公开(公告)号：US20250006566A1

公开(公告)日：2025-01-02

申请号：US18712774

申请日：2022-11-25

Applicant: HITACHI ASTEMO, LTD.

Inventor： Nobutake TSUYUNO ,  Akira MIMA ,  Yujiro KANEKO ,  Eiichi IDE

IPC: H01L23/051 ,  H01L21/56 ,  H01L23/31 ,  H01L23/473 ,  H01L23/64 ,  H01L25/07 ,  H01L25/18 ,  H02M7/00

Abstract: A semiconductor module includes: a plurality of power semiconductor elements arranged in parallel to each other; a first conductor plate and a second conductor plate respectively bonded to an upper surface and a lower surface of the power semiconductor elements arranged in parallel to each other; a wiring substrate provided on the second conductor plate; and an electronic component mounted on the wiring substrate, the power semiconductor elements, the first conductor plate, the second conductor plate, the wiring substrate, and the electronic component being sealed with a sealing member. The first conductor plate positioned on the upper surface side of the wiring substrate has at least one of a recess and a through hole in a region facing with the electronic component on the wiring substrate.

公开(公告)号：US20240047231A1

公开(公告)日：2024-02-08

申请号：US18266405

申请日：2021-09-29

Applicant: HITACHI ASTEMO, LTD.

Inventor： Yasuhiro TSUYUKI ,  Nobutake TSUYUNO ,  Eiichi IDE ,  Yujiro KANEKO

IPC: H01L21/56 ,  H01L23/473 ,  H01L25/11 ,  H01L25/18 ,  H01L23/31

CPC classification number: H01L21/566 ,  H01L23/473 ,  H01L25/115 ,  H01L25/18 ,  H01L23/3121 ,  H01L24/32

Abstract: An electric circuit body including a power semiconductor element joined to one surface of a conductor plate; a sheet member including an insulating layer joined to the other surface of the conductor plate; a sealing member that integrally seals the sheet member, the conductor plate, and the power semiconductor element in a state where a surface of the sheet member opposite to a surface joined to the conductor plate is exposed; a cooling member that cools heat of the power semiconductor element; and a heat conduction member provided between the opposite surface of the sheet member and the cooling member, where the heat conduction member is provided over a first projection region facing the conductor plate and a second projection region facing the sealing member, and a thickness of the heat conduction member is thicker in the second projection region than in the first projection region.

公开(公告)号：US20230023345A1

公开(公告)日：2023-01-26

申请号：US17785297

申请日：2020-11-27

Applicant: HITACHI ASTEMO, LTD.

Inventor： Nobutake TSUYUNO ,  Akira MATSUSHITA ,  Toru KATO

IPC: H05K7/20 ,  H05K5/03 ,  H02M7/00

Abstract: The resin material 336 is arranged in a first region 421 surrounded by the fin base 440, the inclined portion 343 of the cover member 340, and the outermost peripheral heat dissipation fins 334 arranged on the outermost peripheral side. Then, the resin material 336 is caused to protrude to the first region 421. That is, the resin material 336 is arranged in the first region 421. In a cross section perpendicular to the refrigerant flow direction (Y direction), a cross-sectional area of the first region 421 is larger than an average cross-sectional area 423 of the adjacent heat dissipation fins 331. Then, a cross-sectional area of a second region 422 formed between the resin material 336 arranged in the first region 421 and the outermost peripheral heat dissipation fin 334 arranged on the outermost peripheral side is smaller than the average cross-sectional area 423 of the heat dissipation fins.

公开(公告)号：US20220336324A1

公开(公告)日：2022-10-20

申请号：US17760722

申请日：2020-08-14

Applicant: HITACHI ASTEMO, LTD.

Inventor： Nobutake TSUYUNO ,  Yujiro KANEKO ,  Akira MATSUSHITA ,  Masahito MOCHIZUKI ,  Eiichi IDE ,  Junpei KUSUKAWA

IPC: H01L23/473 ,  H02M7/00 ,  H02M7/5387 ,  H05K7/20 ,  H01L25/07 ,  H01L21/48

Abstract: A sheet-shaped member 440 including a resin insulating layer 441 and a metal foil 442 is used. The sheet-shaped member 440 is deformed following warpage or step difference in a second conductor plate 431 and a fourth conductor plate 433, and therefore, the thickness of the resin insulating layer 441 can be set to a constant thickness of, for example, 120 μm capable of securing insulation properties. By plastically deforming a metal-based heat conduction member 450 having a thickness of, for example, 120 μm interposed between the sheet-shaped member 440 and a cooling member 340, the thickness of the metal-based heat conduction member 450 is changed to absorb the warpage or step difference generated in the second conductor plate 431 and the fourth conductor plate 433. This results in remarkable improvement in heat dissipation as compared with a case where the conductor plates are brought into contact with the cooling member 340 via an insulating layer alone.

公开(公告)号：US20250105110A1

公开(公告)日：2025-03-27

申请号：US18726097

申请日：2022-12-28

Applicant: HITACHI ASTEMO, LTD.

Inventor： Nobutake TSUYUNO ,  Yujiro KANEKO ,  Yusuke TAKAGI

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L25/07

Abstract: A semiconductor device has a conductor plate to which a plurality of semiconductor elements are joined; an insulation sheet which is bonded to the opposite face of the conductor plate from the side facing the semiconductor elements; and a resin member which seals the semiconductor elements, the insulation sheet and the conductor plate. The conductor plate includes element joining regions to which the semiconductor elements are respectively joined, and a connection region which is provided between the element joining regions. The surface of the element joining regions of the conductor plate on the side facing the insulation sheet protrudes beyond the surface of the connection region on the side facing the insulation sheet and is bonded to the insulation sheet. The resin member is filled between the insulation sheet and the surface of the connection region of the conductor plate on the side facing the insulation sheet.

公开(公告)号：US20240243032A1

公开(公告)日：2024-07-18

申请号：US18561923

申请日：2022-03-04

Applicant: Hitachi Astemo, Ltd.

Inventor： Nobutake TSUYUNO ,  Yujiro KANEKO ,  Yusuke TAKAGI

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/367 ,  H01L25/065

CPC classification number: H01L23/3735 ,  H01L23/3675 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/0665 ,  H01L2924/12 ,  H01L2924/1306 ,  H01L2924/182

Abstract: In an electric circuit body, at least one of the cooling members fixed to both surfaces of a first semiconductor module and a second semiconductor module includes a first heat dissipation region that abuts on the first semiconductor module through a heat conduction member, a second heat dissipation region that abuts on the second semiconductor module through the heat conduction member, and a low rigidity portion formed between the first heat dissipation region and the second heat dissipation region to have lower rigidity the first heat dissipation region and the second heat dissipation region; and the fixing member fixes the cooling member to both surfaces of the first semiconductor module and the second semiconductor module in the low rigidity portion of the cooling member.

公开(公告)号：US20240038611A1

公开(公告)日：2024-02-01

申请号：US18039896

申请日：2021-09-29

Applicant: Hitachi Astemo, Ltd.

Inventor： Ning TANG ,  Nobutake TSUYUNO ,  Yujiro KANEKO ,  Eiichi IDE

IPC: H01L23/31 ,  H01L23/473 ,  H01L25/18 ,  H01L23/00 ,  H01L21/56 ,  H01L25/00

CPC classification number: H01L23/3121 ,  H01L23/473 ,  H01L25/18 ,  H01L24/40 ,  H01L24/37 ,  H01L21/566 ,  H01L25/50 ,  H01L2224/40137 ,  H01L2224/40101 ,  H01L2224/37147 ,  H01L2224/37124 ,  H01L2224/37639 ,  H01L2224/37655 ,  H01L23/49575

Abstract: An electrical circuit body includes a power semiconductor element joined to one face of a conductor plate, a sheet member including an insulating layer joined to the other face of the conductor plate, a sealing member integrally sealing the sheet member, the conductor plate, and the power semiconductor element in a state where a face, of the sheet member, opposite to a face joined to the conductor plate is exposed, and a cooling member bonded to the opposite face of the sheet member via a heat conduction member, wherein the sealing member has a recess along an outer edge of the sheet member on a surface where the sheet member is exposed, the recess being located outside the sheet member.

公开(公告)号：US20230119278A1

公开(公告)日：2023-04-20

申请号：US17910201

申请日：2020-12-25

Applicant: Hitachi Astemo, Ltd.

Inventor： Nobutake TSUYUNO ,  Yusuke TAKAGI ,  Yujiro KANEKO

IPC: H01L25/18 ,  H02M7/00 ,  H01L25/07 ,  H01L21/56 ,  H01L23/473 ,  H01L23/31 ,  H01L23/495

Abstract: Provided is an electric circuit body including: a power semiconductor element; a first conductor plate configured to be connected to one surface of the power semiconductor element; a first sheet-shaped member having a first resin insulation layer and configured to at least cover a surface of the first conductor plate; a sealing material configured to seal each of the power semiconductor element, the first conductor plate, and an end of the first sheet-shaped member; and a first cooling member configured to be adhesively attached to the first sheet-shaped member. In the electric circuit body, the first sheet-shaped member includes : an embedded portion where the end of the first sheet-shaped member is covered with the sealing material; a heat dissipation surface as a region to overlap the surface of the first conductor plate; and a margin as a region between the embedded portion and the heat dissipation surface, the margin is located more inward than the heat dissipation surface, and the embedded portion is located more inward than the margin.

公开(公告)号：US20210391236A1

公开(公告)日：2021-12-16

申请号：US17295713

申请日：2019-11-08

Applicant: HITACHI ASTEMO, LTD.

Inventor： Nobutake TSUYUNO ,  Akira MATSUSHITA ,  Yujiro KANEKO

IPC: H01L23/367 ,  H01L23/373 ,  H01L21/48 ,  H05K7/20

Abstract: A semiconductor module 900 includes a semiconductor device 300 that includes first and second fin bases 800 having first and second connecting portions 810 and a resin 850 for sealing the outer peripheral side surfaces of first to fourth conductors 410 to 413, and a flow path forming body 600 connected to the first and second connecting portions 810 of the first and second fin bases 800. A first elastically deformed portion 801, which is elastically deformed, is provided such that a distance in a thickness direction between the outer peripheral ends 810a of the first and second connecting portions 810 becomes smaller than a distance in a thickness direction between intermediate portions 804 of the first and second connecting portions 810. The resin 850 is filled between the first and second connecting portions 810 of the first and second fin bases 800 are filled with the resin 850 therebetween.