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公开(公告)号:US20100097770A1
公开(公告)日:2010-04-22
申请号:US12406636
申请日:2009-03-18
申请人: Hwa-Sun Park , Yul-Kyo Chung , Jong-Man Kim , One-Cheol Bae
发明人: Hwa-Sun Park , Yul-Kyo Chung , Jong-Man Kim , One-Cheol Bae
CPC分类号: H05K1/185 , H01L21/6835 , H01L23/49827 , H01L23/5389 , H01L23/544 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L25/0657 , H01L2223/54426 , H01L2224/04105 , H01L2224/2402 , H01L2224/24226 , H01L2224/24227 , H01L2225/06524 , H01L2225/06575 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H05K1/0269 , H05K3/305 , H05K3/386 , H05K3/4602 , H05K2201/0195 , H05K2201/09918 , H05K2201/10515 , H05K2203/063 , H05K2203/066 , Y10T156/1052
摘要: Disclosed are a printed circuit board and a manufacturing method thereof. The manufacturing method of a printed circuit board includes: mounting an electronic device on an upper surface of an adhesive layer; laminating an insulator on an upper side of the electronic device and a lower side of the adhesive layer, respectively, such that the electronic device is buried; and forming a circuit pattern and a via on the insulator.
摘要翻译: 公开了一种印刷电路板及其制造方法。 印刷电路板的制造方法包括:将电子器件安装在粘合剂层的上表面上; 分别在电子设备的上侧和粘合剂层的下侧层叠绝缘体,使得电子器件被埋置; 并在绝缘体上形成电路图案和通孔。