公开(公告)号：US20070049000A1

公开(公告)日：2007-03-01

申请号：US11212978

申请日：2005-08-26

申请人： Jay Lin ,  Dennis Pai ,  Frank Lung ,  Hung Chang ,  Men Lung

发明人： Jay Lin ,  Dennis Pai ,  Frank Lung ,  Hung Chang ,  Men Lung

IPC分类号： H01L21/44

CPC分类号： H05K3/3457 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K2201/10734 ,  H05K2203/025 ,  H01L2924/00

摘要： A method for re-forming BGA of a semiconductor package includes the steps of, providing a semiconductor package element formed with balls grid array, at least one of diameter of the ball is larger than the others ; providing a jig formed with penetrated holes corresponding to the each of balls of the semiconductor package element ; providing the jig mounted to the semiconductor package element, each of balls is located within the corresponding to the penetrated holes, the at least one of bigger ball is exposed from the surface of the penetrated holes of the jig; grinding the exposed part of the balls to exact size; and re-working the processes of manufacturing BGA.

摘要翻译： 一种用于重新形成半导体封装的BGA的方法包括以下步骤：提供形成有球栅阵列的半导体封装元件，所述球的直径中的至少一个大于其他直径; 提供形成有与半导体封装元件的每个球相对应的穿透孔的夹具; 提供安装到半导体封装元件的夹具，每个滚珠位于对应于穿透孔内，其中至少一个较大的球从夹具的穿透孔的表面露出; 研磨暴露的部分球的精确尺寸; 并重新制定制造BGA的流程。

公开(公告)号：US20060289980A1

公开(公告)日：2006-12-28

申请号：US11165114

申请日：2005-06-22

申请人： Hong Chang ,  Dennis Pai ,  Frank Lung ,  Jay Lin ,  Wilson Huang ,  Men Lung

发明人： Hong Chang ,  Dennis Pai ,  Frank Lung ,  Jay Lin ,  Wilson Huang ,  Men Lung

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L24/83 ,  H01L23/3121 ,  H01L23/5388 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A structure of stacked memory card, the structure includes a substrate, a lower chip, wires, adhered element, upper chip, and compound resin. The substrate has an upper surface formed with a plurality of first electrodes, and a lower surface. The B-stage glue is coated on the upper surface of the substrate. The lower chip is arranged on the upper surface of the substrate, and is located on the B-stage glue. The plurality of wires are electrically connected the lower chip to the first electrode of the substrate. The adhesive element includes adhesive agent and filling elements is coated on the lower chip. The upper chip is adhered on the lower chip by adhesive element, and is spaced with the lower chip through the filling element, then is electrically connected to the first electrode of the substrate by wires. The compound resin is encapsulated on the upper chip, lower chip, and wires.

摘要翻译： 堆叠式存储卡的结构，该结构包括基板，下部芯片，电线，粘合元件，上部芯片和复合树脂。 基板具有形成有多个第一电极和下表面的上表面。 B层胶被涂覆在基材的上表面上。 下芯片布置在基板的上表面上，位于B级胶上。 多个导线将下芯片电连接到基板的第一电极。 粘合剂元件包括粘合剂，并且填充元件涂覆在下部芯片上。 上芯片通过粘合元件粘附在下芯片上，并通过填充元件与下芯片间隔开，然后通过电线电连接到基板的第一电极。 复合树脂封装在上芯片，下芯片和电线上。

公开(公告)号：US20070029655A1

公开(公告)日：2007-02-08

申请号：US11195218

申请日：2005-08-02

申请人： Hong Chang ,  Dennis Pai ,  Frank Lung ,  Jay Lin ,  Men Lung

发明人： Hong Chang ,  Dennis Pai ,  Frank Lung ,  Jay Lin ,  Men Lung

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L23/04 ,  H01L23/49855 ,  H01L24/48 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A jig structure for manufacturing a stacked memory card, wherein the stacked memory card has a substrate forming with a package area and at least a electrical element, the jig structure is formed with a penetrated slot corresponding to the mounted area of the substrate and at least a protection cover corresponding to the electrical element.

摘要翻译： 一种用于制造堆叠式存储卡的夹具结构，其中堆叠式存储卡具有形成有封装区域的基板和至少一个电气元件，该夹具结构形成有对应于基板的安装区域的穿透槽，并且至少 对应于电气元件的保护罩。

公开(公告)号：US20070246544A1

公开(公告)日：2007-10-25

申请号：US11408481

申请日：2006-04-20

申请人： Sheila Yang ,  Hong Chang ,  Dennis Pai ,  Frank Lueng ,  Jay Lin ,  Man Lueng ,  Jerry Lin

发明人： Sheila Yang ,  Hong Chang ,  Dennis Pai ,  Frank Lueng ,  Jay Lin ,  Man Lueng ,  Jerry Lin

IPC分类号： G06K19/06

CPC分类号： G06K19/07743 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A method for manufacturing memory card structure comprises the steps of. Providing a carry has an upper surface, which is coated with adhered glue, and a lower surface. Providing a substrate has a first surface, which is formed with first electrodes, and a lower surface, a golden finger is formed on the substrate, and is electrically connected to the first electrodes. Providing a passive component is mounted on the first surface of the substrate. Separating the substrate and the carry. Providing a chip is mounted on the first surface of the substrate. Providing a plurality of wires is electrically connected the chip to the first electrodes of the substrate. Providing a compound resin is covered on the chip and wires.

摘要翻译： 一种用于制造存储卡结构的方法包括以下步骤： 提供携带物具有涂有粘合胶的上表面和下表面。 提供基板具有形成有第一电极的第一表面和下表面，在基板上形成金指，并且电连接到第一电极。 提供无源部件安装在基板的第一表面上。 分离底物和进位。 提供芯片安装在基板的第一表面上。 提供多条导线将芯片电连接到基板的第一电极。 在芯片和电线上覆盖复合树脂。

公开(公告)号：US20070216037A1

公开(公告)日：2007-09-20

申请号：US11378793

申请日：2006-03-16

申请人： Dennis Pai ,  Hong Chang ,  Potter Chien ,  Jay Lin ,  Roy Lin

发明人： Dennis Pai ,  Hong Chang ,  Potter Chien ,  Jay Lin ,  Roy Lin

IPC分类号： H01L23/48

CPC分类号： H01L24/32 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/83856 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A memory card structure includes a substrate, B-Stage glue, an adhered layer, a chip, wires, and a compound layer. The substrate has an upper surface, which is formed with first electrodes and golden fingers electrically connected to the first electrodes. The B-Stage glue is coated on the periphery of upper surface of the substrate. The adhered layer is coated on the upper surface of the substrate. The chip is formed with bonding pads, and is adhered on the upper surface of the substrate by the B-Stage glue and the adhered layer. The plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. And the compound layer is encapsulated on the chip and the wires.

摘要翻译： 存储卡结构包括基板，B阶胶，附着层，芯片，电线和复合层。 基板具有上表面，其形成有电连接到第一电极的第一电极和金指。 B层胶被涂覆在基材的上表面的周边。 粘附层涂覆在基材的上表面上。 该芯片由接合焊盘形成，并且通过B阶胶和附着层粘合在基板的上表面上。 多个导线将芯片的焊盘电连接到基板的第一电极。 复合层被封装在芯片和导线上。

公开(公告)号：US20050198847A1

公开(公告)日：2005-09-15

申请号：US10800555

申请日：2004-03-15

申请人： Te-Hsiang Liu ,  Yu-Wen Fang ,  Jay Lin ,  Ming-Shuo Yen

发明人： Te-Hsiang Liu ,  Yu-Wen Fang ,  Jay Lin ,  Ming-Shuo Yen

IPC分类号： G01B5/25 ,  H01L21/66

CPC分类号： G01B5/14 ,  G01B5/0004 ,  G01B5/25 ,  H01L21/67259

摘要： A parallel ruler comprises a frame, and a plurality of gauges disposed in a flat portion of the frame. The gauges have compressible parts protruding downward beyond a lower surface of the frame for measuring a distance to a plane.

摘要翻译： 平行尺包括框架和设置在框架的平坦部分中的多个量规。 量规具有向下突出超过框架的下表面的可压缩部分，用于测量与平面的距离。

公开(公告)号：US5396474A

公开(公告)日：1995-03-07

申请号：US54593

申请日：1993-04-29

申请人： Jay Lin

发明人： Jay Lin

IPC分类号： G04B19/12 ,  G04B45/00 ,  G04B47/04 ,  G04B37/00

CPC分类号： G04B47/046 ,  G04B19/12 ,  G04B45/0084

摘要： A clock includes an inner frame, an outer frame, a sheet material clamped between the inner frame and the outer frame, and a clock mechanism fixed to the sheet material. The clock mechanism includes a shaft extended through the sheet material and two or more pointers secured to the shaft. Various kinds of patterns can be formed on the sheet material.

摘要翻译： 时钟包括内框架，外框架，夹在内框架和外框架之间的片材，以及固定到片材的时钟机构。 时钟机构包括延伸穿过片材的轴和固定到轴的两个或更多个指针。 可以在片材上形成各种图案。