Construction of rear holder for connector capable to be drawn out
    1.
    发明授权
    Construction of rear holder for connector capable to be drawn out 失效
    构造可拔出的连接器后支架

    公开(公告)号:US5346414A

    公开(公告)日:1994-09-13

    申请号:US94232

    申请日:1993-07-21

    CPC分类号: H01R13/4367 Y10S439/94

    摘要: A construction of a rear holder for a connector capable to be drawn out that comprises a connector housing, connector terminals and a rear holder accompanied with a means for pulling the rear holder out, the rear holder as a stopper for movement of the terminals being inserted into the housing from a opening behind and engaging with the housing by means of projections on the holder and holes in the upper wall of the housing, is characterised by a channel with a pit at the front bottom forming a supporter step for the means, which the means for pulling the rear holder out is easily inserted into.

    摘要翻译: 一种用于连接器的后支架的结构,其能够被拉出,其包括连接器壳体,连接器端子和后部保持器,其具有用于将后保持器拉出的装置,后保持器作为用于插入的端子的移动的止动件 从壳体中的开口后部通过壳体上的突出部和壳体的上壁中的孔与壳体接合的壳体,其特征在于,在前部底部具有凹坑的通道形成用于该装置的支撑台阶, 用于拉出后支架的装置容易插入。

    MOLDING METHOD OF INJECTION MOLDING MACHINE
    2.
    发明申请
    MOLDING METHOD OF INJECTION MOLDING MACHINE 有权
    注塑成型机的成型方法

    公开(公告)号:US20120146260A1

    公开(公告)日:2012-06-14

    申请号:US13391249

    申请日:2011-06-14

    IPC分类号: B29C45/67

    摘要: In performing molding by injecting and filling a resin by an injecting device with a predetermined injection pressure into a mold formed of a fixed mold and a movable mold clamped by a clamping device with a predetermined clamping force, at least a clamping device which enables natural compression of the resin with solidification of the resin in the mold is used as the clamping device, a molding injection pressure and a molding clamping force with which a predetermined mold gap is generated between the movable mold and the fixed mold in injection and filling and a non-defective product can be molded are acquired and set in advance, the clamping device is clamped with the molding clamping force during production, the molding injection pressure is set as a limit pressure, and after the resin is injected and filled in the mold by driving the injecting device.

    摘要翻译: 在通过具有预定注射压力的注射装置将树脂注入和填充到由固定模具形成的模具和由夹紧装置夹紧的可移动模具中以预定夹紧力进行模制的过程中,至少采用能够进行自然压缩的夹紧装置 使用模具中的树脂固化的树脂作为夹紧装置,注射压力和模制夹紧力,在注射和填充期间在活动模具和固定模具之间产生预定的模具间隙, 可以预先获得并设置有效的产品,并且在生产过程中夹紧装置以成型夹紧力夹持,成型注射压力被设定为极限压力,并且在树脂通过驱动注入并填充在模具中之后 注射装置。

    Test socket adjustable to solid state image pickup devices of different sizes
    4.
    发明授权
    Test socket adjustable to solid state image pickup devices of different sizes 有权
    测试插座可调整到不同尺寸的固态图像拾取装置

    公开(公告)号:US07607931B2

    公开(公告)日:2009-10-27

    申请号:US12204179

    申请日:2008-09-04

    IPC分类号: H01R13/62

    摘要: Provided is a test socket capable of being used more flexibly for solid-state image pickup devices of different shapes and of performing locating of the solid-state image pickup devices more precisely. The test socket houses a device under test (DUT) which is a solid-state image pickup device while a test is being performed. The test socket comprises: first locating means for locating the DUT in an X direction parallel to a ceiling plane of the DUT in a housed state; urging means for urging the first locating means in a Z direction perpendicular to the ceiling plane of the DUT in the housed state; and position setting means for setting an upper limit of movement in the Z direction of the first locating means caused by the urging means to set a position in the Z direction of the first locating means relative to the DUT.

    摘要翻译: 提供了能够更灵活地用于不同形状的固态图像拾取装置并且更精确地执行固态图像拾取装置的定位的测试插座。 测试插座容纳被测器件(DUT),该器件是正在进行测试的固态图像拾取器件。 所述测试插座包括:第一定位装置,用于在被容纳的状态下将所述DUT在与所述DUT的顶板平面平行的X方向上定位; 推压装置,用于在收纳状态下沿垂直于DUT的顶板平面的Z方向推动第一定位装置; 以及位置设定装置,用于设定由所述推动装置引起的所述第一定位装置的Z方向上的移动上限,以设定相对于所述DUT的所述第一定位装置的Z方向的位置。

    Monolithically bonded construct of rare-earth magnet and metal material and method for bonding same
    5.
    发明授权
    Monolithically bonded construct of rare-earth magnet and metal material and method for bonding same 有权
    稀土磁体和金属材料的单片结合构造及其结合方法

    公开(公告)号:US06331214B1

    公开(公告)日:2001-12-18

    申请号:US09155094

    申请日:1998-09-21

    IPC分类号: H01F1053

    摘要: Its basic means is a monolithically bonded construct prepared by monolithically bonding together a rare-earth magnet 2 and a an alloy material that is a high melting point metal or a high specific-tenacity material through the solid phase diffusion bonding by the hot isostatic pressing treatment, and a monolithically bonded construct with an interposal of a thin layer of the high melting point metal between a rare-earth magnet 2 and an alloy material 3, 4 that is a high specific-tenacity material. As a method for the bonding, there is used a hot isostatic pressing treatment method in which a rare-earth An magnet and a high melting-point metal are laminated together, thereby to prepare an object to be treated, then the object is put into a hermetic-type high pressure container having an inner wall portion equipped with a heater, then the object is uniformly pressurized in all directions by a synergistic effect caused by pressure and temperature, while the object is maintained for a certain period of time under a certain pressure and temperature condition in an atmosphere of an inert gas, thereby to monolithically bond the object. With this, it is possible to obtain a bonded construct in which a magnet can monolithically be bonded with another metal member with a high strength, without deteriorating magnetic characteristics, such that the rare-earth magnet's insufficiency in brittleness, rigidity, tenacity and the like is compensated.

    摘要翻译: 其基本手段是通过通过热等静压处理的固相扩散接合将稀土类磁体2与作为高熔点金属或高比强度材料的合金材料进行单片接合而制成的单片结合体 ,以及在稀土类磁体2和作为高强度材料的合金材料3,4之间具有高熔点金属薄层的介质的单片结合体。 作为接合的方法,使用将稀土类磁体和高熔点金属层叠在一起的热等静压处理方法,由此制作被处理物,然后将物体放入 具有装配有加热器的内壁部的封闭式高压容器,然后通过由压力和温度引起的协同效应使物体在所有方向上均匀地加压,同时在一定时间内将物体保持一定时间 在惰性气体的气氛中的压力和温度条件,从而将物体整体结合。 由此,可以获得其中磁体可以与另一个具有高强度的金属部件一体地结合而不会恶化磁特性的接合构造,使得稀土类磁体的脆性,刚性,强度等不足 被补偿。

    Molding method of injection molding machine
    6.
    发明授权
    Molding method of injection molding machine 有权
    注塑机成型方法

    公开(公告)号:US09296144B2

    公开(公告)日:2016-03-29

    申请号:US13391249

    申请日:2011-06-14

    摘要: In performing molding by injecting and filling a resin by an injecting device with a predetermined injection pressure into a mold formed of a fixed mold and a movable mold clamped by a clamping device with a predetermined clamping force, at least a clamping device which enables natural compression of the resin with solidification of the resin in the mold is used as the clamping device, a molding injection pressure and a molding clamping force with which a predetermined mold gap is generated between the movable mold and the fixed mold in injection and filling and a non-defective product can be molded are acquired and set in advance, the clamping device is clamped with the molding clamping force during production, the molding injection pressure is set as a limit pressure, and after the resin is injected and filled in the mold by driving the injecting device.

    摘要翻译: 在通过具有预定注射压力的注射装置将树脂注入和填充到由固定模具形成的模具和由夹紧装置夹紧的可移动模具中以预定夹紧力进行模制的过程中,至少采用能够进行自然压缩的夹紧装置 使用模具中的树脂固化的树脂作为夹紧装置,注射压力和模制夹紧力,在注射和填充期间在活动模具和固定模具之间产生预定的模具间隙, 可以预先获得并设置有效的产品,并且在生产过程中夹紧装置以成型夹紧力夹持,成型注射压力被设定为极限压力,并且在通过驱动将树脂注入并填充在模具中之后 注射装置。

    Self test circuit for a semiconductor intergrated circuit
    7.
    发明授权
    Self test circuit for a semiconductor intergrated circuit 有权
    半导体集成电路自检电路

    公开(公告)号:US07730374B2

    公开(公告)日:2010-06-01

    申请号:US11555524

    申请日:2006-11-01

    IPC分类号: G01R31/28

    CPC分类号: G01R31/31725 G01R31/3187

    摘要: A semiconductor integrated circuit that self-tests the skew margin of the clock and data signals in an LVDS. A clock signal CKB1 is held in flip-flop circuit 105 synchronously with checking clock signal A1. Checking pattern signal PAT_A is held in flip-flop circuit 104 synchronously with checking clock signal A2. When the skew margin of clock signal CKA_IN and data signal DA_IN are checked, the checking signal TCKA of flip-flop circuit 105 is input instead of clock signal CKA_IN, and the checking signal TDA of flip-flop circuit 104 is input instead of clock signal DA_IN. The timing relationship between clock signal CKB7 and checking timing signal A1 and the timing relationship between clock signal CKB7 and checking timing signal A2 are controlled independently by timing control circuit 109.

    摘要翻译: 一种半导体集成电路,可以自我测试LVDS中时钟和数据信号的偏移余量。 时钟信号CKB1与检查时钟信号A1同步地保持在触发器电路105中。 检查模式信号PAT_A与检查时钟信号A2同步地保持在触发器电路104中。 当检查时钟信号CKA_IN和数据信号DA_IN的偏斜边缘时,输入触发器电路105的检查信号TCKA而不是时钟信号CKA_IN,并且输入触发器电路104的检查信号TDA而不是时钟信号 DA_IN。 定时控制电路109独立地控制时钟信号CKB7与检查定时信号A1之间的时序关系以及时钟信号CKB7与检查定时信号A2之间的定时关系。

    TEST SOCKET
    10.
    发明申请
    TEST SOCKET 有权
    测试插座

    公开(公告)号:US20090075514A1

    公开(公告)日:2009-03-19

    申请号:US12204179

    申请日:2008-09-04

    IPC分类号: H01R13/64

    摘要: Provided is a test socket capable of being used more flexibly for solid-state image pickup devices of different shapes and of performing locating of the solid-state image pickup devices more precisely. The test socket houses a tested device which is a solid-state image pickup device while a test is being performed. The test socket comprises: first locating means for locating the tested device in an X direction parallel to a ceiling plane of the tested device in a housed state; urging means for urging the first locating means in a Z direction perpendicular to the ceiling plane of the tested device in the housed state; and position setting means for setting an upper limit of movement in the Z direction of the first locating means caused by the urging means to set a position in the Z direction of the first locating means relative to the tested device.

    摘要翻译: 提供了能够更灵活地用于不同形状的固态图像拾取装置并且更精确地执行固态图像拾取装置的定位的测试插座。 测试插座容纳被测试的设备,该测试设备是正在执行测试的固态图像拾取设备。 测试插座包括:第一定位装置,用于在被容纳的状态下将测试装置定位在平行于被测试装置的顶板平面的X方向上; 推压装置,用于在收纳状态下沿垂直于被测试装置的天花板平面的Z方向推压第一定位装置; 以及位置设定装置,用于设定由所述推动装置引起的所述第一定位装置的Z方向的移动上限,以相对于所述被测试装置来设定所述第一定位装置的Z方向的位置。