公开(公告)号：US20060289980A1

公开(公告)日：2006-12-28

申请号：US11165114

申请日：2005-06-22

申请人： Hong Chang ,  Dennis Pai ,  Frank Lung ,  Jay Lin ,  Wilson Huang ,  Men Lung

发明人： Hong Chang ,  Dennis Pai ,  Frank Lung ,  Jay Lin ,  Wilson Huang ,  Men Lung

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L24/83 ,  H01L23/3121 ,  H01L23/5388 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A structure of stacked memory card, the structure includes a substrate, a lower chip, wires, adhered element, upper chip, and compound resin. The substrate has an upper surface formed with a plurality of first electrodes, and a lower surface. The B-stage glue is coated on the upper surface of the substrate. The lower chip is arranged on the upper surface of the substrate, and is located on the B-stage glue. The plurality of wires are electrically connected the lower chip to the first electrode of the substrate. The adhesive element includes adhesive agent and filling elements is coated on the lower chip. The upper chip is adhered on the lower chip by adhesive element, and is spaced with the lower chip through the filling element, then is electrically connected to the first electrode of the substrate by wires. The compound resin is encapsulated on the upper chip, lower chip, and wires.

摘要翻译： 堆叠式存储卡的结构，该结构包括基板，下部芯片，电线，粘合元件，上部芯片和复合树脂。 基板具有形成有多个第一电极和下表面的上表面。 B层胶被涂覆在基材的上表面上。 下芯片布置在基板的上表面上，位于B级胶上。 多个导线将下芯片电连接到基板的第一电极。 粘合剂元件包括粘合剂，并且填充元件涂覆在下部芯片上。 上芯片通过粘合元件粘附在下芯片上，并通过填充元件与下芯片间隔开，然后通过电线电连接到基板的第一电极。 复合树脂封装在上芯片，下芯片和电线上。

公开(公告)号：US20070029655A1

公开(公告)日：2007-02-08

申请号：US11195218

申请日：2005-08-02

申请人： Hong Chang ,  Dennis Pai ,  Frank Lung ,  Jay Lin ,  Men Lung

发明人： Hong Chang ,  Dennis Pai ,  Frank Lung ,  Jay Lin ,  Men Lung

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L23/04 ,  H01L23/49855 ,  H01L24/48 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A jig structure for manufacturing a stacked memory card, wherein the stacked memory card has a substrate forming with a package area and at least a electrical element, the jig structure is formed with a penetrated slot corresponding to the mounted area of the substrate and at least a protection cover corresponding to the electrical element.

摘要翻译： 一种用于制造堆叠式存储卡的夹具结构，其中堆叠式存储卡具有形成有封装区域的基板和至少一个电气元件，该夹具结构形成有对应于基板的安装区域的穿透槽，并且至少 对应于电气元件的保护罩。

公开(公告)号：US20070049000A1

公开(公告)日：2007-03-01

申请号：US11212978

申请日：2005-08-26

申请人： Jay Lin ,  Dennis Pai ,  Frank Lung ,  Hung Chang ,  Men Lung

发明人： Jay Lin ,  Dennis Pai ,  Frank Lung ,  Hung Chang ,  Men Lung

IPC分类号： H01L21/44

CPC分类号： H05K3/3457 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K2201/10734 ,  H05K2203/025 ,  H01L2924/00

摘要： A method for re-forming BGA of a semiconductor package includes the steps of, providing a semiconductor package element formed with balls grid array, at least one of diameter of the ball is larger than the others ; providing a jig formed with penetrated holes corresponding to the each of balls of the semiconductor package element ; providing the jig mounted to the semiconductor package element, each of balls is located within the corresponding to the penetrated holes, the at least one of bigger ball is exposed from the surface of the penetrated holes of the jig; grinding the exposed part of the balls to exact size; and re-working the processes of manufacturing BGA.

摘要翻译： 一种用于重新形成半导体封装的BGA的方法包括以下步骤：提供形成有球栅阵列的半导体封装元件，所述球的直径中的至少一个大于其他直径; 提供形成有与半导体封装元件的每个球相对应的穿透孔的夹具; 提供安装到半导体封装元件的夹具，每个滚珠位于对应于穿透孔内，其中至少一个较大的球从夹具的穿透孔的表面露出; 研磨暴露的部分球的精确尺寸; 并重新制定制造BGA的流程。