摘要:
The present invention relates to a method of preparing a microcapsule with a double-layered structure which comprises the steps of performing an interfacial polymerization of an amine-aldehyde prepolymer on droplets containing an inorganic metal precursor selected from carboxylate and alkoxide compounds, and hydrolyzing the including inorganic precursors for formation of inorganic inner layer. The method of the present invention can prepare a microcapsule with a double-layered structure of an inorganic inner layer and a polymer outer layer, which is effective for eluting and substituting a core material inside the capsule.
摘要:
The present invention relates to a method of preparing a microcapsule with a double-layered structure which comprises the steps of performing an interfacial polymerization of an amine-aldehyde prepolymer on droplets containing an inorganic metal precursor selected from carboxylate and alkoxide compounds, and hydrolyzing the including inorganic precursors for formation of inorganic inner layer. The method of the present invention can prepare a microcapsule with a double-layered structure of an inorganic inner layer and a polymer outer layer, which is effective for eluting and substituting a core material inside the capsule.
摘要:
Disclosed is a method for preparing a poly(ethersulfonimide or ethersulfonamide) copolymer using cyclic oligomers, and more particularly, to a method for preparing a poly(ethersulfonimide or ethersulfonamide) copolymer by preparing a cyclic ether sulfone oligomer and a cyclic imide or amide oligomer and subjecting the cyclic ether sulfone oligomer and the cyclic imide or amide oligomer to ring-opening copolymerization in the presence of an alkali metal fluoride catalyst.
摘要:
Disclosed is a method for preparing a poly(ethersulfonimide or ethersulfonamide) copolymer using cyclic oligomers, and more particularly, to a method for preparing a poly(ethersulfonimide or ethersulfonamide) copolymer by preparing a cyclic ether sulfone oligomer and a cyclic imide or amide oligomer and subjecting the cyclic ether sulfone oligomer and the cyclic imide or amide oligomer to ring-opening copolymerization in the presence of an alkali metal fluoride catalyst.
摘要:
The present invention relates to aromatic polyether resins crosslinked with amic acid or imide side chain, and more particularly, to the aromatic polyether resin crosslinked by amic acid or imide side chain, which is produced by heat curing of amic acid, wherein introduction of imide groups to the basic backbone provides excellent chemical resistance as well as heat resistance and improves surface roughness when coated as a thin film so that it can be suitable for films and flexible display plate substrate.
摘要:
A novel Trichosporonoides madida CJ-NT1 microorganism which is capable of converting fermentable sugars to a high titre of erythritol under low aeration conditions and a method of producing erythritol by fermentation of sugar, which comprises culturing the cells of the Trichosporonoides madida CJ-NT1 strain are provided.
摘要:
A method of surface modifying a polyimide film, a method of manufacturing a flexible copper clad laminate using the same, and a flexible copper clad laminate (FCCL) having a two-layer structure manufactured thereby. The method of surface modifying a polyimide film is conducted by modifying the surface of a polyimide film through a first plasma treatment, dipping the polyimide film into a solution containing an ethyleneimine-based silane coupling agent prepared by mixing the compound of Formula 1 and the compound of Formula 2 at a molar ratio of with 0.25˜1, and then modifying the surface of the polyimide film through a second plasma treatment. The method of surface modifying a polyimide film is advantageous because it may be substituted for a conventional surface treatment processes using ion beams. Also, the FCCL having a two-layer structure, formed by conducting copper sputtering and electroplating on the surface modified polyimide film, has good adhesive strength between the polyimide film and the copper foil and can maintain such adhesive strength even at high temperatures for a long period of time. Further, it may be usefully applied to electronic parts, such as flexible printed circuit boards, TCP (Tape Carrier Package), COF (Chip On Film), etc.
摘要:
The present invention relates to polyamide-imides having head-to-tail backbone and more particularly, to polyamide-imimdes having head-to-tail ragularity to provide excellent heat and chemical resistance, physical and mechanical properties, processability, and gas permeability and selectivity. The polyamide-imides represented in the following formula (1) are obtained by direct polymerization, in the presence of dehydrating catalyst, of alone or as a mixture of 2 or above of monomers prepared by condensation of an amine compound having a nitro group with a carboxylic acid anhydride,
摘要:
The present invention relates to a process of preparing polycarbonates and more particularly, to the process of preparing polycarbonates through a melt polymerization reaction of dihydroxyaryl compounds with diarylcarbonate, wherein said melt polymerization is performed in the presence of a mixed catalyst composed of an oxygen (O) or sulfur (S) containing compound having lone-pair electrons and an alkali metal or alkaline earth metal salt in an appropriate ratio at a reduced temperature by accelerating a reaction rate to obtain high quality polycarbonates with higher than 15,000 g/mole of a viscosity average molecular weight and improved color.
摘要:
Provided is a method for quantitative evaluation of mar- and scratch-induced surface damage on polymeric and coating materials. The method for quantitative evaluation of scratch-induced damage on polymeric and coating materials includes: preparing a test specimen of polymeric and coating materials; inducing a scratch damage on the surface of the test specimen; representing the scratch damage formed on the test specimen as corresponding color coordinates; and calculating a quantitated scratch damage index from a combination of a load applied to the surface of the test specimen and the color coordinates corresponding to the scratch damage.