公开(公告)号：US20220227453A1

公开(公告)日：2022-07-21

申请号：US17575229

申请日：2022-01-13

Applicant: Hsuan-Chih LIN ,  Chun-Cheng LEE

Inventor： Hsuan-Chih LIN ,  Chun-Cheng LEE

IPC: B62M1/36 ,  B62M11/02

Abstract: The present disclosure related to an effort-saving crank structure (1) of a bicycle (8), which includes: a crank mechanism (10) having a crank (11), a shaft end gear (12) and a treadle end gear (13) disposed on the crank (11); a transmission mechanism (20) disposed in the crank (11) and having a rotation shaft (21) and a first gear (22) and a second gear (23) connected to the rotation shaft (21), the first gear (22) and the shaft end gear (12) are engaged for transmission, and the second gear (23) and the treadle end gear (13) are engaged for transmission; a rotation arm unit (30) having a first rotation arm (31) and a second rotation arm (32), two ends of the second rotation arm (32) are respectively connected to the first rotation arm (31) and the treadle end gear (13).

公开(公告)号：US20170217128A1

公开(公告)日：2017-08-03

申请号：US15416099

申请日：2017-01-26

Applicant: Hsuan-Chih LIN ,  Chun-Cheng LEE

Inventor： Hsuan-Chih LIN ,  Chun-Cheng LEE

IPC: B32B7/08 ,  B32B37/10 ,  B32B3/30 ,  B32B7/04 ,  B32B3/26

CPC classification number: B32B7/08 ,  B32B3/266 ,  B32B3/30 ,  B32B7/05 ,  B32B15/082 ,  B32B15/085 ,  B32B15/09 ,  B32B15/18 ,  B32B15/20 ,  B32B27/08 ,  B32B27/302 ,  B32B27/32 ,  B32B27/365 ,  B32B37/10 ,  B32B38/06 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2307/30 ,  B32B2307/54 ,  B32B2307/558 ,  B32B2307/718

Abstract: A composite hollow board structure and a manufacturing method thereof are provided. The composite hollow board structure includes a first plate having a surface formed of a plurality of first conical rings and a plurality of first attachment rings thereon; and a second plate pressed onto the first plate and having a surface formed a plurality of second conical rings and a plurality of second attachment rings thereon; wherein each first conical ring and each second attachment ring are inserted onto each other, each second conical ring and each first attachment ring are inserted onto each other; a hollow cavity is respectively formed between each first conical ring and each second attachment ring as well as between each second conical ring and each first attachment ring. Accordingly, the known bonding or welding step can be omitted to increase deformation capacity with simplified process and reduced manufacturing time.

公开(公告)号：US20240317356A1

公开(公告)日：2024-09-26

申请号：US18603510

申请日：2024-03-13

Applicant: Hsuan-Chih LIN ,  Kai-Wen LIN

Inventor： Hsuan-Chih LIN ,  Kai-Wen LIN

IPC: B62M3/00 ,  B62M11/02

CPC classification number: B62M3/00 ,  B62M11/02

Abstract: A crank apparatus equipped with a labor-saving mechanism and a bicycle crank assembly are disclosed. The crank apparatus includes a crank mechanism, a transmission mechanism, a supporting module and a rotating arm module. The crank mechanism includes a crank, an axle-end gear and a pedal-end gear. The transmission mechanism includes a rotating axle having a circular groove. The supporting module is adapted to sheathe the rotating axle and includes an outer ring and rollers received inside the circular grooves and clamped between the rotating axle and the outer ring. The rotating arm module includes a first rotating arm and a second rotating arm. One end of the second rotating arm is connected to the first rotating arm, and another end of the second rotating arm is connected to the pedal-end gear. Accordingly, the transmission stability and useful lifetime of the crank apparatus and bicycle crank assembly are increased.

公开(公告)号：US20100315823A1

公开(公告)日：2010-12-16

申请号：US12785782

申请日：2010-05-24

Applicant: Hsuan-Chih LIN ,  Hong-Long Chen

Inventor： Hsuan-Chih LIN ,  Hong-Long Chen

IPC: B60Q1/00

CPC classification number: F21V29/004 ,  F21S45/47 ,  F21S45/48 ,  F21S45/50 ,  F21V19/0035 ,  F21V23/06 ,  F21V29/70 ,  F21Y2115/10 ,  Y10S362/80

Abstract: A light-emitting device pressure ring structure includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a holder member insertable in the mounting base, a light-emitting unit fixedly mounted in the holder member with a bottom heat sink thereof suspending outside the holder member and tubular electrodes thereof connectable to the electrode pins of the circuit board for power input, and a pressure ring cap detachably threaded onto the mounting base to hold down the holder member and to keep the heat sink of the light-emitting unit outside the mounting base for quick dissipation of waste heat from the light-emitting devices of the light-emitting unit.

Abstract translation: 一种发光装置压环结构，包括安装用安装基座，容纳在安装基座中的电路板，具有可连接到外部电源的电极引脚，可插入安装基座的保持器构件，固定安装的发光单元 在保持器构件中，其底部散热器悬挂在保持器构件的外部，并且可连接到用于电力输入的电路板的电极引脚的管状电极，以及可拆卸地旋拧到安装基座上以压住保持构件的压力环帽， 以将发光单元的散热片保持在安装基座外部，以便从发光单元的发光装置快速散发废热。

公开(公告)号：US20100315815A1

公开(公告)日：2010-12-16

申请号：US12785850

申请日：2010-05-24

Applicant: Hsuan-Chih LIN ,  Hong-Long Chen

Inventor： Hsuan-Chih LIN ,  Hong-Long Chen

IPC: F21S4/00

CPC classification number: F21V31/005 ,  F21K9/00 ,  F21S2/005 ,  F21V17/12 ,  F21V29/70 ,  F21V29/713 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: A light-emitting unit adapter module includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a light-emitting unit mountable in the mounting base, and a holding-down device fastenable to the mounting base to hold down the light-emitting unit, keeping the tubular electrodes of the light-emitting unit in positive contact with the electrode pins of the circuit board for power input and the heat sink of the light-emitting unit suspending outside the mounting base for quick dissipation of waste heat during operation of the light-emitting devices of the light-emitting unit.

Abstract translation: 一种发光单元适配器模块，包括用于安装的安装基座，容纳在安装基座中并具有可连接到外部电源的电极引脚的电路板，可安装在安装基座中的发光单元，以及压紧装置 可固定到安装基座上以按压发光单元，使发光单元的管状电极与用于电力输入的电路板的电极引脚正确接触，并将发光单元的散热片悬空 用于在发光单元的发光装置的操作期间快速消散废热的安装基座。

公开(公告)号：US20100311193A1

公开(公告)日：2010-12-09

申请号：US12779589

申请日：2010-05-13

Applicant: Hsuan-Chih LIN

Inventor： Hsuan-Chih LIN

IPC: H01L21/56

CPC classification number: H01L33/54 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

Abstract: A method of fabricating a LED module by: bonding one or multiple LED chips and multiple conducting terminals to a circuit substrate, and then molding a packing cup on the circuit substrate over by over molding for enabling the LED chip(s) and the conducting terminals to be exposed to the outside of the packing cup, and then molding a lens on the packing cup and the LED chip(s) by over-molding. By means of directly molding the lens on the packing cup and the LED chip(s), no any gap is left in the lens, avoiding deflection, total reflection or light attenuation and enhancing luminous brightness and assuring uniform distribution of output light.

Abstract translation: 一种通过以下方式制造LED模块：将一个或多个LED芯片和多个导电端子连接到电路基板上，然后通过过模塑将电路基板上的填料杯模制成可使LED芯片和导电端子 暴露于包装杯的外部，然后通过过度成型将透镜模制在包装杯和LED芯片上。 通过将透镜直接模制在包装杯和LED芯片上，透镜中没有留下任何间隙，避免了偏转，全反射或光衰减，并提高了发光亮度，并保证了输出光的均匀分布。

公开(公告)号：US20100270922A1

公开(公告)日：2010-10-28

申请号：US12761727

申请日：2010-04-16

Applicant: Hsuan-Chih LIN

Inventor： Hsuan-Chih LIN

IPC: H01K1/62 ,  H01J61/52 ,  H01K1/30 ,  F21V29/00

CPC classification number: F21V29/004 ,  F21K9/00 ,  F21V29/77 ,  F21V29/773 ,  F21V29/89 ,  F21V31/005 ,  F21Y2115/10

Abstract: A LED head sink module includes a LED module, which comprises a circuit substrate, a LED chip installed in the circuit substrate, a packing cup molded on the circuit substrate around the LED chip and a lens molded on the packing cup over the LED chip, a heat sink, which has a base and a flat mounting block located on the bottom side of the base for stopping against the circuit substrate of the LED module for absorbing waste heat, a bracket, which has a center opening that receives the circuit substrate of the LED module, first retaining members for fastening to a retaining portion at the periphery of the packing cup and second retaining members for fastening to the flat mounting block of the heat sink, and a water seal sandwiched between the LED module and the bracket to seal off outside moisture and dust.

Abstract translation: LED头模块包括LED模块，其包括电路基板，安装在电路基板中的LED芯片，模制在LED芯片周围的电路基板上的封装杯和模制在LED芯片上的封装杯上的透镜， 散热器，其具有位于基座的底侧上的基部和平坦的安装块，用于阻挡用于吸收废热的LED模块的电路基板，支架具有接收电路基板的中心开口 LED模块，用于紧固到包装杯周边的保持部分的第一保持构件和用于紧固到散热器的平坦安装块的第二保持构件以及夹在LED模块和支架之间的水封以密封 外面的水分和灰尘。