
    Apparatus for polishing a substrate 有权
    用于抛光衬底的装置

    公开(公告)号：US07291057B2

    公开(公告)日：2007-11-06

    申请号：US10601789

    申请日：2003-06-24

    申请人： Norio Kimura ,  Yu Ishii ,  Hirokuni Hiyama ,  Katsuya Okumura ,  Hiroyuki Yano

    发明人： Norio Kimura ,  Yu Ishii ,  Hirokuni Hiyama ,  Katsuya Okumura ,  Hiroyuki Yano

    IPC分类号： B24B49/00 ,  B24B1/00

    CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B49/04 ,  H01L21/02074 ,  H01L21/3212 ,  H01L21/76807

    摘要： A method of polishing substrates enables the size of a polishing table to be reduced. A surface of a substrate to be polished is brought into contact with a polishing surface of a polishing table in such a manner that a portion of the surface of the substrate extends outwardly from an outer periphery of the polishing surface. The substrate is rotated about its center axis while keeping its surface in contact with the polishing surface of the polishing table. The attitude of the substrate carrier is controlled so that the surface of the substrate is kept parallel with the polishing surface of the polishing table during a polishing operation.

    摘要翻译： 研磨基板的方法能够减小抛光台的尺寸。 将要抛光的基底的表面以与研磨台的抛光表面接触的方式使得基底表面的一部分从抛光表面的外周向外延伸。 衬底围绕其中心轴线旋转，同时保持其表面与抛光台的抛光表面接触。 控制基板载体的姿态，使得在抛光操作期间基板的表面与抛光台的抛光表面保持平行。

    Polishing apparatus and method
    9.
    发明申请
    Polishing apparatus and method 有权
    抛光设备和方法

    公开(公告)号：US20050260933A1

    公开(公告)日：2005-11-24

    申请号：US11187944

    申请日：2005-07-25

    申请人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

    发明人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

    IPC分类号： B24B9/06 ,  B24B37/12 ,  B24B37/34 ,  H01L21/00 ,  B24B49/00

    CPC分类号： B24B37/345 ,  B24B9/065 ,  B24B37/12 ,  H01L21/67046

    摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

    摘要翻译： 抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属 电影。 抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光 用于抛光衬底的外周部分的机构。

    Polishing apparatus and method
    10.
    发明授权
    Polishing apparatus and method 有权
    抛光设备和方法

    公开(公告)号：US07108589B2

    公开(公告)日：2006-09-19

    申请号：US11187944

    申请日：2005-07-25

    申请人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

    发明人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

    IPC分类号： B24B7/00

    CPC分类号： B24B37/345 ,  B24B9/065 ,  B24B37/12 ,  H01L21/67046

    摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

    摘要翻译： 抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属 电影。 抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光 用于抛光衬底的外周部分的机构。