摘要:
A semiconductor device and methods for forming the same are provided. The semiconductor device includes a first doped region and a second, oppositely doped, region both formed in a substrate, a first gate formed overlying a portion of the first doped region and a portion of the second doped region, two or more second gates formed over the substrate overlying a different portion of the second doped region, one or more third doped regions in the second doped region disposed only between the two or more second gates such that the third doped region and the second doped region having opposite conductivity types, a source region in the first doped region, and a drain region in the second doped region disposed across the second gates from the first gate.
摘要:
A power amplifier with an active bias circuit and operating method thereof are provided. The power amplifier comprises a power amplifier transistor and an active bias circuit. The active circuit receives input power and applies a bias voltage to the gate of the power amplifier transistor. The bias voltage will increase in correspondence with an increase in the input power. Therefore, the power amplifier of this invention has excellent output power, linearity of operation and power-added efficiency in a range of input power.
摘要:
The present invention relates to a semiconductor structure having an integrated passive network and a method for making the same. The semiconductor structure includes a substrate which can be an interposer. The substrate can include a plurality of conductive vias. In various embodiments, the substrate includes a dielectric layer disposed thereon, the dielectric layer having an opening forming a straight hole allowing electrical connection between the passive network and the conductive via. The passive network includes a series of patterned dielectric and conductive layers, forming passive electronic components. In an embodiment, the passive device includes a common resistor coupled to a pair of inductors, each of the inductors coupled to a capacitor. In another embodiment, the passive device includes a resistor and an inductor electrically connected to each other, a bottom surface of the inductor coplanar with a bottom surface of the resistor.
摘要:
The present invention relates to a semiconductor structure having an integrated passive network and a method for making the same. The semiconductor structure includes a substrate which can be an interposer. The substrate can include a plurality of conductive vias. In various embodiments, the substrate includes a dielectric layer disposed thereon, the dielectric layer having an opening forming a straight hole allowing electrical connection between the passive network and the conductive via. The passive network includes a series of patterned dielectric and conductive layers, forming passive electronic components. In an embodiment, the passive device includes a common resistor coupled to a pair of inductors, each of the inductors coupled to a capacitor. In another embodiment, the passive device includes a resistor and an inductor electrically connected to each other, a bottom surface of the inductor coplanar with a bottom surface of the resistor.