摘要:
A transparent four rank memory module has a front side and a back side. The front side has a third memory rank stacked on a first memory rank. The back side has a fourth memory rank stacked on a second memory rank. An emulator coupled to the memory module activates and controls one individual memory rank from either the first memory rank, the second memory rank, the third memory rank, or the fourth memory rank based on the signals received from a memory controller.
摘要:
A transparent four rank memory module has a front side and a back side. The front side has a third memory rank stacked on a first memory rank. The back side has a fourth memory rank stacked on a second memory rank. An emulator coupled to the memory module activates and controls one individual memory rank from either the first memory rank, the second memory rank, the third memory rank, or the fourth memory rank based on the signals received from a memory controller.
摘要:
A transparent four rank memory module has a front side and a back side. The front side has a third memory rank stacked on a first memory rank. The back side has a fourth memory rank stacked on a second memory rank. An emulator coupled to the memory module activates and controls one individual memory rank from either the first memory rank, the second memory rank, the third memory rank, or the fourth memory rank based on the signals received from a memory controller.
摘要:
A transparent four rank memory module has a front side and a back side. The front side has a third memory rank stacked on a first memory rank. The back side has a fourth memory rank stacked on a second memory rank. An emulator coupled to the memory module activates and controls one individual memory rank from either the first memory rank, the second memory rank, the third memory rank, or the fourth memory rank based on the signals received from a memory controller.
摘要:
A dual-channel memory module for use in computing devices is disclosed. The memory module can include a substrate having a base portion, a first connector portion, and a second connector portion spaced apart and electrically insulated from the first connector portion. A first set of memory devices is disposed on the base portion and in electrical communication with the first connector portion, and a second set of memory devices is disposed on the base portion and in electrical communication with the second connector portion. The first and second sets of memory devices are independent of each other.
摘要:
A transparent four rank memory module has a front side and a back side. The front side has a third memory rank stacked on a first memory rank. The back side has a fourth memory rank stacked on a second memory rank. An emulator coupled to the memory module activates and controls one individual memory rank from either the first memory rank, the second memory rank, the third memory rank, or the fourth memory rank based on the signals received from a memory controller.
摘要:
A transparent four rank memory module has a front side and a back side. The front side has a third memory rank stacked on a first memory rank. The back side has a fourth memory rank stacked on a second memory rank. An emulator coupled to the memory module activates and controls one individual memory rank from either the first memory rank, the second memory rank, the third memory rank, or the fourth memory rank based on the signals received from a memory controller.
摘要:
A circuit for converting signals between a memory interface and a memory array is disclosed. The memory interface is not the same type as the memory array such that the signals between the interface and the array need to be synchronized and translated. The circuit includes an interface converter for shifting the logic levels of the signals between the memory interface and the memory array. Furthermore, the circuit has a translation block for translating and synchronizing the signals. In this respect signals between the memory array and the memory interface are synchronized and translated such that the memory array can be used with a memory interface of a different type.
摘要:
A method and system for testing memory modules is disclosed. The system includes a memory module and a connector configured to receive the module. The memory module is configured to operate in two modes: In the first operation mode the module uses a frequency between a low frequency and a high frequency. In the second operation mode, the module uses a frequency lower than the lower frequency. A control circuit is coupled to the connector. The control circuit is configured to apply a control signal to the circuit module when the circuit module is received in the connector. When the circuit module is received in the connector, the control signal is applied. This applied control signal causes the module to operate in the second operation mode.
摘要:
A memory module having error detection and correction mechanisms is disclosed. The memory module includes a plurality of memory devices arranged in an array and a buffer device connected to the memory devices. The buffer device includes a register module for synchronizing and buffering a plurality of input signals to the memory devices, an error detection module for detecting errors of the input signals, and a transmission memory for storing a copy of the input signals and transmitting the stored copy of the input signals as an output signal.