摘要:
An infrared gas sensor includes: an infrared light source having a resistor for emitting an infrared light by heating the resistor; an infrared light sensor having a detection device for generating an electric signal in accordance with a temperature change of the detection device corresponding to the infrared light in a case where the sensor receives the infrared light; a reflection member for reflecting the infrared light emitted from the light source to introduce the infrared light to the sensor; a casing for accommodating the light source, the light sensor, and the reflection member; and a substrate. The reflection member faces the light source. The resistor and the detection device are disposed on the substrate.
摘要:
A Fabri-Perot filter includes: a substrate; a first mirror disposed on the substrate; and a movable mirror unit facing the first mirror with a gap therebetween. The movable mirror unit is movable toward the first mirror in a case where a predetermined voltage is applied between the first mirror and the movable mirror unit so that the gap is changeable. The filter is capable of transmitting an infrared light having a predetermined wavelength corresponding to the gap. The movable mirror unit includes a center portion and a periphery portion, which is deformable easier than the center portion.
摘要:
A Fabri-Perot filter includes: a substrate; a first mirror disposed on the substrate; and a movable mirror unit facing the first mirror with a gap therebetween. The movable mirror unit is movable toward the first mirror in a case where a predetermined voltage is applied between the first mirror and the movable mirror unit so that the gap is changeable. The filter is capable of transmitting an infrared light having a predetermined wavelength corresponding to the gap. The movable mirror unit includes a center portion and a periphery portion, which is deformable easier than the center portion.
摘要:
An ultrasonic sensor includes a plurality of converters and a protection component. The plurality of converters convert one of a received ultrasonic wave into an electric signal and an electric signal into an ultrasonic wave for transmission. The plurality of converters are juxtaposed. The protection component protects each of the converters.
摘要:
An ultrasonic sensor includes a plurality of converters and a protection component. The plurality of converters convert one of a received ultrasonic wave into an electric signal and an electric signal into an ultrasonic wave for transmission. The plurality of converters are juxtaposed. The protection component protects each of the converters.
摘要:
An ultrasonic sensor includes a plurality of converters and a protection component. The plurality of converters convert one of a received ultrasonic wave into an electric signal and an electric signal into an ultrasonic wave for transmission. The plurality of converters are juxtaposed. The protection component protects each of the converters.
摘要:
An ultrasonic sensor includes a plurality of converters and a protection component. The plurality of converters convert one of a received ultrasonic wave into an electric signal and an electric signal into an ultrasonic wave for transmission. The plurality of converters are juxtaposed. The protection component protects each of the converters.
摘要:
An ultrasonic sensor includes a plurality of converters and a protection component. The plurality of converters convert one of a received ultrasonic wave into an electric signal and an electric signal into an ultrasonic wave for transmission. The plurality of converters are juxtaposed. The protection component protects each of the converters.
摘要:
A method for manufacturing a dynamic quantity detection device includes bonding a semiconductor chip that includes a detection element for detecting a dynamic quantity to a stand using a bonding layer. Initially, a semiconductor chip is formed that includes a detection element used for correlating a dynamic quantity to be detected to an electric quantity and a processing circuit element used for a circuit that processes the electric quantity. Further, a bonding layer is placed on a stand. The semiconductor chip is then placed on the bonding layer and the semiconductor chip is bonded to the stand by sintering the bonding layer at 400° C. or lower in order to suppress a change in a characteristic of the processing circuit element.
摘要:
In a thermo pile infrared ray sensor, an opening portion is formed by etching a substrate from a second surface after an n-type poly-Si layer and a thin aluminium layer are formed so that first and second connection portions are formed by parts thereof. An infrared ray absorbent layer is formed on the substrate to cover the first connection portion with a screen print after the opening portion is formed.