公开(公告)号：US08910644B2

公开(公告)日：2014-12-16

申请号：US13041230

申请日：2011-03-04

申请人： Hua Chung ,  Xizi Dong ,  Kyawwin Jason Maung ,  Hiroji Hanawa ,  Sang Won Kang ,  David H. Quach ,  Donald J. K. Olgado ,  David Bour ,  Wei-Yung Hsu ,  Alexander Tam ,  Anzhong Chang ,  Sumedh Acharya

发明人： Hua Chung ,  Xizi Dong ,  Kyawwin Jason Maung ,  Hiroji Hanawa ,  Sang Won Kang ,  David H. Quach ,  Donald J. K. Olgado ,  David Bour ,  Wei-Yung Hsu ,  Alexander Tam ,  Anzhong Chang ,  Sumedh Acharya

IPC分类号： B08B3/02 ,  B08B5/00 ,  C23C16/44 ,  C23C16/455 ,  H01L21/02 ,  H01L21/67

CPC分类号： B08B5/00 ,  C23C16/4405 ,  C23C16/45506 ,  C23C16/45591 ,  H01L21/02041 ,  H01L21/67115 ,  Y10S438/905

摘要： Embodiments of the invention generally relate to apparatus and methods for cleaning chamber components using a cleaning plate. The cleaning plate is adapted to be positioned on a substrate support during a cleaning process, and includes a plurality of turbulence-inducing structures. The turbulence-inducing structures induce a turbulent flow of cleaning gas while the cleaning plate is rotated during a cleaning process. The cleaning plate increases the retention time of the cleaning gas near the showerhead during cleaning. Additionally, the cleaning plate reduces concentration gradients within the cleaning plate to provide a more effective clean. The method includes positioning a cleaning plate adjacent to a showerhead, and introducing cleaning gas to the space between the showerhead and the cleaning plate. A material deposited on the surface of the showerhead is then heated and vaporized in the presence of the cleaning gas, and then exhausted from the processing chamber.

摘要翻译： 本发明的实施例一般涉及使用清洁板清洁腔室部件的设备和方法。 清洁板适于在清洁过程期间定位在基板支撑件上，并且包括多个湍流诱导结构。 湍流诱导结构在清洁过程中清洁板旋转时引起清洁气体的湍流。 在清洁过程中，清洁板增加了喷头附近清洁气体的停留时间。 此外，清洁板减少清洁板内的浓度梯度以提供更有效的清洁。 该方法包括将清洁板定位在与喷头相邻的位置，并将清洁气体引入到喷头和清洁板之间的空间。 然后将沉积在喷头表面上的材料在清洁气体的存在下加热和蒸发，然后从处理室中排出。

公开(公告)号：USD664170S1

公开(公告)日：2012-07-24

申请号：US29386850

申请日：2011-03-04

申请人： Hua Chung ,  Xizi Dong ,  Kyawwin Jason Maung ,  Hiroji Hanawa ,  Sang Won Kang ,  David H. Quach ,  Donald J. K. Olgado ,  David Bour ,  Wei-Yung Hsu ,  Alexander Tam ,  Anzhong Chang ,  Sumedh Acharya

设计人： Hua Chung ,  Xizi Dong ,  Kyawwin Jason Maung ,  Hiroji Hanawa ,  Sang Won Kang ,  David H. Quach ,  Donald J. K. Olgado ,  David Bour ,  Wei-Yung Hsu ,  Alexander Tam ,  Anzhong Chang ,  Sumedh Acharya

公开(公告)号：US20110308551A1

公开(公告)日：2011-12-22

申请号：US13041230

申请日：2011-03-04

申请人： Hua Chung ,  Xizi Dong ,  Kyawwin Jason Maung ,  Hiroji Hanawa ,  Sang Won Kang ,  David H. Quach ,  Donald J.K. Olgado ,  David Bour ,  Wei-Yung Hsu ,  Alexander Tam ,  Anzhong Chang ,  Sumedh Acharya

发明人： Hua Chung ,  Xizi Dong ,  Kyawwin Jason Maung ,  Hiroji Hanawa ,  Sang Won Kang ,  David H. Quach ,  Donald J.K. Olgado ,  David Bour ,  Wei-Yung Hsu ,  Alexander Tam ,  Anzhong Chang ,  Sumedh Acharya

IPC分类号： B08B9/00 ,  B08B3/04

CPC分类号： B08B5/00 ,  C23C16/4405 ,  C23C16/45506 ,  C23C16/45591 ,  H01L21/02041 ,  H01L21/67115 ,  Y10S438/905

摘要： Embodiments of the invention generally relate to apparatus and methods for cleaning chamber components using a cleaning plate. The cleaning plate is adapted to be positioned on a substrate support during a cleaning process, and includes a plurality of turbulence-inducing structures. The turbulence-inducing structures induce a turbulent flow of cleaning gas while the cleaning plate is rotated during a cleaning process. The cleaning plate increases the retention time of the cleaning gas near the showerhead during cleaning. Additionally, the cleaning plate reduces concentration gradients within the cleaning plate to provide a more effective clean. The method includes positioning a cleaning plate adjacent to a showerhead, and introducing cleaning gas to the space between the showerhead and the cleaning plate. A material deposited on the surface of the showerhead is then heated and vaporized in the presence of the cleaning gas, and then exhausted from the processing chamber.

摘要翻译： 本发明的实施例一般涉及使用清洁板清洁腔室部件的设备和方法。 清洁板适于在清洁过程期间定位在基板支撑件上，并且包括多个湍流诱导结构。 湍流诱导结构在清洁过程中清洁板旋转时引起清洁气体的湍流。 在清洁过程中，清洁板增加了喷头附近清洁气体的停留时间。 此外，清洁板减少清洁板内的浓度梯度以提供更有效的清洁。 该方法包括将清洁板定位在与喷头相邻的位置，并将清洁气体引入到喷头和清洁板之间的空间。 然后将沉积在喷头表面上的材料在清洁气体的存在下加热和蒸发，然后从处理室中排出。

公开(公告)号：US20100273291A1

公开(公告)日：2010-10-28

申请号：US12731030

申请日：2010-03-24

申请人： Olga Kryliouk ,  Jie Su ,  Kevin Griffin ,  Sung Won Jun ,  Sandeep Nijwahan ,  Xizi Dong ,  Tze Poon ,  Lori D. Washington ,  Jacob Grayson

发明人： Olga Kryliouk ,  Jie Su ,  Kevin Griffin ,  Sung Won Jun ,  Sandeep Nijwahan ,  Xizi Dong ,  Tze Poon ,  Lori D. Washington ,  Jacob Grayson

IPC分类号： H01L51/40

CPC分类号： C23C16/303 ,  C23C16/4405 ,  C23C16/45563 ,  C23C16/45574 ,  H01L21/0237 ,  H01L21/0254 ,  H01L21/0262 ,  H01L33/007

摘要： Embodiments of the present invention generally relate to methods and apparatus for removing unwanted deposition build-up from one more interior surfaces of a substrate processing chamber after a substrate is processed in a chamber to form, for example, Group III-V materials by metal-organic chemical vapor deposition (MOCVD) deposition processes and/or hydride vapor phase epitaxial (HVPE) deposition processes. In one embodiment, a method for removing unwanted deposition build-up from one or more interior surfaces of a substrate processing chamber is provided. The method comprises depositing one or more Group III containing layers over a substrate disposed in the substrate processing chamber, transferring the substrate out of the substrate processing chamber, and pulsing a halogen containing gas into the substrate processing chamber to remove at least a portion of the unwanted deposition build-up from one or more interior surfaces of the substrate processing chamber.

摘要翻译： 本发明的实施方案一般涉及用于在衬底在腔室中处理以形成例如III-V族材料之后，从衬底处理室的多个内表面去除不想要的沉积积累的方法和装置， 有机化学气相沉积（MOCVD）沉积工艺和/或氢化物气相外延（HVPE）沉积工艺。 在一个实施例中，提供了从衬底处理室的一个或多个内表面去除不想要的沉积积聚的方法。 该方法包括在设置在衬底处理室中的衬底上沉积一个或多个含III族的层，将衬底转移到衬底处理室之外，并将含卤素的气体脉冲到衬底处理室中以去除至少一部分 从衬底处理室的一个或多个内表面积聚不需要的沉积物。