专利检索 cpc:"H01L2224/37639" 第 1 页

1.

发明授权
Semiconductor package with conductive clip 有权

公开(公告)号：US09799623B2

公开(公告)日：2017-10-24

申请号：US15190466

申请日：2016-06-23

申请人： Infineon Technologies Americas Corp.

发明人： Martin Standing

IPC分类号： H01L23/12 , H01L23/00 , H01L23/13 , H01L23/492 , H01L23/498 , H01L25/16 , H01L23/04 , H01L23/06 , H01L23/14 , H01L23/495

CPC分类号： H01L24/40 , H01L23/04 , H01L23/06 , H01L23/13 , H01L23/14 , H01L23/492 , H01L23/4924 , H01L23/49548 , H01L23/49558 , H01L23/49582 , H01L23/4985 , H01L24/24 , H01L24/34 , H01L24/36 , H01L24/37 , H01L24/82 , H01L24/83 , H01L24/84 , H01L25/165 , H01L2224/24227 , H01L2224/32245 , H01L2224/37012 , H01L2224/37147 , H01L2224/37639 , H01L2224/37644 , H01L2224/40225 , H01L2224/73153 , H01L2224/73253 , H01L2224/76155 , H01L2224/82102 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/05432 , H01L2924/0635 , H01L2924/0665 , H01L2924/07025 , H01L2924/0715 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49155 , Y10T29/49174 , H01L2924/00 , H01L2924/00014

摘要： A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.

2.

发明授权
Semiconductor device and structure therefor 有权
标题翻译：半导体器件及其结构

公开(公告)号：US09460995B2

公开(公告)日：2016-10-04

申请号：US14939873

申请日：2015-11-12

申请人： Semiconductor Components Industries, LLC

发明人： Ali Salih , Chun-Li Liu , Gordon M. Grivna

IPC分类号： H01L29/49 , H01L23/522 , H01L29/66 , H01L29/778 , H01L21/768 , H01L23/498 , H01L21/78 , H01L23/482 , H01L23/532 , H01L29/20 , H01L21/683 , H01L23/00

CPC分类号： H01L23/5226 , H01L21/6836 , H01L21/76898 , H01L21/78 , H01L23/4824 , H01L23/49827 , H01L23/53228 , H01L23/53242 , H01L23/5329 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/84 , H01L29/2003 , H01L29/66462 , H01L29/778 , H01L29/7787 , H01L2221/68327 , H01L2224/0345 , H01L2224/0346 , H01L2224/0347 , H01L2224/04034 , H01L2224/05111 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05639 , H01L2224/05647 , H01L2224/06181 , H01L2224/37012 , H01L2224/37013 , H01L2224/37124 , H01L2224/37147 , H01L2224/3716 , H01L2224/37187 , H01L2224/3719 , H01L2224/37639 , H01L2224/37644 , H01L2224/37647 , H01L2224/37655 , H01L2224/37664 , H01L2224/40499 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2224/84815 , H01L2224/8485 , H01L2924/00014 , H01L2924/12032 , H01L2924/12042 , H01L2924/1305 , H01L2924/13063 , H01L2924/13064 , H01L2924/13091 , H01L2924/00 , H01L2924/01028 , H01L2924/014 , H01L2924/0105 , H01L2924/01047 , H01L2924/01082 , H01L2924/00012 , H01L2924/01029 , H01L2924/07811 , H01L2224/45099

摘要： In one embodiment, a method of forming a HEMT device may include plating a conductor or a plurality of conductors onto an insulator that overlies a plurality of current carrying electrodes of the HEMT device. The method may also include attaching a connector onto the conductor or attaching a plurality of connectors onto the plurality of conductors.

摘要翻译： 在一个实施例中，形成HEMT器件的方法可以包括将导体或多个导体电镀到覆盖在HEMT器件的多个载流电极上的绝缘体上。该方法还可以包括将连接器附接到导体上或者将多个连接器附接到多个导体上。

3.

发明授权
Conductor strip with contact areas having cutouts 有权
标题翻译：具有接触区域的导线条具有切口

公开(公告)号：US09406592B2

公开(公告)日：2016-08-02

申请号：US14735300

申请日：2015-06-10

申请人： Continental Automotive GmbH

发明人： Nico Kohl , Martin Metzler , Sven Egelkraut , Markus Leicht

IPC分类号： H01L23/495 , H01L23/00 , H01L23/498

CPC分类号： H01L23/49544 , H01L23/3735 , H01L23/495 , H01L23/49548 , H01L23/49838 , H01L23/49844 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L2224/29339 , H01L2224/32227 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/37011 , H01L2224/37013 , H01L2224/37147 , H01L2224/3756 , H01L2224/37639 , H01L2224/4001 , H01L2224/4007 , H01L2224/40095 , H01L2224/40106 , H01L2224/40221 , H01L2224/40225 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/73263 , H01L2224/83191 , H01L2224/83192 , H01L2224/83201 , H01L2224/83203 , H01L2224/83205 , H01L2224/83385 , H01L2224/83801 , H01L2224/83825 , H01L2224/8384 , H01L2224/8385 , H01L2224/84201 , H01L2224/84203 , H01L2224/84205 , H01L2224/84385 , H01L2224/84801 , H01L2224/84825 , H01L2224/8484 , H01L2224/8485 , H01L2224/92142 , H01L2224/92246 , H01L2924/00015 , H01L2924/13055 , H01L2924/13091 , H01L2924/351 , H01L2924/00 , H01L2224/48 , H01L2924/00014 , H01L2924/0105 , H01L2924/01047 , H01L2924/00012

摘要： A power semiconductor circuit includes at least one semiconductor having at least one contact area, and at least one bonding conductor strip having at least one contact region fastened on at least one of the contact areas. The contact region of the bonding conductor strip includes cutouts.

摘要翻译： 功率半导体电路包括至少一个具有至少一个接触区域的半导体，以及至少一个接合导体条，其具有紧固在至少一个接触区域上的至少一个接触区域。接合导体条的接触区域包括切口。

4.

发明授权
Module including a discrete device mounted on a DCB substrate 有权
标题翻译：模块包括安装在DCB基板上的分立器件

公开(公告)号：US09147637B2

公开(公告)日：2015-09-29

申请号：US13336248

申请日：2011-12-23

申请人： Ralf Otremba , Roland Rupp , Daniel Domes

发明人： Ralf Otremba , Roland Rupp , Daniel Domes

IPC分类号： H01L23/02 , H01L23/48 , H01L23/24 , H01L23/373 , H01L23/495 , H01L23/498 , H01L23/00 , H01L23/31

CPC分类号： H01L23/48 , H01L23/24 , H01L23/3107 , H01L23/3135 , H01L23/3735 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L23/49811 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/0603 , H01L2224/06181 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/37124 , H01L2224/37147 , H01L2224/37155 , H01L2224/3716 , H01L2224/37639 , H01L2224/37647 , H01L2224/37655 , H01L2224/3766 , H01L2224/4005 , H01L2224/40095 , H01L2224/40137 , H01L2224/40227 , H01L2224/40247 , H01L2224/4103 , H01L2224/41051 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48464 , H01L2224/4847 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48766 , H01L2224/48769 , H01L2224/48771 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8381 , H01L2224/8382 , H01L2224/8385 , H01L2224/83851 , H01L2224/84801 , H01L2224/8482 , H01L2224/8485 , H01L2224/85447 , H01L2224/92247 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/141 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2924/15787 , H01L2924/181 , H01L2924/19105 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2924/01028 , H01L2924/01015 , H01L2924/20759

摘要： A module includes a DCB substrate and a discrete device mounted on the DCB substrate, wherein the discrete device comprises a leadframe, a semiconductor chip mounted on the leadframe and an encapsulation material covering the semiconductor chip.

摘要翻译： 模块包括DCB衬底和安装在DCB衬底上的分立器件，其中分立器件包括引线框，安装在引线框上的半导体芯片和覆盖半导体芯片的封装材料。

5.

发明申请
CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE 有权
标题翻译：连接器总成及其制造方法

公开(公告)号：US20120064781A1

公开(公告)日：2012-03-15

申请号：US12948977

申请日：2010-11-18

申请人： Shutesh Krishnan , Soon Wei Wang

发明人： Shutesh Krishnan , Soon Wei Wang

IPC分类号： H01R13/40 , H01R43/00

CPC分类号： H05K7/00 , H01L23/3121 , H01L23/3677 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/074 , H01L2224/05554 , H01L2224/291 , H01L2224/32225 , H01L2224/32235 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/37124 , H01L2224/37147 , H01L2224/37611 , H01L2224/37624 , H01L2224/37639 , H01L2224/37644 , H01L2224/37647 , H01L2224/4007 , H01L2224/40095 , H01L2224/40106 , H01L2224/40225 , H01L2224/40227 , H01L2224/4103 , H01L2224/41052 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/83851 , H01L2224/85423 , H01L2224/85447 , H01L2924/00014 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , Y10T29/49117 , Y10T29/4913 , H01L2924/00012 , H01L2924/00 , H01L2224/84

摘要： A connector assembly and a method for manufacturing the connector assembly. In accordance with embodiments, the connector assembly includes an electrical connector having first and second surfaces and first and second ends. A layer of electrically insulating material is formed from or on a portion of the first surface at the first end. Optionally, a layer of electrically insulating material can be formed from or on the second surface.

摘要翻译： 连接器组件和用于制造连接器组件的方法。根据实施例，连接器组件包括具有第一和第二表面以及第一和第二端的电连接器。电绝缘材料层由第一端部的第一表面的一部分上形成，或者在第一端的一部分上形成。任选地，电绝缘材料层可以从第二表面上或在第二表面上形成。

6.

发明申请
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE 有权
标题翻译：半导体元件及其制造方法

公开(公告)号：US20120063107A1

公开(公告)日：2012-03-15

申请号：US12948970

申请日：2010-11-18

申请人： Shutesh Krishnan , Soon Wei Wang

发明人： Shutesh Krishnan , Soon Wei Wang

IPC分类号： H05K7/00 , H05K3/30

CPC分类号： H05K7/00 , H01L23/3121 , H01L23/3677 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/074 , H01L2224/05554 , H01L2224/291 , H01L2224/32225 , H01L2224/32235 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/37124 , H01L2224/37147 , H01L2224/37611 , H01L2224/37624 , H01L2224/37639 , H01L2224/37644 , H01L2224/37647 , H01L2224/4007 , H01L2224/40095 , H01L2224/40106 , H01L2224/40225 , H01L2224/40227 , H01L2224/4103 , H01L2224/41052 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/83851 , H01L2224/85423 , H01L2224/85447 , H01L2924/00014 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , Y10T29/49117 , Y10T29/4913 , H01L2924/00012 , H01L2924/00 , H01L2224/84

摘要： A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component includes stacked semiconductor die. In accordance with embodiments, the semiconductor component includes a substrate having a component receiving area and a plurality of bond pads. A semiconductor chip is attached to the component receiving area. An electrical connector is coupled to the semiconductor chip and the substrate. A second semiconductor chip is mounted or attached to one of the ends of the electrical connector such that this end is positioned between the semiconductor chips. A second electrical connector is coupled between the second semiconductor chip and the substrate. A third semiconductor chip is mounted over or attached to the second electrical connector such that a portion is between the second and third semiconductor chips.

摘要翻译： 半导体部件及半导体部件的制造方法，其特征在于，所述半导体部件具有堆叠的半导体管芯。根据实施例，半导体部件包括具有部件接收区域和多个接合焊盘的基板。半导体芯片附接到部件接收区域。电连接器耦合到半导体芯片和基板。第二个半导体芯片被安装或连接到电连接器的一个端部，使得该端部位于半导体芯片之间。第二电连接器耦合在第二半导体芯片和基板之间。第三半导体芯片安装在第二电连接器上或附着到第二电连接器，使得一部分在第二和第三半导体芯片之间。