摘要:
The present invention provides methods and apparatus for a pre-CMP semiconductor substrate buffing module. The invention includes a polishing pad assembly adapted to be rotated against a major surface of a substrate; a chuck adapted to hold the substrate and to rotate the substrate against the polishing pad assembly as the polishing pad assembly is rotated; and a lateral motion motor adapted to oscillate the polishing pad assembly laterally across the major surface of the substrate while the polishing pad assembly is rotated against the rotating substrate. Numerous additional features are disclosed.
摘要:
In one aspect, a scrubber brush assembly is provided. The scrubber brush assembly includes a scrubber brush including exterior molded surfaces and a mounting passage having interior molded surfaces, the interior molded surfaces having molded foam, raised rotation-restraining features, and a mandrel including recesses directly coupled to the molded foam, raised rotation-restraining features of the scrubber brush to prevent slippage. Scrubber brushes and methods of assembly are provided, as are numerous other aspects.
摘要:
Embodiments of a load cup for transferring a substrate are provided. The load cup includes a pedestal assembly having a substrate support and a de-chucking nozzle. The de-chucking nozzle is positioned to flow a fluid between the polishing head and the back side of a substrate during transfer of the substrate from the polishing head to the substrate support.
摘要:
In one aspect, a scrubber brush assembly is provided. The scrubber brush assembly includes a scrubber brush having a body of open-cell foam including an interior surface, a sleeve received in contact with the scrubber brush, the sleeve including peripherally-spaced, longitudinal walls and reinforcing segments interconnecting adjacent ones of the longitudinal walls and forming elongated pockets along the length, the sleeve having raised ribs extending along the length, and a mandrel having recesses formed on an outer surface, the mandrel being coupled to the sleeve by receiving the raised ribs within the recesses. Scrubber brush subassemblies, high stiffness mandrels, and methods of assembly are provided, as are numerous other aspects.
摘要:
The present invention provides methods and apparatus for a pre-CMP semiconductor substrate buffing module. The invention includes a polishing pad assembly adapted to be rotated against a major surface of a substrate; a chuck adapted to hold the substrate and to rotate the substrate against the polishing pad assembly as the polishing pad assembly is rotated; and a lateral motion motor adapted to oscillate the polishing pad assembly laterally across the major surface of the substrate while the polishing pad assembly is rotated against the rotating substrate. Numerous additional features are disclosed.
摘要:
In one aspect, a scrubber brush assembly is provided. The scrubber brush assembly includes a scrubber brush having a body of open-cell foam including an interior surface, a sleeve received in contact with the scrubber brush, the sleeve including peripherally-spaced, longitudinal walls and reinforcing segments interconnecting adjacent ones of the longitudinal walls and forming elongated pockets along the length, the sleeve having raised ribs extending along the length, and a mandrel having recesses formed on an outer surface, the mandrel being coupled to the sleeve by receiving the raised ribs within the recesses. Scrubber brush subassemblies, high stiffness mandrels, and methods of assembly are provided, as are numerous other aspects.
摘要:
Systems and methods for centralized client application management are provided. In an example embodiment, device data is received from a user device. The user device is identified according to an identification rule. A client state is received from the user device. A match between the client state and a specified state is determined. Based on the client state matching the specified state, an instruction to be performed on the user device is generated. The instruction is caused to be performed on the user device. The instruction causes a change to the client state stored on the user device.